On March 5th, Fibocom officially launched the FG205 module and a 5G MiFi solution based on the Qualcomm QMB415 platform. The QMB415 platform has been adapted for the Linux operating system. Leveraging a deeply customized hardware architecture and reduced storage requirements, it provides an optimized solution and more reliable supply stability for wireless broadband applications.
Deep Hardware Customization: Streamlined Design Directly Targeting Core MiFi Needs
Built upon the Qualcomm SM4450, the QMB415 platform has been highly customized for wireless broadband application scenarios. Unlike the redundant design of traditional smartphone chip platforms, this solution achieves “precision tailoring” in its architecture: it reduces redundant CPU processing power and eliminates the GPU, focusing specifically on network connection efficiency.
Software System: Linux OS Ends “Memory Anxiety”
The most significant highlight of the MiFi solution released by Fibocom is its support for the Linux operating system. Previously, most 5G SoC platforms utilized the Android operating system, which requires substantial memory capacity, typically ≥3GB. After adapting this solution to the Linux OS, the maximum memory requirement is only 1GB. This solution lowers the storage configuration, achieving cost-effectiveness while also significantly mitigating the supply and price risks associated with storage, an often “uncontrollable” factor.
Platform Evolution: Pin-Pin Compatibility for Rapid Iteration
To help customers shorten product time-to-market, this solution fully considers the continuity of hardware design. The Fibocom 5G module, based on the QMB415 platform, maintains the same dimensional layout as Fibocom’s FG180/190 series modules based on the Snapdragon X72/X75. Through pin-pin compatible design, device manufacturers can quickly switch between and iterate products with different performance levels on the same hardware platform without the need for redesigning the circuit board.
Regarding Wi-Fi adaptation for the Fibocom FG205, Fibocom will launch a series of solutions supporting Wi-Fi 5/6/6E/7. This will further enrich Fibocom’s MBB product portfolio, comprehensively meet the full range of customer requirements across different tiers, and provide the wireless broadband industry with solutions offering better cost optimization and more reliable supply.
On March 5th, during the Mobile World Congress (MWC) 2026 in Barcelona, Quectel, a global supplier of IoT total solutions, in collaboration with UNISOC, unveiled a new series of 5G modules based on UNISOC’s three major platforms: the 5G eMBB V620, V610, and the 5G RedCap V527. This new product matrix, characterized by high-end performance, compact design, and lightweight features, marks a new journey towards the large-scale application of the 5G Internet of Things.
Flagship Performance, Redefining the 5G Experience
The RG620UA/RM520UA series 5G modules, built on the UNISOC V620 platform, deliver robust 5G data rates, a quad-core A55 processor, rich Ethernet configurations, and Wi-Fi 7/Wi-Fi 6 connectivity. Simultaneously, they continue to optimize and innovate in areas such as ENDC combinations, RAM+ROM solutions, and adaptation for QuecOpen and OpenWRT/PrplOS. This precisely meets the urgent market demand for high-performance, highly flexible terminals in the 5G FWA sector.
Extreme Compactness, Unlocking New Possibilities for Portability
Targeting space-constrained scenarios like global portable terminals and power IoT applications, Quectel has launched the compact 5G modules RG258UB-GL/RG258UB-CN based on the UNISOC V610 platform. This series employs a highly integrated packaging process, reducing the volume by approximately one-third compared to traditional 5G LGA modules. This frees up more design flexibility for devices like portable mobile hotspots (MHS) and compact power terminals. They also deliver robust performance, fully supporting 5G SA/NSA dual modes and global full network compatibility, with an optimized RF solution to ensure signal stability. By selecting core domestic components, they effectively mitigate supply chain risks while achieving a better balance between performance and cost, helping customers quickly respond to the growing demand for consumer electronics and IoT portable devices in global markets.
Lightweight and Slim, Accelerating the Popularization of 5G
Based on UNISOC’s new generation high-performance 5G RedCap IoT communication chip, the V527, Quectel has introduced the RG155UC-CN lightweight module targeting the IoT market where cost and performance are both critical. This module features an ultra-small, ultra-thin design, reducing volume by 46% and thickness by 17% compared to traditional packaging. It supports a rich software ecosystem, significantly lowering the barrier to upgrading lightweight 5G terminals, and is widely adaptable to consumer and industrial terminals such as smart wearables, tablets, and industrial sensors.
Furthermore, the UniHALO solution, developed by Quectel based on UNISOC’s full range of 5G IoT platforms, has now been successfully adapted to the OpenWRT 24.10 version. This solution aims to provide developers with a more stable and efficient software development environment by simplifying the design process, improving system performance, and effectively reducing DDR and Flash resource overhead. It fully leverages hardware potential, further lowering the development threshold for 5G terminals.
