Category: New Products

Fibocom LE270-KR Receives South Korea’s KC Certification and Passes KT Network Access

Today, the KES 2026 (Korea Electronics Show) kicked off. Fibocom showcased its LE270-KR LTE Cat.1 bis wireless communication module at the exhibition, demonstrating low-power cellular connectivity solutions tailored for IoT scenarios such as smart metering. The LE270-KR has completed South Korea’s KC certification (Korea Certification) and successfully passed the network access testing of Korean operator KT. Currently, the module has entered mass production and has been successfully integrated into South Korea’s smart meter projects, marking a significant milestone in Fibocom’s continuous expansion of global IoT connectivity capabilities.

Built on the Eigencomm EC718P_M chip platform, the Fibocom LE270-KR targets low-to-medium-rate IoT applications. Through its low-power consumption, compact design, and the technical advantages of Cat.1 bis, it meets the reliable connectivity demands of long-running devices like smart meters.

Cat.1 Bis Upgrades Smart Metering Connectivity for Long-Term Operational Demands

As smart grids and digital infrastructure continue to evolve, devices like smart meters require communication solutions that offer stable connectivity, low power consumption, and long-term operation.

LTE Cat.1 bis strikes an ideal balance among performance, cost, and power consumption while meeting mid-rate data transmission needs. It is highly suitable for IoT scenarios such as smart metering, asset tracking, and the Industrial IoT (IIoT).

Specially engineered for IoT applications, the Fibocom LE270-KR features an LCC+LGA package with dimensions of just 17.7mm × 15.8mm × 2.4mm, satisfying the strict compact design needs of terminal devices. Meanwhile, by optimizing power consumption in both connected and DRX standby modes, the product better accommodates the low-power connectivity requirements of long-running hardware like smart meters.

Enhancing South Korean Market Adaptation to Accelerate IoT Deployments

Tailored specifically for the telecommunications environment in South Korea, the LE270-KR supports local LTE frequency bands and has completed both KC certification and KT network access. This provides a reliable connectivity guarantee for device manufacturers looking to enter the South Korean market.

The successful implementation of the LE270-KR in South Korea’s smart meter projects is a vital step forward in Fibocom’s ongoing efforts to broaden its global IoT connectivity. Leveraging its strong R&D in wireless communication, extensive global certification experience, and deep industry applications, Fibocom continues to deliver cellular communication solutions that meet the precise demands of diverse markets.

Flexible Interface Design Swiftly Speeds Up Device Development

The Fibocom LE270-KR integrates a wide range of universal interfaces and supports mainstream operating systems such as Windows and Linux. This helps customers simplify their development workflows and shorten the time-to-market for terminal products.

Moving forward, Fibocom will remain focused on industry demands across smart metering and the Industrial IoT to promote the adoption of cellular connectivity technologies, such as LTE Cat.1 bis, in the global IoT market.

Quectel Launches SE505FE 5G Smart Module

Keeping pace with this industry trend, Quectel officially unveiled its new SE505FE series of 5G smart modules today. The series natively supports Android 16 and is powered by an octa-core processor and a high-performance GPU, highly integrating graphics rendering, 5G connectivity, and multimedia capabilities into a single module.

With highly competitive cost-effectiveness, it directly addresses the rigid demands for real-time processing performance and human-machine interaction in scenarios such as commercial retail and smart industry, providing an AIoT foundation solution for next-generation smart terminals that combines performance with deployment flexibility.

Precise positioning: Android 16 + high cost-effectiveness, lowering the barrier for smart terminal deployment

Previously, enabling 5G connectivity and Android-based interaction on IoT devices often required stacking three separate circuit boards—an AP motherboard, a communication module, and a multimedia processing unit—resulting in high costs and extremely complex designs. The Quectel SE505FE offers a more cost-effective integrated solution that resolves this hardware stacking challenge.

More powerful core

Built on the MediaTek MT8863T platform, it features an octa-core processor (2× Cortex-A76 @ 2.4 GHz + 6× Cortex-A55 @ 2.0 GHz) and a Mali-G57 GPU. Based on the Arm Valhall architecture, the GPU delivers excellent graphics processing and energy efficiency. Without the need for an external host controller, it can comfortably handle complex graphics rendering, 2K HD video encoding/decoding, and edge computing tasks, ensuring smooth human-machine interaction and accurate visual presentation on smart terminals.

Smarter system

Equipped with native Android 16, it integrates interaction, multimedia, and device security management capabilities. This not only shortens time-to-market but also meets the stringent requirements of payment and industrial devices for data encryption, firmware verification, and remote management through a system-level multi-layer security framework. It also supports cross-device collaboration, making it easy to connect data links across smart buildings and production lines.

