Quectel Launched New 5G Sub-6GHz Smart Module SG520B

On December 13th, Quectel, a leading global IoT overall solution provider, announced the official launch of its new generation 5G Sub-6GHz smart module series, SG520B.


The Quectel SG520B  series supports various connectivity technologies including 5G, Wi-Fi 6E, and Bluetooth, with powerful multimedia capabilities. It is poised to directly meet the growing market demands for edge computing, graphic processing, and multimedia capabilities in vertical industries such as smart gateways, smart industry, smart retail, and handheld PDAs.

In terms of network connectivity, the Quectel SG520B series emphasizes comprehensiveness, featuring the latest Android 13 operating system and comprehensive coverage of 5G NSA/SA modes, Wi-Fi 6E, and Bluetooth connectivity.


On one hand, the Quectel SG520B series complies with the 3GPP Release 16 standard, backward compatible with LTE Cat 15/3G networks to ensure the stability of terminal network environments. Additionally, to minimize errors and optimize data speed, the SG520B series also provides 5G and LTE multiple-input multiple-output (MIMO) technology, allowing the receiver to simultaneously use multiple antennas on the same frequency band to enhance data transmission efficiency and quality. Excellent cellular network connectivity fundamentally empowers the SG520B series to meet the strict requirements of the current market for high-speed wireless communication, low latency, and broad connectivity.

Furthermore, the Quectel SG520B series also supports 2×2 MIMO Wi-Fi 6E, Wi-Fi dual-band synchronization (DBS), and other connectivity methods, with a peak data rate of up to 3.6Gbps. It is equipped with Bluetooth 5.2 and an integrated GNSS receiver configuration including GPS/GLONASS/BDS/Galileo/NavIC/QZSS/SBAS, simultaneously meeting the requirements for fast and accurate positioning and multiple network connection methods in environmental applications.


In terms of multimedia functionality, the Quectel SG520B series supports single-screen and multi-camera setups, as well as 1080p@60 fps video encoding and decoding capabilities, making it an ideal choice for industrial and consumer applications with high multimedia requirements, such as smart gateways, CPE, Mi-Fi devices, POS terminals, cash registers, dashcams, digital signage, and industrial PDAs. Additionally, the series integrates a rich set of interfaces including LCM, camera, touchscreen, UART, USB, I2C, and I2S, greatly expanding its application range in the IoT field and leaving room for performance expansion in the later stages.



To adapt to the differentiated demands of various regional markets globally, the SG520B series will launch four sub-models, including SG520B-CN for the domestic market, SG520B-EM for Europe, Asia-Pacific, Latin America, and Japan, SG520B-NA tailored for the North American region, and the Wi-Fi & Bluetooth version SG520B-WF.


In terms of package design, it adopts the classic LGA method, compatible with Quectel SG560D 5G smart module, and is expected to be stable in supply until 2030, making the SG520B series an outstanding all-around representative of Quectel 5G smart modules.

Quectel Released Two New WiFi 7 Modules FGE576Q and FGE573Q

During the Consumer Electronics Show (CES) on January 9, 2024, Quectel, a leading global IoT solutions provider, announced the official release of communication modules FGE576Q and FGE573Q supporting Wi-Fi 7 technology. These two modules will break through wireless connectivity boundaries with cutting-edge Wi-Fi performance, providing a better networking experience for the next generation of IoT and mobile terminal devices.

This series of modules adopts the latest Wi-Fi 7 technology standards, offering higher transmission rates, greater connection capacity, and better communication efficiency to easily meet the growing demands for wireless communication in areas such as smart homes, industrial automation, healthcare, and transportation.


As COO Zhang Dong of Quectel stated, “Continuously leading in technological innovation is Quectel’s unremitting pursuit. The official launch of FGE576Q and FGE573Q, these two Wi-Fi 7 modules, can better assist the IoT ecosystem in addressing the continuously upgrading communication needs. Digital applications that were previously constrained by wired connections with high traffic, low latency, and multi-user issues can now be addressed through Wi-Fi 7 technology. I believe these two modules will set new benchmarks in the short-range wireless connectivity field and open up new possibilities for various industry applications.”