Anchored by Customer Value, Building a Global Digital Future Together
Currently, Quectel 5G modules based on the three UNISOC platforms are widely deployed across various fields including smart industry, smart grid, smart logistics, and consumer electronics. The entire product series adopts low-power design, helping to improve terminal battery life by over 20%, deeply aligning with the “Dual Carbon” goals. The V527 and V610 platforms, with their high cost-performance ratio, lower the barrier to 5G access, injecting momentum into the digital development of emerging markets. The V620 platform, with its outstanding performance, provides a high-speed, low-latency network experience that is truly both “affordable and high-quality.”
In addition to the two previously unveiled AI modules SIM9650W and SIM9780, SIMCom also launched five new IoT modules at MWC 2026: the A8805X, SIM7672JP, A7665SA, A7600C, and SIM7082G. Covering 5G, 4G, and LPWA categories, these modules focus on practical connectivity and balanced performance, catering to diverse fields such as automotive, industrial, and civil applications, providing stable and cost-effective hardware support for global IoT deployment.
The A8805X has obtained the IATF16949:2016 automotive-grade certification. With dimensions of 37.5 × 33.0 × 3.0 mm and an LGA package, it supports a wide operating temperature range from -40°C to +85°C, making it suitable for harsh automotive environments. It also features excellent EMC protection capabilities to handle challenging electromagnetic conditions.
Leveraging 5G RedCap lightweight technology, the SIMCOM 5G Module balances 5G low latency and low power consumption, achieving downlink speeds of up to 226Mbps and uplink speeds of 120Mbps on 5G NR. It is ideal for automotive T-Box and industrial AGV applications, particularly in scenarios with frequent interference and demanding transmission requirements, such as factory workshops. The 5G Redcap module is available in European (A8805E) and Chinese (A8805C) versions, each tailored to regional frequency bands, providing reliable 5G connectivity for automotive and industrial intelligence.
Three 4G Modules Launched Simultaneously Compact and practical, suitable for a wide range of scenarios.
SIM7672JP: Measuring 24.0 × 24.0 × 2.4 mm with an LCC + LGA package, this module offers a rich set of interfaces and integrates a multi-GNSS receiver. It supports software features such as FOTA, SSL, and LBS, and is package-compatible with the A7672 and SIM7000 series. Tailored for Japan’s regional frequency bands, it is ideal for shared devices and smart POS terminals, enabling rapid deployment.
A7665SA: With dimensions of 17.6 × 15.7 × 2.1 mm and a compact LGA package, this Cat.1 bis module delivers downlink speeds of 10Mbps and uplink speeds of 5Mbps. It supports FOTA, LBS, MQTT, and other functions, and is package-compatible with the SIM800C and SIM7080G series. Designed for South America’s regional frequency bands, it solves integration challenges for small terminals and is suitable for high-volume production scenarios such as e-bikes and smart locks, offering excellent cost performance.
A7600C: A high-performance LTE Cat.4 module with dimensions of 30.0 × 30.0 × 2.5 mm and an LCC + LGA package. It supports FOTA, LBS, SSL, and other features, and is package-compatible with previous generations, enabling a smooth transition from 3G to LTE. It supports seamless fallback to multiple networks, is tailored for China’s regional frequency bands, and can connect to external Wi-Fi modules. It is suitable for various fields such as automotive and industrial routers, combining broad coverage with high reliability.
SIM7082G An LPWA long-endurance module designed to meet the low-power requirements of massive IoT deployments.
Addressing the need for low power consumption and long endurance in IoT, the SIM7082G features a compact LCC + LGA package with dimensions of 17.6 × 15.7 × 2.3 mm. Equipped with PSM and eDRX power-saving technologies, it supports battery life of up to 10 years, eliminating the need for frequent battery replacements. Additionally, it supports full-band Cat-M and NB-IoT, covering global frequency ranges. With AT command compatibility with the SIM7080G series and extensive certifications, it is ideal for long-term operation scenarios such as smart meters and remote smoke detectors, providing sustained connectivity for smart energy and environmental monitoring.
From 5G RedCap automotive-grade connectivity to precise 4G regional deployment and LPWA long-endurance scenarios, the five new IoT modules prioritize practicality, avoid redundancy, and balance performance with cost, aligning with the deployment needs of various industries. The simultaneous launch of these five new products further enriches SIMCom’s IoT product portfolio. With core advantages of stability, reliability, and cost-effectiveness, they provide global partners with more precise IoT connectivity hardware options.