For the global market, the series is available in four variants: SE505FE-EM (Europe, Middle East, Africa, South Asia, etc.), SE505FE-NA (North America and Latin America), SE505FE-CN (China), and SE505FE-WF (Wi-Fi and Bluetooth only), precisely matching carrier band requirements in different regions.

The module adopts a compact standard LGA package measuring 42.5 × 56.5 × 2.9 mm. Its slim and compact form factor makes it an ideal fit for space-constrained portable devices, wall-mounted digital signage, and compact smart gateways.

Comprehensive connectivity and practical multimedia capabilities form the core of smart terminals

The Quectel SE505FE packs a full suite of wireless connectivity into a compact footprint. For cellular connectivity, it supports 5G Sub-6 GHz bands, complies with the 3GPP Release 16 standard, supports 4×4 MIMO and dual-SIM dual-standby, and is backward compatible with LTE Cat 4, ensuring stable connections in complex environments.

On top of that, the Quectel 5G Smart module integrates Wi-Fi 5, Bluetooth 5.2, and quad-mode GNSS positioning (GPS/BDS/GLONASS/Galileo), truly realizing a “single-module-as-terminal” connectivity architecture.

On the multimedia side, which directly shapes user experience, the SE505FE is also well equipped: it supports camera input up to 32 MP at 30 fps and 2K video encoding/decoding at 30 fps. With complete audio input and output interfaces, it delivers clear visuals and smooth operation whether used for on-site recording by industrial inspection devices or for continuously playing promotional content on retail advertising displays.

Industrial-grade reliability and flexible interfaces for demanding scenarios

IoT devices often operate in harsh environments, and the SE505FE ensures stable 24/7 operation with industrial-grade reliability.

Wide temperature range

It supports an industrial-grade operating temperature range from -35°C to +75°C, maintaining stable performance whether deployed in cold outdoor environments or high-temperature factory facilities.

Ample storage

It comes standard with 4 GB LPDDR4X + 64 GB eMMC, with an optional 8 GB + 128 GB configuration (expandable up to 12 GB + 512 GB), and supports SD card expansion up to 2 TB, meeting high-volume local storage needs.

Rich interfaces

It provides USB 3.1, dual UART, 106 GPIOs, and multiple reusable interfaces including I2C, SPI, and I2S. Together with seven antenna interfaces, it covers the connectivity needs of most peripherals for industrial PDAs, smart gateways, in-vehicle devices, and more.

Certification-ready

It will support major global market access certifications including FCC, CE, and CCC, and the entire series complies with RoHS and REACH environmental standards, helping customers bring products to target markets quickly and efficiently.

Leveraging its strong processing performance, connectivity, and multimedia capabilities, the SE505FE can be widely applied across multiple industries:

  • Commercial retail: countertop POS terminals, smart POS systems, digital signage/advertising displays
  • Industrial and professional applications: handheld PDAs, tablets, smart two-way radios, audio/video recorders
  • Smart hardware: AR/VR devices, smart gateways, smart home products, smart wearables

From retail terminals to industrial production lines, and from smart cities to mobile mobility, the deep integration of 5G and Android is redefining the development paradigm for IoT devices. Going forward, Quectel will continue to expand its Android smart module portfolio, lowering design barriers and strengthening global support to help 5G IoT evolve from “usable” to “highly usable,” accelerating intelligent upgrades across industries.

 Quectel Launches NXP i.MX 9 Series Core Modules

Recently, Quectel Wireless Solutions officially launched its first innovative modules based on the NXP i.MX 9 series processors to the global market—the SRG091X and SRG093X series.

Integrating the processor, memory and storage, Wi-Fi 6/Bluetooth/Thread/ZigBee wireless solutions, and industrial peripheral interfaces into a single unit, this series features built-in Wi-Fi 6 multi-protocol connectivity and the i.MX 9 diverse ecosystem. It helps customers avoid underlying hardware design challenges and accelerates product deployment, providing a highly integrated solution for scenarios such as industrial automation, smart homes, and edge computing gateways.

“The SRG091X and SRG093X series modules are designed to provide high-performance processing capabilities for industrial, multimedia, and consumer applications,” said Sun Yanming, Vice President of Quectel. “This series integrates Wi-Fi 6, Bluetooth 5.4, and 802.15.4 (Thread/ZigBee) connectivity, and offers a rich selection of interfaces, making it particularly suitable for video-centric application scenarios. The new generation of modules will bring powerful computing power and multimedia capabilities to massive IoT scenarios, and we look forward to witnessing more innovations from our customers based on these modules.”

