Quectel 5G Module Archives

Quectel RG155UC-CN 5G RedCap Module Launched at MWC Shanghai 2026

On June 26, during MWC Shanghai 2026, Quectel officially unveiled its brand-new 5G RedCap module, the RG155UC-CN. Built on the domestic UNISOC V527 platform, this module achieves an optimal balance between performance and cost through precise architectural streamlining.

As a benchmark module deeply customized for RedCap scenarios, the Quectel RG155UC-CN truly delivers “lightweight 5G with hardcore performance.” Boasting three core advantages—an ultra-compact footprint, ultra-low power consumption, and a rich array of interfaces—it comprehensively resolves industry pain points associated with traditional 5G modules, such as oversized dimensions, high power draw, and limited scenario adaptability. It provides a highly cost-effective and efficient new solution for the large-scale deployment of 5G across a vast array of lightweight terminals, including industrial IoT, smart wearables, portable data collectors, and smart security devices, propelling 5G RedCap into a new era of accessible commercialization.

Ultra-Compact and Thin Form Factor: Unleashing Unlimited Design Freedom for Terminals

Quectel RG155UC-CN features a next-generation, highly integrated precision packaging process with dimensions of just 21.9 × 22.9 × 2.0 mm. Compared to traditional 5G modules of similar specifications, it achieves a leap in size optimization: overall volume is reduced by 46%, and thickness is decreased by 17%. This ultra-thin, compact form factor significantly lowers the structural design threshold for end devices.

For space-constrained products like handheld data collectors, compact industrial sensors, and portable smart devices, this is more than just a numerical “slimming.” The smaller footprint allows designers to reserve more space for structural components, batteries, and functional modules. It simplifies the tooling design of the entire device, drastically reduces hardware retrofitting costs, and shortens the R&D cycle for customers.

Deep Low-Power Architecture Optimization: Over 20% Boost in Device Battery Life

Leveraging the native lightweight characteristics of RedCap technology, the RG155UC-CN has undergone full-link power consumption tuning. It is equipped with a multi-level eDRX intelligent power-saving mechanism that dynamically adapts to various operating modes, including device sleep, scheduled reporting, and always-on connectivity.

Field test data shows that, compared to standard Quectel 5G modules, the RG155UC-CN significantly optimizes overall power consumption, directly extending terminal battery life by over 20%. For battery-powered IoT devices operating in off-grid environments without external power (such as power grid monitoring, environmental data collection, and portable testing terminals), this effectively prolongs maintenance cycles, reduces the frequency of manual battery replacements, and substantially lowers long-term O&M costs.

Fully Compatible Interface Design: One-Stop Coverage for Diverse Scenarios

The Quectel RG155UC-CN comes fully equipped with mainstream industry-standard hardware interfaces, eliminating the need for extra adapters and meeting the development needs of most lightweight IoT terminals. It integrates a comprehensive suite of interfaces, including (U)SIM, UART, USB 2.0, SDIO 3.0, RGMII, I2C, SPI, PCM, and ADC, supporting diverse functions such as data transmission, Ethernet networking, peripheral control, and analog signal acquisition.

Quectel Launches the SP805FL Series AI Computing Modules

On June 25, during the MWC Shanghai 2026 exhibition, Quectel officially unveiled its first flagship AI computing module series based on the MediaTek platform: the SP805FL series (available in WF and AP variants). This launch establishes a crucial pathway for integrating advanced AI computing power into end-device applications across various industries.

Equipped with MediaTek’s flagship Genio Pro 5100 chip, this product seamlessly combines robust computing power, outstanding graphics and imaging capabilities, and a rich array of interfaces. It fully supports the deployment of physical AI, on-device large language models (LLMs), and multimodal interactions. The module is widely applicable to high-end scenarios such as robotics, smart helmets, 3D scanning/printing, computing boards, smart retail, large-screen displays, and smart homes, empowering customers to seize the initiative in the wave of edge computing and AI-native applications.

Flagship CPU Architecture: Effortlessly Handling Complex Tasks at the Edge

The Quectel SP805FL features a full octa-core Arm v9.2 architecture, comprising 1x Cortex-X925, 3x Cortex-X4, and 4x Cortex-A720 cores. Built on a 3nm manufacturing process, it effortlessly manages multitasking and complex computations.

In practical applications, even when a robot simultaneously performs navigation computing, visual recognition, and voice dialogue, it maintains smooth responsiveness, eliminating lag and latency. For devices like industrial tablets and 3D scanners that require real-time processing of massive amounts of data, its massive performance headroom makes “millisecond-level reconstruction” a reality.