High Speed, Low Latency, and Stable Multiple Connections


In terms of the network connection speed, which is the most concerning aspect for the market, both of these modules perform excellently. Quectel FGE576Q boasts a data transmission rate of up to 3.6 Gbps and supports dual-band concurrency with 2.4 GHz + 5 GHz and 2.4 GHz + 6 GHz, while Quectel FGE573Q provides speeds of up to 2.9 Gbps. Both products achieve high throughput and low latency, bringing a qualitative leap in data transmission rates. With outstanding communication performance and reliability, the FGE576Q and FGE573Q Wi-Fi 7 modules will provide unprecedented smooth experiences for users in emerging scenarios such as ultra-high-definition streaming, online gaming, augmented reality, and virtual reality.


It is worth mentioning that both of these Wi-Fi modules utilize MLO (Multi-Link Operation) functionality. Through this feature, routers can utilize multiple wireless bands and channels concurrently when connected to Wi-Fi 7 clients, resulting in greater throughput and lower latency.


In addition to their excellent performance in network speed, these two modules also achieve the best coexistence state between Wi-Fi and Bluetooth, integrating dual Bluetooth with a maximum speed of 2 Mbps and supporting low-power audio and Bluetooth Low Energy (BLE) functionalities.


Currently, with outstanding data transmission rates, ultra-low latency, and higher network reliability, Quectel FGE576Q and FGE573Q have become the ideal solutions for various applications such as cloud gaming, 8K ultra-high-definition streaming, AR/VR, industrial IoT, and remote healthcare





Quectel Released New WiFi 7 & Bluetooth 5.4 Modules

On February 26th, during the MWC 2024 exhibition, leading global Internet of Things (IoT) solutions provider Quectel officially announced the launch of its new Wi-Fi 7 and Bluetooth 5.4 combo module, the NCM8x5 series. This series of products is specifically designed for wireless connectivity in personal computers (PCs), offering advantages such as low latency and ultra-high speed to meet the demands of PC terminal applications requiring Wi-Fi 7 wireless connectivity technology.


The released module includes five models: NCM825, NCM825A, NCM835, NCM865, and NCM865A. All these models support mainstream high-performance processor platforms such as Qualcomm’s Snapdragon X Elite platform, as well as Intel and AMD’s x86 platforms.



Low latency, high throughput, and outstanding core performance characterize the Quectel NCM8x5 series modules. These modules adopt the Qualcomm FastConnect™ 7800 solution, supporting 2×2 MIMO and dual-band concurrent (DBS) technology, enabling PC terminals to simultaneously connect to multiple frequency bands such as 2.4 GHz + 5 GHz. Additionally, the NCM865 and NCM865A models utilize High Band Concurrent (HBS) multi-connection technology, reducing interference within the high-frequency spectrum to enhance wireless communication. This improvement helps utilize bandwidth more effectively, reduce signal latency, increase data throughput, and meet the demand for low-latency, high-throughput wireless connections in various industries.


Furthermore, the entire series supports MLO (Multi-Link Operation) functionality, enabling routers to utilize multiple wireless frequency bands and channels to connect to Wi-Fi 7 clients simultaneously, achieving faster data rates, lower latency, and higher network reliability for users.



Simultaneously, the NCM825, NCM825A, NCM835, NCM865, and NCM865A Wi-Fi 7 and Bluetooth 5.4 combo modules support 4K-QAM and 320 MHz bandwidth, achieving a maximum data rate of 5.8 Gbps. This capability satisfies the requirements of terminals like laptops, ensuring ultra-low latency and real-time responsiveness.



In addition to excellent Wi-Fi connectivity, this series integrates features such as dual-mode Bluetooth, 2Mbps Low Energy Bluetooth (BLE), low-power (LE) audio, and long-range transmission for low-power Bluetooth.