Rich Wireless Connectivity, Adapting to Diverse IoT Scenarios

The SRG091X and SRG093X series offer four models in total: SRG091X, SRG091X-W, SRG093X, and SRG093X-W. Among them, the models with the -W suffix are equipped with a wireless chip, supporting dual-band Wi-Fi 6 (2.4GHz/5GHz), Bluetooth 5.4, and 802.15.4 (Thread/ZigBee) protocols on a single chip. They are also compatible with the Matter standard, bringing a seamless multi-protocol interconnection experience to scenarios such as smart homes, building automation, and industrial sensing.

Simultaneously, this series of modules can work in tandem with Quectel’s higher-bandwidth Wi-Fi, Wi-Fi HaLow, and cellular modules, further expanding the boundaries of long-range low-power wide-area networking and high-bandwidth cellular communication. On the software level, the modules support multiple operating systems including Linux and Zephyr, and come with QT graphics components, providing a mature foundation for customers’ secondary development.

Comprehensive Performance Upgrade, Empowering Advanced Edge AIoT Applications

SRG091X: High-Efficiency Entry-Level Choice

Based on the NXP i.MX 91 processor, the SRG091X features a high-performance single-core Arm® Cortex®-A55 CPU with a frequency of up to 1.4GHz. In terms of storage configuration, it is equipped with 256KB L2 cache, default onboard 1GB LPDDR4 low-power memory, and 8GB eMMC storage (storage is optional).

With a compact size that continues the high integration advantages of SoM, it supports image input with up to 2K resolution and can run lightweight deep learning algorithms. It is suitable for entry-level industrial and consumer AIoT terminals with space constraints that require multimedia and edge computing power.

SRG093X: Multi-Core Heterogeneous, Unleashing Edge Computing Power

Targeting higher computing power and real-time control needs, the Quectel SRG093X is built on the NXP i.MX 93 processor. It adopts a dual-core Arm® Cortex®-A55 CPU (frequency up to 1.7GHz) and embeds an Arm® Cortex®-M33 microcontroller running at 250MHz.

The A55 core is responsible for running complex operating systems like Linux and multimedia tasks, while the M33 core handles real-time control and low-power response. The two work together to achieve a balance of “application processing + deterministic real-time performance.” In terms of memory, this module comes standard with 1GB LPDDR4X and 16GB eMMC (storage is optional).

Multi-Category Industrial-Grade Peripherals, Flexibly Adapting to Diverse Terminal Developments

To meet extensive industrial and multimedia application needs, the SRG091X and SRG093X provide extremely rich peripheral interfaces, ensuring developers have sufficient flexibility in carrier board design:

  • Multimedia and Display: The SRG091X supports 24-bit parallel RGB display output; the SRG093X adds LVDS and MIPI-DSI display interfaces and a MIPI CSI-2 camera interface on this basis, meeting the needs of higher-specification HMIs and video terminals.
  • High-Speed Network Connectivity: Provides dual 1Gbps Ethernet interfaces, suitable for high-reliability wired networking scenarios such as industrial gateways, energy metering, and EV charging stations.
  • Industrial Control and Expansion: Integrates 2 channels of USB 2.0, 2 channels of CAN-FD, 4 channels of 16bit-ADC, S/PDIF digital audio interface, and a large number of low-speed peripherals such as SPI/UART/I2C/I3C, capable of connecting to industrial sensors, actuators (such as motors, solenoid valves, etc.), and audio devices.

Wide Application, Covering Full Scenarios from Industry to Consumer

Relying on high-performance processors, rich wireless connectivity, and industrial-grade reliability, the SRG091X and SRG093X series are suitable for a wide range of IoT application scenarios:

  • Industry and Energy: Industrial HMI, edge computing gateways, industrial scanning/printing terminals, lightweight AI vision inspection terminals, smart meters, and EV charging piles.
  • Commercial and Consumer: Medical edge terminals, AI smart speakers and Matter smart hubs, POS self-service terminals, visual doorbells, and smart locks (visual AI interaction terminals).
  • Emerging AI Scenarios: Service robot bases, AGV touch panels, smart retail identification terminals, and building intelligent sensing nodes.

From “Connectivity” to “Intelligence,” the Quectel SRG091X and SRG093X series, with the i.MX 9 processor at the core and Wi-Fi 6 as the wing, provide a highly integrated, highly reliable, and cost-effective edge intelligence foundation for global OEMs and IoT developers, helping the next generation of IoT devices accelerate their landing.

Quectel Released Smart Module SE200ZC-AP for AI

From smart retail and service robots to dashcams and medical devices, AI vision is rapidly becoming a standard feature across various smart terminals. Deploying complex visual tasks—such as real-time recognition, object detection, and behavior analysis—places stringent demands on edge devices in terms of computing power, image quality, and power consumption. Striking the perfect balance among these three factors is the critical dividing line between a product that merely “works” and one that truly “excels.” Quectel’s newly launched SE200ZC-AP smart module is specifically designed to address this challenge.