50+ TOPS NPU: Enabling Fully Independent On-Device AI Operation

The successful deployment of on-device AI relies heavily on dedicated AI computing power. The Quectel SP805FL integrates MediaTek’s 8th-generation NPU, delivering over 50 TOPS of AI computing power. It supports full-precision computing (INT4/INT8/INT16/FP16), enabling the efficient deployment of various AI large models. With multimodal interaction and scene perception capabilities, it provides robust support for the large-scale deployment of on-device AI.

Leveraging its powerful AI performance, devices can independently handle complex AI inference tasks. Whether it is a smart helmet used for underground or field operations, service robots, or smart retail terminals, they can operate stably in offline or congested network environments, respond to commands in milliseconds, and simultaneously safeguard data privacy.

All-Scenario Multimedia and Connectivity: Meeting Rigorous Industrial Demands

In terms of multimedia capabilities, the SP805FL supports simultaneous multi-screen display and 8K encoding/decoding, catering to scenarios with stringent requirements for image quality and multi-screen display, such as 3D scanning/printing, commercial large screens, and smart retail.

Regarding wireless connectivity, the Quectel SP805FL-WF variant is equipped with Wi-Fi 7 and Bluetooth 6.0, enabling high-speed, stable wireless data transmission. It also integrates multi-constellation GNSS positioning, compatible with GPS/BDS/GLONASS/Galileo/QZSS/NAVIC, and supports L1+L5 dual-frequency positioning, providing precise positioning services for intelligent transportation and logistics platforms.

Designed for industrial-grade scenarios, the product supports a wide operating temperature range of -35°C to +75°C, making it capable of handling various complex industrial environments. Global certifications, including CE, RCM, FCC, and IC, are currently in progress to meet global compliance deployment requirements in the future.

Massive Interfaces for Flexible Expansion: Simplifying Development, Reducing Costs, and Boosting Efficiency

The SP805FL offers an interface lineup that far exceeds conventional smart modules, boasting exceptional scalability. In addition to traditional interfaces such as MIPI DSI/CSI, I2S, UART, SDIO, I2C, and SPI, it supports multiple PCIe lanes and dual Gigabit Ethernet ports, significantly enhancing its flexibility and adaptability in on-device AI applications.

Adopting a compact LGA package design, the module allows high computing power to be seamlessly integrated into smaller end products. Developers do not need to add external interface or computing chips; a single module can satisfy most device connectivity requirements, effectively simplifying hardware design and shortening R&D cycles.

The launch of the Quectel SP805FL marks a critical leap for smart modules, transforming them from mere “data transmission pipelines” into “independent on-device decision-making units.”

Quectel’s 5G+AI Smart Module AS830M Passes AEC-Q104 Test

Recently, Quectel’s professional-grade AS830M 5G+AI cabin-connectivity integrated smart cockpit module has officially passed the AEC-Q104 automotive-grade qualification test. This milestone signifies that the AS830M fully meets the stringent requirements of top-tier global automotive electronics supply chains in System-in-Package (SiP) design, multi-chip thermal management, signal integrity, and end-to-end automotive-grade quality management.

The Quectel AS830M’s successful completion of this standard thoroughly validates its stability, safety, and durability in complex in-vehicle environments, earning authoritative endorsement. Furthermore, the module has secured essential domestic certifications, including NAL, CCC, and SRRC, ensuring it possesses all necessary market access qualifications.

In terms of performance, the Quectel AS830M module is built on the Qualcomm QCM8538 platform and features a 4nm process chip, seamlessly integrating 5G connectivity, multi-screen 8K display interaction, and edge AI capabilities. Powered by an 8-core CPU delivering up to 200K DMIPS, its dedicated NPU provides 48 TOPS of comprehensive AI computing power. This enables the smooth execution of complex AI tasks, including edge large language models, machine vision, and multimodal interaction. The Quectel 5G AI module also supports 6-screen synchronization, 8K@30 display output, and the connection of up to 17 cameras. Additionally, its highly integrated SiP packaging and LXC container isolation technology deeply merge communication and cockpit functions without interference, directly addressing the fragmentation and latency pain points of traditional cockpit systems.

For automakers and Tier 1 suppliers, the significance of the AS830M passing the AEC-Q104 test goes far beyond mere “compliance”; it delivers a truly “plug-and-play,” automotive-grade, highly integrated cabin-connectivity solution. Under the traditional model, automakers had to conduct module-level reliability testing independently, a process often characterized by long cycles, high costs, and significant risks. The AS830M 5G AI Module fundamentally transforms this landscape by alleviating customers’ redundant testing burdens, significantly reducing system failure risks and supply chain management costs, and effectively shortening the time-to-market for OEM production, thereby accelerating the safe and rapid deployment of premium smart cockpits.