Ensuring a comprehensive and compatible package for diverse applications, the series provides flexible size options. For instance, the Quectel NCM825 series has dimensions of 16.0mm x 20.0mm x 1.80mm, suitable for slim and compact laptops, while the NCM865 series, with dimensions of 22.0mm x 30.0mm x 2.25mm, better meets the needs of versatile laptops.

Moreover, all sub-models of the NCM8x5 series have obtained certifications from regulatory authorities worldwide, including China’s SRRC approval, EU CE, UK UKCA, North America FCC/IC, Australia RCM, South Korea KC, and Japan JATE/Telec certification.



Regarding the introduction of multiple high-performance Wi-Fi 7 and Bluetooth 5.4 modules, Quectel’s COO Zhang Dong stated, “In response to the current demand in the PC market for high-performance, efficient, and secure wireless connections, Quectel has added several Wi-Fi 7 and Bluetooth 5.4 modules to its module portfolio. Through the mentioned features such as Multi-Link Operation performance and dual-band concurrency, this series of modules can provide PC users with lower latency, faster data transmission, and excellent network reliability, significantly enhancing user experience. This is crucial for improving office efficiency and promoting the development of mobile office solutions.”



Furthermore, Quectel follows industry-leading practices and standards throughout the development process, from product architecture to firmware/software development. It undergoes third-party independent testing to reduce potential vulnerabilities and implements security practices such as generating SBOM and VEX files and firmware binary analysis throughout the entire software development lifecycle to ensure product security and reliability.



It’s also noteworthy that, to further assist customers in simplifying the design process, Quectel provides various high-performance antenna options, offering high flexibility and compatibility to meet the requirements of different projects. Customers can combine Quectel’s modules with corresponding antennas and pre-certification services to help reduce the cost and time-to-market of IoT devices.



During the MWC 2024 exhibition, Quectel’s NCM8x5 series modules were officially showcased. Attendees were invited to visit Quectel’s booth at 5A19 to learn more about the modules on display.


Quectel Showed the Commercial Deployment of 5G CPE on RG620T

On February 28th, during the 2024 Mobile World Congress (MWC 2024), leading global IoT solution provider Moving Forward Communications announced that its globally certified 5G module RG620T, based on the MediaTek T830 platform, and the MediaTek Wi-Fi 7 module BE7200, based on the MediaTek Wi-Fi 7 chipset, have achieved large-scale commercial deployment in Australia. This marks the first large-scale commercial deployment globally of 5G CPE equipped with Wi-Fi 7, bringing high-quality 5G Fixed Wireless Access (FWA) services to Australian users.

Partnering with MediaTek to Deliver Quality Services to Australian Customers


Quectel RG620T is a 5G Sub-6GHz module designed by Moving Forward Communications specifically for Enhanced Mobile Broadband (eMBB) applications, in compliance with the 3GPP R16 standard. This Quectel 5G module supports both 5G SA and NSA dual-network modes. In a 5G SA network, it can deliver up to 7.01Gbps downlink speed and 2.5Gbps uplink speed, while in a 5G NSA network, it can provide a maximum downlink speed of 5.67Gbps and an uplink speed of 1.46Gbps.


RG620T comes in an LGA package with dimensions of 44.0mm × 53.0mm × 2.95mm and operates within a temperature range of -30°C to +70°C, with versions available for extended temperature requirements based on customer needs. Additionally, to meet various market demands, Moving Forward Communications also offers module customization services according to the requirements of different operators.


Norbert Muhrer, President and Chief Sales Officer of Moving Forward Communications, stated: “We are pleased to see the RG620T achieve its first large-scale commercial deployment, delivering exceptional 5G experiences to FWA users in Australia. This is a significant milestone for the module as it progresses into the global market. Looking ahead, we expect the RG620T to make further contributions to the prosperity of the 5G FWA market, providing outstanding wireless connectivity experiences for users worldwide.”