Purpose-built for AI vision, the Quectel SE200ZC-AP is based on the Rockchip RV1126B/RV1126BJ platform. It seamlessly integrates 3 TOPS of NPU computing power, 4K ultra-HD encoding/decoding, and ultra-low power consumption into a compact form factor. It delivers high-performance, highly reliable edge AI solutions for scenarios including smart security, industrial vision, smart vehicles, service robots, medical imaging, and smart retail.

Lightweight Computing Foundation: Bringing Intelligence to the Edge
Lightweight, scenario-specific computing power is key to the rapid deployment of AI vision devices.

The Quectel SE200ZC-AP features a quad-core ARM Cortex-A53 CPU with a maximum clock speed of 1.6 GHz, integrated with a Neon acceleration engine and an FPU. This ensures an optimal balance of performance and energy efficiency, easily handling multitasking scenarios. Powered by a 3 TOPS NPU, it supports mixed-precision computing (INT4/INT8/INT16/FP16) and can smoothly run lightweight multimodal large models. Complex algorithmic inferences, such as facial recognition, object detection, behavior analysis, and audio parsing, are all completed locally on the device.

By pushing AI capabilities to the edge and performing inference locally, the Quectel smart module not only eliminates the risks of remote data transmission and safeguards user privacy but also minimizes response latency. This supports real-time intelligent decision-making, laying a solid foundation for vision applications in industrial and security sectors where real-time performance is paramount.

4K Ultra-HD Encoding & Decoding: Exceptional Frame-by-Frame Image Quality
Premium imaging is the cornerstone of AI vision terminals delivering real value.

Equipped with a high-performance multimedia processing engine, the SE200ZC-AP supports 4K@45fps H.265/H.264 encoding and 4K@30fps H.265/H.264 decoding. It also features dual parallel encoding capabilities (HEVC/JPEG and H.264/JPEG), allowing simultaneous output of multiple video streams. High-definition recording and real-time snapshot capture are effortlessly handled by a single hardware module.

In terms of image processing, the module supports 8MP AI-ISP and 12MP HDR ISP, offering outstanding spatial noise reduction and image enhancement. Notably, the AI-ISP utilizes dedicated hardware for independent processing, consuming zero NPU resources. This not only guarantees superior image quality but also reserves ample computing power for complex vision applications, perfectly balancing image fidelity with AI inference.

Its image capture capabilities are equally impressive, supporting up to five cameras with a maximum resolution of 12MP@30fps per channel. It features two 4-lane MIPI CSI interfaces that can be flexibly split into multiple 2-lane channels, along with one general-purpose DVP interface. This fully accommodates multi-camera scenarios such as multi-sensor stitching and panoramic surround views.

Ultra-Low Power Design: Tailored for Battery-Powered Applications
Beyond robust computing and high-definition imaging, battery life directly determines the practical viability of portable and outdoor devices.

The Quectel SE200ZC-AP adopts an ultra-low power design and features AOV3.0 low-power video recording technology. With a storage configuration of 1 GB LPDDR4x + 64 GB eMMC, its sleep current drops to an impressive 0.85 mA. Additionally, the module supports fast boot and low-power pre-recording functions, significantly reducing standby power consumption. This makes it particularly well-suited for battery-powered products like portable medical devices, wireless vehicle equipment, and inspection robots.

Comprehensive Hardware & Software Compatibility: Accelerating Time-to-Market
To meet the diverse needs across various industries, the SE200ZC-AP offers a robust support system encompassing software, hardware, and peripheral expansion. This effectively simplifies the development process and helps customers shorten their product launch cycles.

On the software front, the module is deeply compatible with Linux (Kernel 6.1) and Debian 12 operating systems, providing efficient support for application development and iterative upgrades across diverse scenarios.

On the hardware front, the SE200ZC-AP utilizes an LCC+LGA package with an ultra-compact footprint of just 40.0 × 40.0 × 2.9 mm, allowing for seamless integration into space-constrained smart terminals.

Furthermore, the module is equipped with a rich array of peripheral interfaces, including MIPI_DPHY/DVP/LCDC, MIPI CSI, SAI, PDM, DSM, ADC, I2C, GMAC, USB 3.0/2.0, SPI, CAN FD, SDIO, and UART. These enable rapid expansion of functions such as image capture, screen display, audio input, and local storage.

Additionally, the module supports external connection to Quectel’s 4G, Wi-Fi 6, audio, and GNSS modules. This provides a one-stop solution for the entire “perception-computation-communication” chain, ensuring seamless coordination across local data collection, AI analysis, wireless transmission, and location tracking.