Currently, the Quectel AS830M has been selected by multiple leading domestic automakers and is accelerating toward mass production. Looking ahead, Quectel will continue to advance AEC-Q104 compliance testing for cabin-connectivity modules with varying computing specifications, supporting domain controller convergence in the automotive industry and providing customers with an expanded portfolio of premium cabin-connectivity solutions.

Quectel AR588MA 5G-A Automotive-Grade Module Empowers TBox-P Platform

Recently, Jingwei Hirain’s TBox-P platform, built on Quectel’s automotive-grade 5G-A module AR588MA, has officially entered mass production. This provides full-link support for intelligent connected vehicles—from the communication core to the in-vehicle system—helping drive large-scale commercial adoption of advanced intelligent driving. The Jingwei Hirain TBox-P platform powered by Quectel’s AR588MA has already secured mass production design wins from multiple L4 autonomous driving customers.

What exactly does the powerful AR588MA “core” bring to the TBox-P platform?

Say Goodbye to Weak Signal Anxiety: AI-Powered Intelligent Network Selection Lets Vehicles Proactively “Choose the Signal”

Underground garages, tunnels, mountainous areas, urban canyons… the in-vehicle network environment is complex and ever-changing. Traditional in-vehicle communication can only “passively wait for a signal,” leading to poor experience and insufficient stability in weak signal areas.

The Quectel AR588MA breaks this deadlock. It features an embedded AI vehicle network engine with three key capabilities: scene recognition, intelligent switching, and signal compensation. It not only senses vehicle speed, location, and environment in real time but also autonomously learns base station handover patterns. When a vehicle enters a weak signal area like an underground garage, the AI engine predicts this in advance and dynamically optimizes network selection. Combined with an adaptive antenna compensation algorithm, it significantly enhances signal penetration in weak signal areas, achieving a qualitative leap from “passive connection” to “active optimization.”

5G-A Onboard: Greater Bandwidth, Faster Response, Stronger Capabilities

The AR588MA module is built on MediaTek’s 5G-A platform MT2739 and complies with the 3GPP R18 standard. It delivers a peak downlink rate of up to 9.0 Gbps and a peak uplink rate of over 2.5 Gbps. Compared to traditional 5G, this is not just a doubling of numbers—it’s a leap in experience.

Simply put, under ideal network conditions, downloading an HD movie in the cabin takes just a few seconds, and communication between the vehicle, the cloud, and roadside units happens with near-zero latency. This combination of ultra-high bandwidth and ultra-low latency paves the way for high-speed data pathways for advanced driver assistance and vehicle-to-everything (V2X) applications, making intelligent driving systems faster and safer.

No Single Point of Failure: DSDA Dual SIM Dual Active Creates “Double Insurance”

Advanced intelligent driving cannot rely on a single network. If the communication link is interrupted, the consequences could be disastrous. Ordinary “dual SIM dual standby” only supports both SIMs in standby simultaneously—when one card is on a call, data on the other card is interrupted. The DSDA (Dual SIM Dual Active) supported by the AR588MA allows both SIM cards to operate independently and concurrently without interfering with each other, truly enabling simultaneous network connectivity.

Even if one carrier’s network is congested or a base station fails, the other network seamlessly takes over, ensuring core services such as remote monitoring, NG-eCall emergency calling, and vehicle dispatching remain uninterrupted. This true dual-network redundancy builds an unbreakable communication safety foundation for L4 autonomous driving.

High Reliability & Easy Compatibility: Fast Upgrades, Global Availability

The reliability of in-vehicle products directly affects driving safety. The Quectel 5G Module strictly follows automotive-grade design standards, meets AEC-Q100 Grade 2 requirements and ISO 21434 cybersecurity standards, and operates stably under extreme temperatures (-40°C to +105°C) and vibrations. It also supports NG‑eCall emergency calling and L1+L5 dual-band GNSS high-precision positioning, providing dual benefits for vehicle safety and precise navigation.

In terms of upgrades and adaptation, the AR588MA features a highly compatible design. It is pin-to-pin compatible with Quectel’s existing automotive 5G series modules on the hardware side, and uses the QuecOpen architecture on the software side. Traditional 5G projects can smoothly upgrade to 5G-A without starting from scratch, greatly shortening development cycles and reducing costs. Additionally, the module supports global frequency bands, meeting the mass production needs of automakers in different regions and accelerating global deployment.