MWC 2026 is in full swing, and the deep integration of AI and mobile communications has become one of the most-watched core trends on the exhibition floor!
Seizing the moment with a dual-product launch, SIMCom unveiled its second new 5G AI module, the SIM9780, following the debut of the AI computing module SIM9650W. Precisely targeting the intelligent automotive industry, this SIMCOM 5G AI module centers on a combination of 5G and 8 TOPS of practical computing power. It is tailored for core scenarios such as in-car navigation, integrated cockpit and parking systems, and intelligent in-car robots, delivering a “essential needs” solution for the transformation towards smarter vehicles.
Partners familiar with SIMCom know that we consistently adhere to the principle of “practical technology, implementation is paramount.” The SIMCOM SIM9780 precisely addresses the pain points of the automotive industry with three core highlights that clearly demonstrate its capabilities:
The Golden Combination of 5G + 8 TOPS: More Practical
The 8 TOPS computing power of the SIM9780 is perfectly suited for core requirements like in-car voice interaction, local data inference, and image recognition – avoiding wasted calculating while effectively controlling hardware costs. Paired with optional 5G NSA/SA dual-mode support, it is compatible with all major network standards and covers the frequency bands of over 200 global operators. With a downlink speed of up to 2.4Gbps, tasks like HD map updates, remote data interaction, and online video streaming are smooth and lag-free, achieving both sufficient computing power and guaranteed transmission speed.
Automotive Quality: Stability is Paramount
For automotive products, stability is always the top priority! The SIM9780 meets the demands of complex in-vehicle environments, supporting an ultra-wide operating temperature range from -40°C to +85°C. Whether in the cold north or the hot south, it operates stably. The LGA package design and multiple storage configuration options cater to the hardware requirements of different in-vehicle devices. Running on the Android 13 operating system and supporting multiple firmware upgrade methods, it simplifies development and maintenance, allowing partners to avoid unnecessary complications.
More Than Just Automotive: “Cross-Border” Versatility
Featuring a built-in Mali-G57 quad-core GPU supporting 4K@60fps video encoding/decoding and asynchronous multi-screen display, it can easily handle tasks like environmental perception and data computation for integrated cockpit/parking systems, and voice interaction and intelligent response for in-car robots. Rich interfaces including USB3.0 and MIPI allow flexible connection to external sensors, cameras, and central control screens for expanded smart functions. It is also adaptable to scenarios like in-car navigation, remote vehicle security monitoring, and in-vehicle infotainment systems.
Beyond its core automotive applications, the SIM9780 truly “shines across borders”! In addition to covering application scenarios such as integrated cockpit/parking, intelligent in-car robots, in-car navigation, remote vehicle security, and in-car audio/video, it can also easily empower devices like industrial PDAs and smart POS terminals – one module addressing diverse needs across multiple fields.
The debut of the SIM9780 marks another precise strategic move by SIMCom in the intelligent automotive arena. On the future path of smart mobility, SIMCom will continue to advance with global partners, leveraging more practical technology combinations to make the implementation of in-car intelligence simpler and more efficient, ensuring that every technological innovation genuinely empowers thousands of industries.
With the core theme of “The IQ Era,” MWC 2026 focuses on the deep integration of AI and mobile communications, serving as a vital platform for global technology companies to showcase core technologies and strategize for future. On the first day of the exhibition, SIMCom officially launched its new AI computing module, the SIM9650W. Eschewing the hype of extreme computing power, this 5G AI module centers on practical 12 TOPS computing power combined with full-scenario adaptability. Echoing the conference’s theme of AI implementation, it provides a cost-effective, implementable core solution for the intelligent transformation of diverse industries.
The SIMCOM SIM9650W breaks away from the misconception that “higher computing power is always better.” It focuses on actual industry needs, balancing performance and cost to precisely address the challenge of computing power during AI implementation across various sectors, truly enabling AI technology to enter practical application scenarios.
Key Specification Highlights
12 TOPS Practical Computing Power Core
Stable AI computing power reaching 12 TOPS. This can easily handle real-time analysis of multiple high-definition video streams and abnormal behavior recognition in security scenarios, as well as local data inference and device linkage control in industrial edge computing. It is also suitable for small to medium-scale AI applications in retail, government affairs, etc., covering diverse needs from basic intelligence to mid-to-high-end computing power, avoiding waste and maximizing cost-effectiveness.