Fibocom FG550 Successfully Optimizes Competitiveness for 5G Terminals

Fibocom has launched the FG550-EAU, an optimized 5G module based on the Samsung Exynos Modem platform with enhanced memory solutions. While fully retaining core business functions and customer customization capabilities, the Fibocom 5G module‘s RAM specification has been optimized from 8Gb LPDDR4x to 4Gb LPDDR4x, achieving a 50% reduction in memory capacity.

Addressing the demands for cost control and stable delivery in 5G terminal mass production, this solution helps customers reduce terminal BOM costs and strengthen supply chain resilience. It provides a more predictable and reliable component selection for large-scale commercial deployment.

Precision Memory Optimization: Balancing Cost and Performance

Currently, driven by the demand for AI servers and data center construction, the global memory chip supply remains tight, accompanied by intensified price volatility. As a critical component of communication modules, the cost and supply stability of memory directly impact the overall hardware costs and mass production schedules of 5G terminals.

In response, Fibocom has conducted precision memory optimization for the FG550-EAU. Through comprehensive bottom-level code review, memory scheduling strategy reconstruction, and refined system resource allocation, Fibocom successfully resolved issues such as underlying adaptation conflicts, memory footprint control, multi-branch code management, and functional trimming risks, achieving stable deployment of the 4Gb specification.

The optimized FG550-EAU retains key functional features and customer customization capabilities while improving system resource utilization efficiency, ensuring both optimal terminal operation experience and power consumption performance.

From a supply chain perspective, 4Gb LPDDR4x is a mature, standardized, and widely used component with a broader supply base and guaranteed production capacity. Combined with Fibocom’s diversified supply chain system, this solution effectively reduces reliance on single high-specification memory components, enhancing batch delivery and long-term supply assurance.

High-Speed Connectivity and Open Adaptation: Supporting Multi-Scenario Terminal Deployment

Even with the optimized memory configuration, the Fibocom FG550-EAU fully maintains its core communication capabilities for high-performance 5G terminals. Supporting the 3GPP Rel.16 standard, the module features high data rates, low latency, and high reliability. It is adaptable to diverse application scenarios, including 5G FWA, mobile broadband, industrial communications, HD video transmission, and whole-home broadband.

In terms of transmission performance, the FG550-EAU supports NR 5CC multi-carrier aggregation and is backward-compatible with LTE Cat.20 full-band specifications. It enables seamless 4G/5G dual-mode switching, adapting to mainstream 4G/5G network environments worldwide.

For device development and system adaptation, the FG550-EAU features an open architecture design. It has successfully completed joint debugging and adaptation with mainstream AP application processor solutions from Broadcom and Realtek, helping customers shorten the R&D, debugging, and mass production cycles for FWA terminals.

This memory configuration optimization for the FG550-EAU represents Fibocom’s technological innovation practice centered around customers’ mass production needs. Looking ahead, Fibocom will continue to leverage its 5G communication capabilities, platform adaptation expertise, and supply chain management skills. By partnering with global FWA, mobile broadband, and pan-IoT customers, Fibocom aims to create 5G terminal products with greater cost competitiveness and delivery certainty, accelerating the transition of various industries from the “Internet of Everything” to the “Intelligent Internet of Everything.”

Quectel’s 5G+AI Smart Module AS830M Passes AEC-Q104 Test

Recently, Quectel’s professional-grade AS830M 5G+AI cabin-connectivity integrated smart cockpit module has officially passed the AEC-Q104 automotive-grade qualification test. This milestone signifies that the AS830M fully meets the stringent requirements of top-tier global automotive electronics supply chains in System-in-Package (SiP) design, multi-chip thermal management, signal integrity, and end-to-end automotive-grade quality management.

The Quectel AS830M’s successful completion of this standard thoroughly validates its stability, safety, and durability in complex in-vehicle environments, earning authoritative endorsement. Furthermore, the module has secured essential domestic certifications, including NAL, CCC, and SRRC, ensuring it possesses all necessary market access qualifications.

In terms of performance, the Quectel AS830M module is built on the Qualcomm QCM8538 platform and features a 4nm process chip, seamlessly integrating 5G connectivity, multi-screen 8K display interaction, and edge AI capabilities. Powered by an 8-core CPU delivering up to 200K DMIPS, its dedicated NPU provides 48 TOPS of comprehensive AI computing power. This enables the smooth execution of complex AI tasks, including edge large language models, machine vision, and multimodal interaction. The Quectel 5G AI module also supports 6-screen synchronization, 8K@30 display output, and the connection of up to 17 cameras. Additionally, its highly integrated SiP packaging and LXC container isolation technology deeply merge communication and cockpit functions without interference, directly addressing the fragmentation and latency pain points of traditional cockpit systems.