Quectel Launches New-Generation AI Computing Smart Module SH603FC

On March 11, during embedded world 2026, Quectel announced the official launch of its new-generation SH603FC series, an AI computing smart module based on MediaTek’s G520 chip platform.

As Quectel’s first high-performance module to feature this platform, the SH603FC series offers three variants: Wi-Fi 6, Wi-Fi 6E, and AP. It is designed to create an integrated intelligent hardware foundation for diverse scenarios such as industrial applications, robotics, smart retail, in-vehicle aftermarket entertainment devices, and edge computing, empowering various industries to achieve digital transformation and intelligent upgrades.

Robust Performance: Building the Cornerstone of Universal Intelligence

Quectel SH603FC series incorporates a CPU architecture featuring A78 + A55 cores, manufactured using TSMC’s 6nm process. It integrates a high-performance AI processing unit, enabling efficient on-device execution of complex AI model operations like facial recognition, product detection, and behavior analysis. This essentially equips terminal devices with a “smart brain,” facilitating a leap from passive response to proactive thinking.

This capability for “proactive thinking” is reshaping operational processes across industries:

On industrial production lines, real-time defect detection can immediately identify faulty products, significantly improving yield rates and efficiency.
For delivery robots, intelligent environmental perception allows for rapid identification of obstacles and path changes, enabling smoother and safer autonomous operation.
In smart stores, local analysis of foot traffic and customer behavior not only reduces reliance on cloud bandwidth but also ensures the privacy and security of commercial data from the source.

Dual-Screen Display: Unleashing Unlimited High-Definition Interaction

The Quectel AI module is not only equipped with a “smart brain” capable of handling complex AI computations but also possesses “sharp eyes” for capturing high-definition visuals. Its multimedia processing capabilities are particularly impressive, with the dual-screen display function precisely addressing the “one-device, multiple-screens” demands in sectors like commercial displays, in-vehicle aftermarket entertainment, and self-service kiosks. Through interface multiplexing solutions such as MIPI, eDP, and DP, the series supports dual-screen display at resolutions up to 2560×1600 at 60fps. This not only reduces hardware BOM costs but also expands the dimensions of interaction.

The flexible “one-chip, dual-screen” architecture elevates device interaction experiences to a new level.

On a vending machine, the main screen can loop 4K product advertisements, while the secondary screen displays real-time transaction QR codes and inventory information, achieving efficient synergy between advertising and transactions.
For smart payment terminals, the staff screen handles checkout operations, while the customer screen clearly shows the purchase details and promotional offers, enhancing transaction transparency and the consumer experience.
In in-vehicle aftermarket systems, the central control screen provides the driver with real-time information like navigation and vehicle status, while a screen for the passenger or a roof-mounted display can be used freely for entertainment, balancing driving safety with passenger experience.

Versatile Adaptability: Excelling in Diverse Application Environments

Leveraging its robust comprehensive performance and rich interface resources (such as PCIe, USB, RGMII, etc.), the SH603FC series has become a core driver for intelligent upgrades across multiple fields, injecting powerful momentum into the digital transformation of various industries.

In the industrial sector, it supports a wide operating temperature range from -35°C to +75°C, providing robust AI computing power and stable operation for industrial tablets and control equipment, facilitating real-time production data collection and analysis, and advancing the implementation of Industry 4.0.
In the smart retail sector, it empowers smart vending machines and self-checkout systems with intelligent payment processing and real-time inventory monitoring, making store operations more efficient and services more attentive.
In the commercial display sector, its high-definition display capabilities make content dissemination on advertising players and large-screen terminals more engaging, effectively enhancing brand presentation and communication efficiency.

Furthermore, the module features a compact LGA+LCC form factor and fully supports multiple operating systems, including Android 15, Yocto, and Ubuntu. It can be flexibly adapted to various devices such as robots, in-vehicle aftermarket entertainment systems, smart intercom recorders, and smart home appliances. It provides a one-stop hardware solution to meet the intelligent upgrade needs of different industries and scenarios.

Currently, samples for the SH603FC series are available for testing. Customers are welcome to inquire and collaborate to unlock the boundless possibilities of edge intelligence together.

Quectel Launches New 5G Modules at MWC2026

On March 5th, during the Mobile World Congress (MWC) 2026 in Barcelona, Quectel, a global supplier of IoT total solutions, in collaboration with UNISOC, unveiled a new series of 5G modules based on UNISOC’s three major platforms: the 5G eMBB V620, V610, and the 5G RedCap V527. This new product matrix, characterized by high-end performance, compact design, and lightweight features, marks a new journey towards the large-scale application of the 5G Internet of Things.