Powerful Multimedia and Interaction Capabilities
Integrates an Adreno™ 643 GPU, supports 4K video encoding/decoding and dual-screen display with different content. It can smoothly support immersive graphics rendering for VR/AR devices and high-definition display with multitasking in smart cockpits, making multimedia interaction experiences smoother and more stable.
High-Speed, Stable Full-Scenario Connectivity
The SIMCOM 5G AI Module integrates 2×2 MIMO Wi-Fi 6E, supporting the 2.4GHz, 5GHz, and 6GHz bands with throughput up to 3.6Gbps. It also integrates Bluetooth 5.2, ensuring stable, high-speed data transmission for devices in dense wireless environments. Whether it’s real-time data synchronization between devices and the cloud in a smart factory or the immediate upload of customer traffic analysis data in a mall, reliable connectivity is guaranteed.
Industrial-Grade Reliability and Expandability
Features a wide operating temperature range from -35°C to +75°C, confidently handling challenges in complex environments like outdoor vehicles, unattended retail kiosks, and industrial sites. It offers rich hardware interfaces including multiple MIPI-CSI camera interfaces and PCIe Gen3, allowing flexible connection to various peripherals and adapting to complex environments like automotive, industrial, and outdoor retail.
What Can 12 TOPS Do?
12 TOPS of AI computing power means terminal devices can handle more complex, real-time AI tasks, moving from simple “seeing” to “understanding” and reacting quickly.
More Accurate Real-Time Visual Recognition
In smart retail scenarios, an intelligent weighing scale or self-checkout terminal equipped with the SIM9650W can process multiple camera streams simultaneously, instantly and accurately identifying hundreds of types of vegetables, fruits, or bakery items with similar shapes and colors, multiplying checkout efficiency.
More Complex Multimodal Analysis
In industrial quality inspection, devices can run multiple AI models concurrently, such as appearance detection, OCR reading, and abnormal sound analysis, performing comprehensive automated product inspection to enhance production quality and efficiency.
Smoother Immersive Interaction
For devices like helmets or service robots, 12 TOPS of computing power is sufficient to support real-time SLAM (Simultaneous Localization and Mapping), gesture recognition, and object interaction, providing users with a smooth and natural immersive experience.
Rich Scenarios: Empowering Intelligent Upgrades Across Industries
The SIM9650W can be widely applied in cutting-edge fields such as smart retail, smart industry, intelligent automotive, public safety, and emerging consumer electronics, delivering core value to customers:
Cost Reduction, Faster Time-to-Market
The practical computing power configuration avoids redundant investment. Combined with mature technical support, it effectively shortens customer product R&D cycles and reduces overall costs.
Enhanced Product Competitiveness
Balances performance, cost, and reliability, enabling customers to create more differentiated, competitive, and cost-effective terminal products.
Ensuring Stability and Ease of Implementation
Industrial-grade design ensures stable operation in complex environments. The validated computing platform significantly lowers the threshold and risk of AI project implementation.
Leading a New Direction for On-Device AI Implementation
Looking ahead, SIMCom will continue to iterate its AI module products guided by real-world industry demands, collaborating with global partners to drive deep integration of AI technology across thousands of industries. The goal is to make practical computing power a reliable support for enterprise intelligent upgrades and empower more partners to achieve efficient AI implementation.
On March 2nd, at Mobile World Congress (MWC) 2026, Fibocom, in collaboration with MediaTek, unveiled a flagship CPE solution based on the next-generation FG390 5G module and the Filogic 8800 Wi-Fi 8 chipset. This solution deeply integrates high-performance 5G-Advanced cellular capabilities with the ultimate wireless experience of Wi-Fi 8, delivering a more efficient, stable, and intelligent network access experience for global operators, enterprises, and home users. Representatives from MediaTek and Fibocom held a product launch ceremony at the event.
Powerful 5G and Wi-Fi 8 Convergence: The solution integrates the Filogic 8800 Wi-Fi 8 chipset and the Fibocom FG390 5G module based on MediaTek’s T930 platform, combining the technological advantages of 5G-A and Wi-Fi 8 to create a seamless, high-performance network connectivity experience for homes and small to medium-sized enterprises.
Intelligent Multi-AP Coordination: Intelligent collaboration among multiple APs reduces interference by over 40%, significantly improves spectrum efficiency, and enhances the smoothness of network connections during concurrent multi-device usage.
Coverage and Stability Optimization: Leveraging Enhanced Long Range (ELR) technology, the solution improves wall penetration capability and coverage range by 40% compared to Wi-Fi 7, ensuring stable connections even at the edge of the network area.