For automakers and Tier 1 suppliers, the significance of the AS830M passing the AEC-Q104 test goes far beyond mere “compliance”; it delivers a truly “plug-and-play,” automotive-grade, highly integrated cabin-connectivity solution. Under the traditional model, automakers had to conduct module-level reliability testing independently, a process often characterized by long cycles, high costs, and significant risks. The AS830M 5G AI Module fundamentally transforms this landscape by alleviating customers’ redundant testing burdens, significantly reducing system failure risks and supply chain management costs, and effectively shortening the time-to-market for OEM production, thereby accelerating the safe and rapid deployment of premium smart cockpits.

Currently, the Quectel AS830M has been selected by multiple leading domestic automakers and is accelerating toward mass production. Looking ahead, Quectel will continue to advance AEC-Q104 compliance testing for cabin-connectivity modules with varying computing specifications, supporting domain controller convergence in the automotive industry and providing customers with an expanded portfolio of premium cabin-connectivity solutions.

SIMCom Partners with Skylo to Initiate NTN Certification for SIM7070G-HP-S Module

SIMCom has officially announced its collaboration with Skylo, a pioneer in non-terrestrial network (NTN) communications, to commence the NTN certification process for its SIM7070G-HP-S module.

The SIMCOM SIM7070G-HP-S module, which is now undergoing certification, is an NTN module independently developed by SIMCom specifically for satellite IoT scenarios. It supports the 3GPP Release 17 5G IoT-NTN standard and is compatible with global satellite networks. Featuring an LCC+LGA package, the SIMCOM 5G module offers extensive interfaces and strong scalability. Its compact dimensions of 24×24×2.3mm allow for flexible integration into the design of various miniaturized IoT devices.

Leveraging SIMCom’s mature low-power technology, the SIM7070G-HP-S can extend device battery life to up to 10 years through Power Saving Mode (PSM) and extended Discontinuous Reception (eDRX) technologies. It offers coverage superior to GSM and is well-suited for satellite IoT communication scenarios that require low latency and low throughput.

The initiation of the NTN certification for the SIM7070G-HP-S module marks a deepening of the existing partnership between SIMCom and Skylo and represents a significant step in SIMCom’s strategic expansion into the satellite IoT sector. By combining its strengths in module R&D, manufacturing, and global presence with Skylo’s satellite network resources, SIMCom aims to transcend the limitations of traditional terrestrial networks and provide seamless, reliable connectivity for customers worldwide.

The SIM7070G-HP-S is suitable for a wide range of applications, including asset tracking, smart metering, and remote monitoring. It effectively fills connectivity gaps in remote areas, further expanding the application scope of SIMCom’s product portfolio. Moving forward, SIMCom will work with Skylo to accelerate the certification process, promote the global deployment of their solutions, achieve ubiquitous IoT coverage, and foster the high-quality development of the satellite IoT industry.

Fibocom 5G Module Fx550 Officially Enters Global Mass Production

On March 31, Fibocom announced that its 5G module Fx550, developed based on Samsung’s Exynos Modem platform (including the LGA-packaged FG550 and M.2-packaged FM550), has officially entered mass production. The launch and mass production of this product not only mark the in-depth implementation of the strategic cooperation between Fibocom and Samsung but will also provide connection solutions with ultimate performance and excellent reliability for global 5G FWA (Fixed Wireless Access) and the broader IoT fields, such as wireless landlines, MiFi, and industry gateways.

A Powerful Alliance: Building New Heights in 5G Connectivity

This mass production is a core achievement of the deep strategic cooperation between Fibocom and Samsung. Samsung’s 5G chip solutions have been verified by massive shipments in the global market and are known for their high stability, excellent RF performance, and extensive global compatibility. Through technical integration, both parties aim to leverage their respective advantages in underlying chip architecture and industry application accumulation to jointly promote the deep penetration and popularization of 5G technology in vertical industries worldwide.

Jungwon Lee, Executive Vice President of Samsung Electronics and Head of the System LSI Modem R&D Team, stated, “Samsung is pleased to deepen its strategic cooperation with Fibocom to jointly advance next-generation 5G connectivity solutions for the global market. The successful mass production of the Fibocom 5G module confirms our shared commitment to innovation, performance, and reliability in providing cutting-edge connectivity for Fixed Wireless Access (FWA) and broadband IoT applications. In the AI era, we are jointly building the cornerstone of a smarter, more interconnected industry.”