Evan Su, General Manager of MediaTek’s Wireless Communication Division, said: “As long-term partners, we have been collaborating with Moving Forward in the 5G field to continuously provide faster and more stable 5G products to the global market. Our T830 and Filogic 680 chipsets provide the foundation for the functionalities of the Moving Forward RG620T, currently delivering high-quality mobile broadband connections to FWA customers in Australia.”


Furthermore, the MediaTek T830 platform boasts advanced features such as support for 3Tx (transmit) and 8Rx (receive) capabilities, significantly enhancing both uplink and downlink speeds, spectrum efficiency, and coverage quality, thereby providing stable and high-speed 5G connections even in complex indoor and outdoor environments. The 3Tx and 8Rx capabilities of the T830 align perfectly with the product roadmap and requirements of leading operators. Moving Forward Communications can also provide corresponding module products based on customer project requirements.


Complementary Wi-Fi Solutions for a Seamless Connectivity Experience


The Moving Forward Communications RG620T is designed specifically for operators’ FWA requirements, focusing on applications such as CPEs, home and enterprise gateways, and mobile hotspots. The choice of the MediaTek T830 chipset is due to its platform featuring four high-performance ARM Cortex-A55 CPUs, providing surplus CPU performance within the chip, thus improving processing efficiency and significantly reducing costs. Meanwhile, MediaTek’s 5G chipset also comes with corresponding Wi-Fi solutions, exhibiting significant cost advantages when used together. Additionally, the MediaTek platform supports the coexistence of cellular and Wi-Fi in the same device, better meeting users’ demands for related features, further enhancing its attractiveness and applicability.


Wi-Fi 7, as the next-generation wireless network technology, brings consumers a superior connectivity experience. One of its key advantages is higher throughput, which means faster data transfer rates for streaming, gaming, and other online applications. Moreover, this technology has the ability to handle more concurrent users without affecting network performance, making it ideal for homes or public places with numerous connected devices. Furthermore, Wi-Fi 7 offers greater bandwidth, enabling smooth handling of high-demand applications and services. This technology also integrates 5G capabilities, seamlessly combining the strengths of 5G and Wi-Fi 7 to support various innovative application scenarios.


Throughout the module development process, Moving Forward has prioritized security, following leading industry practices and standards from product architecture to firmware/software development. They have collaborated with third-party independent testing organizations to minimize potential vulnerabilities and have incorporated security practices such as generating SBOMs and VEX files, as well as conducting firmware binary analysis, into the entire software development lifecycle.”

Fibocom Released 5G Smart Module SC171 at MWC2024

During the Mobile World Congress 2024, Fibocom announced: In addition to supporting the Android operating system, the 5G smart module SC171 is also compatible with Linux and Windows systems, helping more smart terminal customers iterate products quickly and expanding the coverage of intelligent applications.


The Fibocom SC171 series is designed based on the Qualcomm® QCM6490 IoT solution, featuring an 8-core high-performance processor (1 large core with a frequency of 2.7GHz + 3 large cores with a frequency of 2.4GHz + 4 small cores with a frequency of 1.95 GHz). The SC171 series integrates a high-performance GPU and high-speed HVX technology for image data processing. It supports dual-screen display at 2520×1080@60fps, and can simultaneously operate up to 5 cameras with powerful multimedia playback capabilities. With a computing power of up to 12TOPS, the SC171 efficiently processes data, integrates various AI algorithms, and helps terminals achieve edge computing and AI features.


In addition to being compatible with the smart Android operating system, the Fibocom 5G smart module SC171 is also pre-equipped with Linux and Windows systems, making it expandable to a more diverse range of IoT application terminals, such as smart cameras, industrial control machines, cash registers, vending machines, robots, and in-car devices.



In terms of communication, the SC171 series supports 5G/Wi-Fi 6 wireless communication, providing more flexible network access. As a global version of the 5G smart module, the SC171-GL is compatible with mainstream 5G frequency bands worldwide, meeting the different frequency band requirements of different terminals for 5G and helping customers quickly deploy in the global market. In terms of peripherals, the SC171 has various expansion interfaces such as dual USB, dual PCIe, MIPI, UART, SPI, I2C, making it the preferred solution for smart IoT terminals.



