Quectel RG620UA-EU 5G AI LGA Module

Quectel RG620UA-EU 5G AI LGA Module Specifications:

* Chipset: UNISOC V620 platform.

* Form factor: LGA package

* 5G Support:

- Fully supports 5G R16 features.

- Compliant with 3GPP R16 standard.

- Supports 5G SA and NSA networks, backward compatible with 4G/3G.

- Supports NR CA, LTE CA, ENDC, and HPUE PC1.5 for enhanced coverage and speed.

* Performance:

- Equipped with a 4-core Arm® Cortex®-A55 CPU.

- Maximum downlink speed: 4.67 Gbps; uplink speed: 1.875 Gbps in SA networks.

- Supports Super Uplink technology and NUL/SUL combinations.

- Average RTT: 8ms, suitable for low-latency industrial applications.

* 3GPP R16 Features:

- Supports 5G TSN, 5G LAN, URLLC, high-precision positioning, timing, and low power consumption.

- Low-power features: WUS (Wake-Up Signal) and UAI (Uplink Assistance Information).

* AI Capabilities:

- Capable of accessing the DeepSeek-R1 model.

- Supports integration with Quectel's AI solutions for intelligent voice interaction and diverse AI applications.

* Storage & Interfaces:

- Supports high-config LPDDR4x and FLASH storage.

- Rich functional interfaces: USXGMII, PCIe3.0, USB3.1, SDIO3.0, UART, SPI, I2S, I2C, GPIO, etc.

- Dual-SIM functionality for eSIM/soft SIM scenarios.

* Dimensions: dimensions: 44×53×2.95mm.

* Target Markets:

- Fixed Wireless Access (FWA), industrial manufacturing, 5G handheld terminals, laptops, gateways, and IoT.

- Focus on cost control, functional expansion, and service upgrades for FWA solutions.

* Industrial Applications:

- Enables 5G TSN networks, high-precision positioning, and low-latency industrial IoT.

- Ideal for industrial robot control, remote PLCs, and AGV tracking.