Low Latency and Throughput Breakthrough: Latency is reduced to sub-millisecond levels, and throughput is doubled, ensuring smooth operation even when 200+ devices are connected simultaneously.
Designed for the AI Era: Supports tri-band concurrency on 2.4/5/6GHz, ensuring reliable connectivity for AI terminals, AR/VR applications, and smart home networks.
On March 2nd, during the Mobile World Congress Barcelona 2026 (MWC Barcelona 2026), Quectel, in partnership with MediaTek, proudly launched a next-generation smart CPE solution. This innovative solution combines 5G-Advanced and Wi-Fi 8 technologies, powered by the MediaTek T930 platform.
The solution deeply integrates the high-performance 5G-A connectivity of the MediaTek T930 platform, the intelligent reliability of the Wi-Fi 8 solution, AI-enhanced capabilities, and Quectel’s profound expertise in the global Fixed Wireless Access (FWA) market. Transcending the mere concept of “high speed,” this solution aims to provide a holistic CPE solution for both home and enterprise users, delivering super performance, exceptional stability, and AI-driven intelligent management. It is designed to catalyze transformative leaps in scenarios such as broadband access, mobile office, enterprise networking, and industrial internet. During the exhibition, the prototype based on this solution made its public debut at the Quectel booth (5A19), becoming a focal point of the show.
Technical Core: Deep Collaboration of 5G-A, Wi-Fi 8, and AI – More Than Just Speed
The solution is built upon Quectel RG660MK series module, leveraging MediaTek’s advanced 4nm process T930 5G platform. It integrates a 3GPP R18-compliant 5G-A modem, a quad-core CPU, a dedicated network processing unit, and achieves chip-level deep collaboration with Wi-Fi 8 technology, delivering a revolutionary intelligent connectivity experience for users.
Wide Area Coverage, Stable Signal Support for 8Rx reception technology increases spectral efficiency at the cell edge by 40%, thereby extending 5G signal coverage by 40% and significantly improving the number of users that can access the cell. Whether in home corners, large enterprise buildings, or areas with weak signals, stable and high-speed 5G connectivity is ensured.
Tri-Band Uplink, More Efficient Connection Support for 3Tx (5L) uplink technology adds a third transmitting antenna, boosting signal strength and uplink transmission efficiency. This not only effectively enhances network coverage and stability for multiple users online simultaneously but is also particularly suitable for high-bandwidth, low-latency application scenarios, empowering smart homes and enterprise innovation.
Ultra-Low Latency, Smoother Interaction The solution incorporates MediaTek’s L4S (Low Latency, Low Loss, Scalable Throughput) software feature. While ensuring high throughput, it can reduce critical network latency to 1/20th of traditional solutions. This provides a foundational network capability for latency-sensitive applications like cloud gaming, remote real-time control, and high-definition video conferencing, enabling online interactions to feel as smooth as face-to-face communication.
Local Networking, Intelligent Interference Immunity Through Wi-Fi 8’s Coordinated Spatial Reuse (Co-SR) and Coordinated Beamforming (Co-BF) technologies, the solution enables intelligent coordination and scheduling among multiple access points. In device-dense environments like smart homes, shopping malls, hotels, and offices, it significantly reduces co-channel interference, boosting overall transmission efficiency by over 25%. Even with hundreds of devices connected simultaneously, each terminal operates smoothly, easily resolving issues like lag and disconnections in multi-device networking.
Dynamic Optimization, Handling Congestion with Ease Leveraging Wi-Fi 8’s Dynamic Spectrum Management technology, the solution can intelligently allocate channel resources during network congestion, significantly alleviating traffic jams in high-load scenarios. This boosts device throughput in complex environments by up to 80%, ensuring the network remains robust even when multiple users are simultaneously engaged in 4K streaming, large file downloads, and video calls.
More Open AI Scalability By flexibly integrating a dedicated NPU processor, the solution equips the 5G CPE device with powerful edge AI computing and intelligent interaction capabilities. This enables autonomous scheduling and optimization of network resources, localized intelligent voice interaction, and dynamic distribution of tasks across the end, edge, and cloud, evolving the network from “passive connection” to “active service.”
On January 9, during the 2026 International Consumer Electronics Show (CES 2026), Quectel, a global leading provider of IoT total solutions, announced the launch of its groundbreaking 5G-Advanced module series RG660Qx, compliant with the 3GPP R18 standard. This series is set to redefine the performance benchmarks and experiential boundaries of next-generation smart connectivity through the power of cutting-edge technology integration.