Zhao Yi, Vice President of Fibocom’s MC Division, said: The “5G+AI” joint empowerment drives the intelligent transformation of the industry, bringing revolutionary improvements to end-to-end deployment automation. The SC171, with a computing power of up to 12TOPS, supports mainstream operating systems such as Android, Linux, and Windows, and can be applied to a wider range of IoT scenarios, promoting the development of intelligent edge computing.



Fibocom Releases LTE Smart Module SC208 at MWC2024

During the Mobile World Congress MWC 2024, Fibocom unveiled the LTE smart module SC208 developed based on the Snapdragon® 460 mobile platform, aiming to provide stable and efficient smart connectivity experiences for various fields such as smart retail, handheld devices, aftermarket vehicle installations, multimedia, and more, thereby accelerating innovation and transformation in industry applications.

ST Liew, Vice President of Qualcomm CDMA Technologies Asia Pacific, stated, “Qualcomm Technologies is delighted to collaborate with Fibocom to empower its advancement in edge intelligence for smart IoT devices. The Fibocom SC208 module, based on the Snapdragon 460 platform, will deliver unparalleled performance enhancement and cutting-edge multimedia processing capabilities. We are proud to support Fibocom in its mission to deploy intelligent wireless solutions across multiple industries. Together, we will leverage higher levels of intelligence to drive digital transformation at the edge.”


Zhao Yi, Vice President of the MC Business Unit at Fibocom, mentioned, “AIoT is experiencing rapid growth, with edge computing facilitating on-device analysis of massive data, thus enhancing efficiency and optimizing costs for terminals. The release of the SC208 smart module, based on the Snapdragon 460, by Fibocom, will further promote the development of smart retail, handheld devices, aftermarket vehicle installations, and multimedia applications. In the future, Fibocom will continue its close collaboration with Qualcomm Technologies to meet global demands for intelligent terminal development and iteration.”


The Fibocom SC208, built on Qualcomm Technologies’ Snapdragon 460 mobile platform, features a maximum 1.8GHz octa-core processor, DDR4X memory, providing superior performance to help extend terminal standby time. In terms of image processing, the SC208 supports simultaneous operation of multiple cameras and smooth playback of 1080P@60fps high-definition videos. In hardware, the SC208 adopts a 41mm*41mm LCC+LGA package, compatible with Fibocom’s smart modules SC128, SC138, SC228, SS808, SQ808, and SU808 series, enabling flexible terminal iteration for customers. The SC208 offers various expansion interfaces including MIPI/USB/UART/SPI/I2C, facilitating connection to external devices such as cameras, displays, audio systems, and sensors.


For wireless communication, the SC208 supports global 4G network compatibility, as well as dual-band Wi-Fi/BT for short-range wireless transmission, meeting diverse wireless communication requirements for different terminals. In terms of positioning, the SC208 supports multiple satellite positioning systems including GPS/GLONASS/BeiDou/Galileo/QZSS, ensuring rapid and accurate positioning in various environments. The SC208 comes preloaded with the Android 14 operating system and supports continuous version iterations of Android OS, enabling customers to release terminals with long lifecycles.


Benefiting from the aforementioned software and hardware features, the LTE smart module SC208 can be widely used in wireless smart payment, wearable audio and video recorders, walkie-talkies, aftermarket vehicle installations, multimedia terminals, and more, thereby facilitating the development of the global AIoT industry. Fibocom will continue to rely on its smart module products and technological capabilities to meet the diverse smart demands of the industry, helping customers build terminals with controlled costs, better performance, and optimized power consumption, thus jointly promoting digital transformation. The SC208 has entered the engineering sampling phase and is expected to begin mass production in April 2024.