Tao Xi, Vice President of Fibocom’s Wireless Solutions Business Group and General Manager of the MBB Business Unit, said, “We are very honored to have reached an exclusive cooperation agreement with Samsung Electronics, to be the first to achieve large-scale mass production, and to have our product validated by the market in the broader IoT sector. With the simultaneous advancement of multiple regional versions of the Fx550, including EAU, JP, and MEA, Fibocom will help global enterprises achieve ‘acceleration’ in the high-speed connectivity race.”

Core Advantages: Fx550 Empowering Digital Transformation

The Fx550 module leverages the Samsung Exynos Modem platform to set a new industry benchmark in advanced processing, transmission standards, and networking flexibility.

  • Supports Rel.16 Standard, Empowering High-Reliability Communication
    The Fx550 is fully compatible with the 3GPP Rel.16 standard. With its low latency and high bandwidth characteristics, it precisely meets the demands of the FWA and broader IoT fields for real-time data interaction and large-capacity transmission.
  • Multi-Carrier Aggregation Technology, Breaking Through Speed Limits
    In SA mode, the Fx550 supports up to NR 5CC carrier aggregation (200MHz bandwidth), with a peak downlink speed of 4.67Gbps. Its differential capability to flexibly and efficiently aggregate discrete spectrum within a narrow RF bandwidth provides unique commercial value for global operators to enhance user experience, ultimately empowering industry and home customers. In NSA mode, the Fx550 supports up to NR 2CC + LTE 5CC aggregation, with downlink speeds reaching as high as 6.47Gbps. In LTE networks, the Fx550 supports up to Cat.20, perfectly covering global 4G network capabilities. Breakthroughs in multi-carrier aggregation technology can effectively help operators improve spectrum utilization and ensure ultra-fast connections in complex network environments.
  • Open Architecture, Optimizing System Costs
    The Fx550 adopts a high-performance Modem architecture and has completed in-depth adaptation with mainstream industry AP (Application Processor) solutions, such as Broadcom and Realtek. This deep compatibility gives developers more flexible design choices, allowing for optimal control of development costs while ensuring overall device performance. It also provides global ODMs with diversified product choices, helping end customers create product differentiation. In addition, the Fx550 is compatible with operating systems such as Linux, OpenWRT, RDK-B, and PrpIOS, which facilitates the rapid development of FWA devices, reuse of software assets, and quick upgrades to the latest Wi-Fi Mesh versions, improving the Wi-Fi compatibility of CPE devices.

Global Layout: Multiple Versions Covering Mainstream Markets

To meet the network access standards of different regions, the Fx550 has simultaneously launched multiple regional versions, including FG550-EAU(Europe/Asia/Australia), FM550-EAU (Europe/Asia/Australia), FG550-JP (Japan), FG550-NA (North America), and FG550-MEA (Middle East/Africa). Currently, the Fx550 can provide product services and technical support for multiple regions around the world.

The mass production of the Fx550 is a key step for Fibocom in building a global 5G ecosystem. In the future, Fibocom will continue to work with global industry partners like Samsung to delve deeper into 5G technology innovation. Through continuously iterated connectivity solutions, it will accelerate the prosperity and popularization of 5G FWA and IoT applications worldwide.

Fibocom Launches MQ771-GL Module for Smart Collar

As pet owners’ demand for “scientific pet care” continues to evolve, pet collars are no longer just identification tags but have become intelligent terminals integrating positioning, health monitoring, and behavior analysis. With several core advantages, the Fibocom MQ771-GL perfectly meets the stringent requirements of this vertical market.

Ultra-Low Power Consumption in a Compact Size: Say Goodbye to “Battery Anxiety”

For pet owners, size and power consumption are the biggest pain points for smart collars. The MQ771-GL has been deeply optimized in both aspects.

  • MQ771-GL features an ultra-compact package (17.7mm × 15.8mm), helping customers optimize terminal space.
  • PSM mode as low as 1uA: Reduces power consumption in deep sleep mode, achieving a 70%-90% improvement compared to the previous generation.
  • eDRX technology: Significantly reduces standby current, ensuring the collar maintains ultra-low energy consumption when not in motion. Tests show that the battery life of pet devices can be extended from days to months, making long-term companionship possible.

Global Connectivity: Your Pet, Wherever You Are

Fibocom MQ771-GL supports mainstream global frequency bands for Cat.M / NB-IoT networks.

  • Multi-mode switching: Whether your pet is in a bustling city, a remote suburb, or even traveling abroad, the module automatically selects the optimal network.

Comprehensive Health Monitoring and Behavior Sensing

Fibocom MQ771-GL’s powerful processing capabilities support the integration of multi-sensor data, enabling developers to implement complex monitoring functions.

  • Behavior sensing: Precisely captures barking detection and activity frequency.
  • Physiological indicators: Supports efficient transmission of heart rate and respiratory rate monitoring data, enabling sleep quality analysis through data models and providing early warnings for potential health issues.