Among the series, the Quectel RG660QA is based on the Qualcomm X85 platform, maximizing the peak performance of 5G-A; while the Quectel RG660QB is equipped with the Qualcomm X82 platform, precisely meeting the demands of mainstream high-end connected smart applications. This series of modules uniquely combines key capabilities including ultra-high-speed 5G-A communication, collaboration with Wi-Fi 8, and AI enhancement. They can also be upgraded to support NB NTN satellite communication, thus comprehensively empowering next-generation cutting-edge smart applications such as home and commercial wireless broadband, high-definition mobile video, and high-performance mobile hotspots, injecting a stronger sense of “futurism” into terminal devices. The first batch of engineering samples from the RG660Qx series has officially been released to global customers, with the Quectel RG660QB series expected to go commercial in Q1 2026.
Quectel COO Zhang Dong stated, “The Quectel RG660Qx series not only elevates 5G communication capabilities to a new level but also represents a future-oriented integrated smart product. Leveraging the Qualcomm X8x platform, this series offers extremely high speed, outstanding performance, and exceptional reliability, precisely matching the multiple connectivity, computing, and intelligence needs of ultra-high-speed fixed wireless access (FWA), enterprise-grade gateways, and high-end consumer electronics. We hope that the RG660Qx series significantly lowers the threshold for innovation for our customers and accelerates the emergence of next-generation smart terminals.”
High-Speed and Stable Dual Online: Maximizing 5G-A Communication Strength
In terms of core communication performance, the RG660Qx supports a maximum of 8-channel or 6-channel receiving in the downlink, and supports FDD (2 Layers) + TDD (2 Layers) UL Switch. With advanced Multi-Input Multi-Output (MIMO) technology, the RG660Qx series excels in increasing data transmission rates, optimizing signal quality, and ensuring connection stability, capable of providing high-speed, stable wireless experiences for next-generation 5G applications, including gigabit-level fixed wireless access, essential enterprise services, and high-capacity mobile broadband.
Meanwhile, the RG660Qx series can be upgraded to support Dual SIM Dual Standby (DSDS) and Dual SIM Dual Active (DSDA) functions, flexibly adapting to multi-carrier network switching needs and confidently addressing complex global network environments to ensure continuous online access for businesses.
For key scenarios like indoor 5G CPE, this series of modules can simultaneously support Wi-Fi 7 and Wi-Fi 8 technologies across the 2.4 GHz, 5 GHz, and 6 GHz bands, and integrate Bluetooth functionality, building a comprehensive intelligent interconnect ecosystem. Its Ethernet interface supports rates of up to 10 Gbps, enabling large-capacity data transmission for ultra-high-definition video streaming and enterprise-grade networks. Supporting power level 1, it can effectively extend signal coverage, further enhancing coverage capability in FWA deployment scenarios.
Integration of Multiple Advanced Capabilities Empowering All-Scenario Smart Connectivity
AI enhancement capability is one of the core highlights of the RG660Qx series. Through modem capability upgrades and AI-enhanced Wi-Fi, along with a dedicated AI co-processor featuring 24 TOPS of computing power, this series of modules can easily realize intelligent interaction functions such as voice control. Additionally, it supports external AI computing power modules to further enhance edge-side data processing and intelligent decision-making capabilities, providing core computing support for scenario-based applications of smart terminals.
Besides AI capabilities, the RG660Qx series simultaneously reinforces all-scenario connectivity capabilities: it supports a variety of interfaces including USXGMII, USB, and PCIe, allowing deep cooperation with Wi-Fi chipsets to fully leverage the advantages of Wi-Fi 8 in network reliability and intelligence, significantly enhancing the application experience of devices such as 5G CPE and high-performance mobile hotspots.
The breakthrough in all-area coverage capabilities further underscores the technological foresight of the RG660Qx: the Quectel 5G module can be upgraded to support the NB NTN satellite communication function (requires specific hardware design), forming a complementary relationship with terrestrial network coverage, achieving stable connectivity in remote areas, oceans, deserts, and other locations without ground network availability.
Hassle-Free Hardware Upgrades Accelerating Industry Implementation
To accelerate industry adoption, the RG660Qx series is Pin-to-Pin compatible with Quectel’s previous 5G module series RG650x, allowing customers to use the same recommended Wi-Fi chips and physical layer chip solutions from the RG650x series without the need to reconstruct hardware design for swift upgrades, significantly simplifying R&D processes and optimizing supply chain efficiency. Meanwhile, Quectel can also provide high-performance antenna products and comprehensive technical support to help customers speed up product development and shorten the time to market.