Quectel Released Rx255G Series RedCap with MediaTek

On February 22nd, Quectel, a leading global provider of IoT overall solutions, announced the upcoming launch of the Rx255G series 5G RedCap modules. This series of modules not only features key functions of 5G NR such as high reliability, low latency, and network slicing but also boasts advantages like compact design and ultra-low power consumption. It achieves a fine balance between cost, size, and performance, providing added momentum to the accelerated popularization of lightweight 5G.


RedCap, also known as Reduced Capability, is a lightweight technology introduced by 3GPP in the 5G Release 17 phase, representing a new technical standard protocol. This technology integrates 5G’s low latency, high reliability, and network slicing features into a more cost-competitive lightweight architecture. For applications requiring 5G features but not necessarily high data rates and large bandwidth, RedCap technology offers an economical and efficient solution.

Low Power Consumption, High Performance, and Competitive Cost Highlights


The MediaTek T300 series 5G RedCap platform embedded in the Rx255G series modules features MediaTek’s 5G RedCap UltraSave functionality, reducing power consumption by 60% compared to existing 4G IoT modules. Compared to 5G Enhanced Mobile Broadband (eMBB) modems, power consumption is reduced by 70%. Additionally, when enabling R17 power-saving features, an extra 10% power saving is achieved.


The Rx255G series supports 5G Standalone (SA) and LTE Cat 4 dual-mode. It supports 20MHz bandwidth, 256QAM/64QAM modulation, with maximum downlink and uplink speeds reaching 220 Mbps and 121 Mbps respectively. Additionally, this series of modules supports GNSS positioning and other functions.


Norbert Muhrer, President and Chief Sales Officer of Quectel, stated: “We are pleased to once again bring new 5G RedCap module products to the global market. For IoT applications, the Rx255G series RedCap modules not only realize the key functions of 5G NR but also avoid high power consumption and costs, achieving a fine balance in all aspects and providing better support for a wide range of scenarios that require ultra-reliable low-latency communication (URLLC) and network slicing.”


Evan Su, General Manager of MediaTek’s Wireless Communication Business Unit, said: “The T300 series is the world’s first 6nm RF SoC single-chip solution that supports RedCap. RedCap technology is a key enabler for driving the popularization of 5G, empowering our customers with optimized components and enabling various applications to access 5G networks at more competitive costs.”


Compatible Design, Widespread Applications


In terms of external design, the Rx255G series offers multiple packaging options, including LGA, M.2, and Mini PCIe, providing various interfaces including USB 2.0 and PCIe 1.0. Additionally, this series of modules is compatible with Quectel’s Cat 4 modules EG2x and EC2x series, offering customers a more expedited solution for migrating from Cat 4 to 5G.


The Rx255G series is highly suitable for applications such as smart grids, video networking, connected vehicles, POS terminals, industrial automation, and FWA (Fixed Wireless Access).


The Quectel 5G modules can be used together with a variety of Quectel antenna products, allowing end customers to purchase antennas tailored to their actual application scenarios, thus shortening the time to market for products.

Fibocom Released New 5G RedCap Module FM330 at MWC 2024

During the Mobile World Congress MWC 2024, Fibocom released the RedCap module FM330 series based on the MediaTek T300 platform, accelerating the prosperity of 5G-A. The Fibocom FM330 series and its solutions adopt the globally advanced RedCap scheme to meet the high-energy efficiency requirements of mobile broadband and industrial interconnection.


The Fibocom FM330 series adopts the world’s first 6nm process and integrated RF single-chip RedCap solution (RFSOC) MediaTek T300 development, and simultaneously launches multi-scenario solutions. The MediaTek T300 integrates a single-core Arm Cortex-A35 CPU in a compact area, further reducing power consumption and streamlining size.