Sunzhi Liu, the general manager of Fibocom MTC business unit, said:

“The MQ771-GL is a milestone product in our deep commitment to the LPWA market. It combines Qualcomm’s advanced chip capabilities with Fibocom’s extensive communication expertise, aiming to provide the pet technology market with a highly integrated, cost-effective, and performance-advantaged platform. We look forward to collaborating with more customers to jointly expand the pet technology market.”

Quectel Launches New-Generation AI Computing Smart Module SH603FC

On March 11, during embedded world 2026, Quectel announced the official launch of its new-generation SH603FC series, an AI computing smart module based on MediaTek’s G520 chip platform.

As Quectel’s first high-performance module to feature this platform, the SH603FC series offers three variants: Wi-Fi 6, Wi-Fi 6E, and AP. It is designed to create an integrated intelligent hardware foundation for diverse scenarios such as industrial applications, robotics, smart retail, in-vehicle aftermarket entertainment devices, and edge computing, empowering various industries to achieve digital transformation and intelligent upgrades.

Robust Performance: Building the Cornerstone of Universal Intelligence

Quectel SH603FC series incorporates a CPU architecture featuring A78 + A55 cores, manufactured using TSMC’s 6nm process. It integrates a high-performance AI processing unit, enabling efficient on-device execution of complex AI model operations like facial recognition, product detection, and behavior analysis. This essentially equips terminal devices with a “smart brain,” facilitating a leap from passive response to proactive thinking.

This capability for “proactive thinking” is reshaping operational processes across industries:

  • On industrial production lines, real-time defect detection can immediately identify faulty products, significantly improving yield rates and efficiency.
  • For delivery robots, intelligent environmental perception allows for rapid identification of obstacles and path changes, enabling smoother and safer autonomous operation.
  • In smart stores, local analysis of foot traffic and customer behavior not only reduces reliance on cloud bandwidth but also ensures the privacy and security of commercial data from the source.

Dual-Screen Display: Unleashing Unlimited High-Definition Interaction

The Quectel AI module is not only equipped with a “smart brain” capable of handling complex AI computations but also possesses “sharp eyes” for capturing high-definition visuals. Its multimedia processing capabilities are particularly impressive, with the dual-screen display function precisely addressing the “one-device, multiple-screens” demands in sectors like commercial displays, in-vehicle aftermarket entertainment, and self-service kiosks. Through interface multiplexing solutions such as MIPI, eDP, and DP, the series supports dual-screen display at resolutions up to 2560×1600 at 60fps. This not only reduces hardware BOM costs but also expands the dimensions of interaction.

The flexible “one-chip, dual-screen” architecture elevates device interaction experiences to a new level.

  • On a vending machine, the main screen can loop 4K product advertisements, while the secondary screen displays real-time transaction QR codes and inventory information, achieving efficient synergy between advertising and transactions.
  • For smart payment terminals, the staff screen handles checkout operations, while the customer screen clearly shows the purchase details and promotional offers, enhancing transaction transparency and the consumer experience.
  • In in-vehicle aftermarket systems, the central control screen provides the driver with real-time information like navigation and vehicle status, while a screen for the passenger or a roof-mounted display can be used freely for entertainment, balancing driving safety with passenger experience.

Versatile Adaptability: Excelling in Diverse Application Environments

Leveraging its robust comprehensive performance and rich interface resources (such as PCIe, USB, RGMII, etc.), the SH603FC series has become a core driver for intelligent upgrades across multiple fields, injecting powerful momentum into the digital transformation of various industries.

  • In the industrial sector, it supports a wide operating temperature range from -35°C to +75°C, providing robust AI computing power and stable operation for industrial tablets and control equipment, facilitating real-time production data collection and analysis, and advancing the implementation of Industry 4.0.
  • In the smart retail sector, it empowers smart vending machines and self-checkout systems with intelligent payment processing and real-time inventory monitoring, making store operations more efficient and services more attentive.
  • In the commercial display sector, its high-definition display capabilities make content dissemination on advertising players and large-screen terminals more engaging, effectively enhancing brand presentation and communication efficiency.

Furthermore, the module features a compact LGA+LCC form factor and fully supports multiple operating systems, including Android 15, Yocto, and Ubuntu. It can be flexibly adapted to various devices such as robots, in-vehicle aftermarket entertainment systems, smart intercom recorders, and smart home appliances. It provides a one-stop hardware solution to meet the intelligent upgrade needs of different industries and scenarios.

Currently, samples for the SH603FC series are available for testing. Customers are welcome to inquire and collaborate to unlock the boundless possibilities of edge intelligence together.