From breakthroughs in 5G-A link performance to forward-looking interconnect strategies with Wi-Fi 8, along with synergies between AI enhancements and industry applications, the Quectel RG660Qx series not only demonstrates global leadership in communications technology but also establishes a foundation for next-generation smart terminal innovation through all-scenario coverage and flexible hardware compatibility. In the future, Quectel will continue to drive technological innovation, deepen industry collaboration, and accelerate the transition of 5G-A technology from “standard specifications” to “large-scale applications.”
On January 6, the first day of the 2026 International Consumer Electronics Show (CES 2026), leading global IoT solutions provider Quectel announced the official launch of its next-generation flagship smart module, SP895BD-AP.
This module is powered by the Qualcomm Snapdragon™ Q-8750 processor, which offers enhanced graphics processing capabilities, superior imaging effects, and advanced AI computing performance. It is designed to meet the stringent demands of high-end devices such as video conferencing, ultra-high-definition displays, image synthesis, computation boards, smart retail, and smart home applications. It provides essential hardware support for the AIoT industry as it transitions from “basic intelligence” to “high-level smart computing.”
Quectel’s COO, Zhang Dong, stated: “At this critical juncture in the move toward ‘higher intelligence’ in AIoT, there is an explosive growth in the demand for computational power and multimedia processing capabilities in terminal devices. The newly launched flagship smart module SP895BD-AP is a key achievement for Quectel, grounded in industry needs and deepening our efforts in the edge intelligence field. Leveraging the Qualcomm Snapdragon Q-8750 processor, this module achieves significant performance enhancements in CPU, GPU, and AI engines, alongside 8K multimedia processing capabilities. It offers a solution that balances ‘computational power and energy efficiency’ for high-end AIoT scenarios, accelerating the digital transformation of the industry.”
Enhanced with 3nm Technology: A Double Leap in Performance and AI Computing Power
The SP895BD-AP redefines performance boundaries with its advanced hardware architecture. Featuring the Qualcomm Snapdragon Q-8750 processor, it employs a 3nm fabrication process and includes an octa-core high-performance Qualcomm Oryon™ CPU, with clock speeds reaching up to 2×4.32 GHz + 6×3.53 GHz. Compared to the previous generation (the 8 series chips), it achieves a 45% increase in CPU performance and a 44% improvement in energy efficiency. This allows it to maintain stable high-performance output in high-intensity scenarios such as multi-tasking and complex algorithm execution while minimizing power consumption, thereby balancing the demands for “computational power” and “energy consumption.”
The accompanying Qualcomm® Adreno™ 8 series GPU also exhibits outstanding performance, achieving a 40% increase in efficiency and energy optimization. Its unique tile-based architecture delivers stunning graphics effects and realistic environmental rendering capabilities, ensuring reliable performance for complex task handling and ultra-high-definition displays (8K Display/3D), easily meeting the high demands of graphic processing for high-end devices.
In the domain of edge AI computing, the SP895BD-AP brings groundbreaking advancements: the integrated AI engine achieves a computing power of up to 77 TOPS, marking a 45% increase over the previous generation. It supports INT4/INT8/INT16/FP16 full-precision computing modes, enabling real-time inference, and can even run large language models with up to 11 billion parameters on the edge. By integrating with multimodal perception technology, terminal devices equipped with this module can accurately recognize user contexts, facilitating multimodal interaction, and enabling generative AI assistants with real-time decision-making and personalized service capabilities, thereby establishing a “fully-covered, high-efficiency operation” foundation for edge AI development.
Multimedia Capabilities Maximized: 8K Ultra HD and Robust Imaging Input
In the field of multimedia processing, the SP895BD-AP sets a new benchmark. It supports 8K@30fps video encoding and 8K@60fps video decoding, significantly enhancing video bitrate processing and transmission efficiency. This enables “low latency transmission + high-fidelity reproduction” of ultra-high-definition videos, seamlessly aligning with the core requirements of 4K/8K ultra-high-definition displays and professional video conferencing equipment.
Its imaging input capabilities are equally robust: it features three integrated ISPs (image signal processors), capable of synchronously processing three streams of 48MP@30fps video input, and supports individual cameras with up to 108 million pixels for image capture, accurately capturing scene details to easily meet the needs of high-end imaging scenarios.
To further adapt to the complex and diverse application ecosystem of AIoT, the SP895BD-AP has been fully optimized for its compatibility from “hardware flexibility” to “software compatibility.” Its hardware design utilizes LGA packaging, resulting in a compact size that can accommodate more product forms. Additionally, it is equipped with various peripheral interfaces, including MIPI DSI, CSI, PCIe, USB, I2S, UART, I2C, and SPI, to meet diverse display, audio, sensor, and communication expansion requirements, significantly enhancing scenario adaptability and deployment flexibility in AIoT applications.