The new Fibocom 5G module complies with the 3GPP R17 evolution standard and has excellent energy efficiency, enhanced network coverage, and low latency characteristics. In the Sub-6GHz frequency band, the maximum transmission bandwidth of the FM330 series module is reduced to 20MHz, and the transmit and receive antennas are trimmed to 1T2R, supporting more global 5G mid-low frequency bands including n79. Thanks to the maximum modulation capability of uplink and downlink 256QAM, the downlink throughput of the FM330 series reaches up to 227Mbps, and the uplink throughput reaches 122Mbps. The FM330 series adopts the M.2 packaging method of 30mm*42mm, compatible with the Fibocom LTE Cat.6 module FM101 series, facilitating the smooth iteration of existing 4G terminals to 5G.



During the conference, Fibocom demonstrated the RedCap Dongle solution based on the FM330 series, flexibly meeting the mobile broadband application needs of global customers. The plug-and-play FM330 series RedCap Dongle solution is compatible with various operating systems, including Windows, Linux, Android, etc., enabling users to enjoy 5G networks anytime, anywhere. The FM330 series RedCap Dongle solution is connected to the host computer through a standard USB interface, suitable for industrial equipment such as desktops, laptops, tablets, fixed-mobile convergence terminals, drones, industrial control computers, etc., with networking needs.



The 5G RedCap module FM330 series and solutions will further accelerate the evolution of terminals such as Dongle, CPE, PC, and IPC to 5G-A, promote 5G achieving ten-gigabit downstream, gigabit upstream, intrinsic intelligence, and advance the integration innovation of 5G with perception, AI, computing power, and new generation information technology.




Tao Xi, Vice President of Fibocom MBB Business Unit, said: RedCap is a key technology driving the commercialization of 5G, helping FWA applications extend to FWA-Lite entry-level, accelerating the deep penetration of 5G into households, enterprises, and outdoor third spaces. Fibocom, in collaboration with MediaTek, globally launched the module FM330 series and solutions based on the T300 platform, helping operators enter the new era of 5G-A, and providing the market with one-stop, diversified, and high-performance RedCap Dongle, Hybrid CPE, and other solutions. In the future, Fibocom will continue to maintain close cooperation with MediaTek, break through the boundaries of 5G smart interconnection applications, and achieve long-term win-win cooperation between the two parties.


SIMCOM Released New 5G Products at MWC2024

SIMCOM announced the release of the 5G modules SIM8270, SIM8390, SIM8230, and A8230 series, LTE-A module A7908, smart module SIM9650L, and Wi-Fi module W87 at the MWC event. These products cater to different customer demands in terms of cost, speed, and application scenarios in both domestic and international markets. It heralds a new era of ubiquitous connectivity in the 5G era.


5G Connects All

The next-generation 5G module SIMCOM SIM8270 supports both 5G non-standalone (NSA) and standalone (SA) networking modes, while SIMCOM SIM8390 supports 5G NSA, SA, and mmWave modes. Both modules adopt LGA packaging, integrate GNSS positioning functions, and maintain compatibility with the AT commands of the SIMCOM SIM8260 series, facilitating rapid iteration of terminal products for customers and reducing development costs.



Moreover, the SIMCOM 5G modules SIM8270 and SIM8390 can be combined with the SIMCOM Wi-Fi module W87 to form various 5G+Wi-Fi 7 solutions.


SIMCOM SIM8230 is a 5G R17 SA multi-band RedCap module, packaged in LGA+LCC with compact dimensions. It integrates GNSS positioning functionality and is compatible with the AT commands of the SIM8260 series. Equipped with abundant functional interfaces, it provides great convenience for peripheral expansion while boasting advantages such as lightweight, low power consumption, small size, and high cost-effectiveness. It also supports various regional versions for Asia, North America, Europe, South America, etc., catering to the diverse needs of customers worldwide.


The new generation 5G R17 modules introduced by SIMCOM at this time exhibit superior performance in data transmission rate, power consumption, latency, and reliability, making them suitable for a wide range of terminal devices including 5G CPEs, wearable devices, industrial routers, high-definition video streaming boxes, AR/VR devices, drones, remote control, and robots.



At the exhibition, SIMCOM will also release a cost-effective 5G module A8230, providing a more economical solution for 5G+AIoT applications in terms of cost.