On the software side, the module is designed to be compatible with a broader industry ecosystem, deeply supporting Android 15 and Linux operating systems, which greatly reduces the technological barriers for cross-field applications.
In the future, Quectel will continue to focus on the integration of edge intelligence and IoT technologies, investing and innovating to drive the deep development of industrial digital transformation with more cutting-edge products and more comprehensive solutions, injecting strong momentum into the construction of an intelligent world characterized by “everything being smart and full-domain perception.”
Recently, Quectel Communication officially launched the SH602HA-AP robot computing module, equipped with the Xuri®5 intelligent computing chip for sweet potato robots, which was showcased at the DDC2025 Sweet Potato Robot Developer Conference.
As a core computing solution for the new generation of general-purpose robots, the Quectel SH602HA-AP module boasts high computing power of 10 TOPS, an RTK + binocular vision fusion solution, and advanced on-device large model operation capabilities. These key advantages provide robots with essential technological support for precise navigation and obstacle avoidance, dynamic environmental perception, and more. This advancement aids industries in upgrading from “functional execution” to “perception and decision-making,” thus accelerating the commercialization process of robots on a larger scale.
In terms of core configuration, the Quectel SH602HA-AP module runs on the Ubuntu operating system. The embedded Xuri 5 chip is based on the advanced BPU Bayesian architecture and integrates abundant heterogeneous computing resources, offering up to 10 TOPS of AI computing power. This performance level can easily handle mainstream scenarios such as lawn mowers, cleaning robots, companion robots, and delivery robots, supporting efficient completion of full-stack computing tasks locally. It can also smoothly operate complex AI models and the latest algorithms such as Transformer, BEV, and Occupancy on the edge. Compared to traditional solutions, robots utilizing this module can not only accomplish basic object recognition and path planning but also efficiently realize advanced intelligent behaviors like scene understanding, natural language interaction, and dynamic obstacle avoidance.
More importantly, the Quectel SH602HA-AP achieves breakthroughs in low energy consumption while outputting high-performance AI computing power. In the complex field of robot terminal computing, it delivers better decision-making and task execution within limited time and computational resources, while also better aligning with the stringent requirements for heat dissipation control and lightweight design in robots.
If the computing architecture serves as the “intelligence core” of a robot, then the perception system acts as its “five senses,” interacting with the surrounding world. The SH602HA-AP module creates a complete integrated perception system, realizing an edge-side closed loop of “perception-computation-decision.”
In terms of perception capability, the module fully supports various sensor signal inputs and fusion processes, including LiDAR, structured light, ToF (Time of Flight), and voice. It incorporates core robotic perception algorithms such as dual-camera depth computation, AI + VSLAM (visual simultaneous localization and mapping), and 3D point cloud computation, combined with voice recognition capabilities, endowing robots with comprehensive intelligent abilities of “seeing, hearing, computing, and judging.”
In multimedia and visual processing, the SH602HA-AP performs exceptionally well, featuring a newly designed ISP 2.0 (Image Signal Processor) optimized for robotic scenarios, enhancing both latency and quality. The module’s maximum processing capability reaches 3840×2160@60fps, supporting advanced technologies such as 3D-NR (three-dimensional noise reduction), WDR (wide dynamic range), and HDR (high dynamic range), allowing it to accurately capture high-definition visual data in complex lighting environments. Additionally, it supports 4K@60fps video encoding and decoding, meeting the core demands for real-time visual transmission and processing in robots.
The interface configuration of the SH602HA-AP is remarkably versatile, encompassing 1×BT.1120, 1×DSI, 1×RGMII, 1×USB 3.0, 1×USB 2.0, 1×SDIO, 7×UART, 7×I2C, 1×QSPI, 2×I2S, and other abundant interfaces. Moreover, the module supports flexible external communication and positioning modules such as Quectel 5G, LTE Cat 1/4, Wi-Fi 6, and GNSS, allowing for quick integration of communication and high-precision positioning capabilities across various robotic applications.
Zhang Dong, COO of Quectel Communication, stated, “From lawn mowers and sweepers to cutting-edge humanoid robots, various forms of robots are profoundly reshaping human production and lifestyle. Quectel is committed to providing a solid edge-side computing and communication foundation for intelligent robots. The launch of the SH602HA-AP module not only achieves dual upgrades in computing and perception but, more importantly, significantly lowers the development threshold for high-end intelligent robots, injecting core momentum into industry innovation.”