LTE-A Surfing Unlimited New Experience


LTE-A complements 5G, jointly providing mature and stable communication technology support for high-speed markets. SIMCOM A7908 is a highly integrated LTE Cat.6 module targeting the high-end application market for high-speed services. It features multi-mode, wide-band broadband, built-in DDR, dual PCIe, and Ethernet ports supporting 100M/1G, enabling single-chip soft routing functionality. It can be widely used in terminal devices such as CPEs, MiFi, mobile hotspots, security monitoring, and detection alarms.



AI Innovation Creates New Possibilities for the Future

SIMCOM SIM9650L is a high-computing power smart module with the Android 14 operating system, equipped with a Qualcomm 8-core 64-bit ARM V8 processor, Kyro 6xx CPU. Compared to previous generations of 4G smart modules, the SIM9650L series integrates AI processors Dual HVX and Hexagon Tensor Accelerator, with computing power exceeding 14Tops, and built-in Adreno™ VPU 633, supporting up to 4K 30 video encoding or 4K 60 video decoding.


It also supports multiple high-definition cameras, high-definition touch screens, and has powerful high-speed data transmission and multimedia processing capabilities, enabling customers to quickly develop products and applications related to operating systems and high performance advantages of smart modules, multimedia, wireless communication, etc.


The SIM9650L series integrates GPS high-precision positioning, BT5.2 short-distance communication, 2×2 MIMO, and Wi-Fi6E. It can be widely used in smart POS cash registers, logistics terminals, VR/AR devices, smart robots, vehicle-mounted devices, smart cabins, video surveillance, security monitoring, smart information collection devices, industrial-grade PDAs, and smart handheld terminals.



SIMCOM Looks to the Future New Journey

Looking forward to the future world of 5G+AI, SIMCOM continues to launch high-speed 5G, LTE-A modules, and high-computing power smart modules, as well as full-format module product lines such as 4G, LPWA, GNSS, focusing on the extensive application market of 5G+AIoT, bringing high-quality products to various fields such as homes, enterprises, industries, agriculture, and urban construction. In the future, SIMCOM will continue to work with partners to create more high-quality module products, providing more accurate products and services to customers at home and abroad.


Fibocom Released 5G Smart Module SC151-GL

During MWC Shanghai 2023, Guanghetong unveiled the 5G R16 intelligent module SC151-GL. As the industry’s first intelligent module supporting global 5G bands, the highly integrated SC151-GL is equipped with Qualcomm’s QCM4490 processor, which effectively reduces terminal software and hardware development costs, shortens the R&D cycle, and accelerates the deployment of terminals in the global market.


The Fibocom SC151-GL module is equipped with 5G and Wi-Fi 6/6E connectivity, enabling gigabit-level transmission speeds, broader coverage, and lower latency. With a global market focus, SC151-GL is compatible with mainstream 5G bands worldwide, meeting the diverse frequency requirements of different terminals and helping customers quickly establish a presence in the global market. SC151-GL supports more EN-DC (LTE and 5G dual connectivity) configuration nodes, catering to both 5G SA/NSA dual-module network modes and compatible with 4G/3G networks. In terms of mobile connectivity, SC151-GL supports high-speed access for multiple devices via Wi-Fi and utilizes TWT technology to reduce RF working time, optimize network resources, and save terminal power consumption.


The Fibocom 5G Smart module SC151-GL is equipped with the Android 13 operating system and will continue to support iterative updates up to future versions like Android 18. This means that the SC151-GL can be used in industrial mobile terminal designs until before 2030, offering more flexible and efficient iterative capabilities and an extended product lifecycle. This enables significant savings in terminal development time and costs.



Benefiting from its support for global 5G and Wi-Fi 6/6E, long lifecycle, and rich expansion interfaces, the SC151-GL can drive the efficient global market deployment of industrial handheld and other intelligent 5G terminals with better cost-effectiveness and shorter development cycles.