Flagship Performance, Redefining the 5G Experience

The RG620UA/RM520UA series 5G modules, built on the UNISOC V620 platform, deliver robust 5G data rates, a quad-core A55 processor, rich Ethernet configurations, and Wi-Fi 7/Wi-Fi 6 connectivity. Simultaneously, they continue to optimize and innovate in areas such as ENDC combinations, RAM+ROM solutions, and adaptation for QuecOpen and OpenWRT/PrplOS. This precisely meets the urgent market demand for high-performance, highly flexible terminals in the 5G FWA sector.

Extreme Compactness, Unlocking New Possibilities for Portability

Targeting space-constrained scenarios like global portable terminals and power IoT applications, Quectel has launched the compact 5G modules RG258UB-GL/RG258UB-CN based on the UNISOC V610 platform. This series employs a highly integrated packaging process, reducing the volume by approximately one-third compared to traditional 5G LGA modules. This frees up more design flexibility for devices like portable mobile hotspots (MHS) and compact power terminals. They also deliver robust performance, fully supporting 5G SA/NSA dual modes and global full network compatibility, with an optimized RF solution to ensure signal stability. By selecting core domestic components, they effectively mitigate supply chain risks while achieving a better balance between performance and cost, helping customers quickly respond to the growing demand for consumer electronics and IoT portable devices in global markets.

Lightweight and Slim, Accelerating the Popularization of 5G

Based on UNISOC’s new generation high-performance 5G RedCap IoT communication chip, the V527, Quectel has introduced the RG155UC-CN lightweight module targeting the IoT market where cost and performance are both critical. This module features an ultra-small, ultra-thin design, reducing volume by 46% and thickness by 17% compared to traditional packaging. It supports a rich software ecosystem, significantly lowering the barrier to upgrading lightweight 5G terminals, and is widely adaptable to consumer and industrial terminals such as smart wearables, tablets, and industrial sensors.

Furthermore, the UniHALO solution, developed by Quectel based on UNISOC’s full range of 5G IoT platforms, has now been successfully adapted to the OpenWRT 24.10 version. This solution aims to provide developers with a more stable and efficient software development environment by simplifying the design process, improving system performance, and effectively reducing DDR and Flash resource overhead. It fully leverages hardware potential, further lowering the development threshold for 5G terminals.

Anchored by Customer Value, Building a Global Digital Future Together

Currently, Quectel 5G modules based on the three UNISOC platforms are widely deployed across various fields including smart industry, smart grid, smart logistics, and consumer electronics. The entire product series adopts low-power design, helping to improve terminal battery life by over 20%, deeply aligning with the “Dual Carbon” goals. The V527 and V610 platforms, with their high cost-performance ratio, lower the barrier to 5G access, injecting momentum into the digital development of emerging markets. The V620 platform, with its outstanding performance, provides a high-speed, low-latency network experience that is truly both “affordable and high-quality.”

Quectel and MediaTek Jointly Launch Next-Gen 5G-A + Wi-Fi 8 Smart CPE Solution

On March 2nd, during the Mobile World Congress Barcelona 2026 (MWC Barcelona 2026), Quectel, in partnership with MediaTek, proudly launched a next-generation smart CPE solution. This innovative solution combines 5G-Advanced and Wi-Fi 8 technologies, powered by the MediaTek T930 platform.

The solution deeply integrates the high-performance 5G-A connectivity of the MediaTek T930 platform, the intelligent reliability of the Wi-Fi 8 solution, AI-enhanced capabilities, and Quectel’s profound expertise in the global Fixed Wireless Access (FWA) market. Transcending the mere concept of “high speed,” this solution aims to provide a holistic CPE solution for both home and enterprise users, delivering super performance, exceptional stability, and AI-driven intelligent management. It is designed to catalyze transformative leaps in scenarios such as broadband access, mobile office, enterprise networking, and industrial internet. During the exhibition, the prototype based on this solution made its public debut at the Quectel booth (5A19), becoming a focal point of the show.

Technical Core: Deep Collaboration of 5G-A, Wi-Fi 8, and AI – More Than Just Speed

The solution is built upon Quectel RG660MK series module, leveraging MediaTek’s advanced 4nm process T930 5G platform. It integrates a 3GPP R18-compliant 5G-A modem, a quad-core CPU, a dedicated network processing unit, and achieves chip-level deep collaboration with Wi-Fi 8 technology, delivering a revolutionary intelligent connectivity experience for users.

Wide Area Coverage, Stable Signal
Support for 8Rx reception technology increases spectral efficiency at the cell edge by 40%, thereby extending 5G signal coverage by 40% and significantly improving the number of users that can access the cell. Whether in home corners, large enterprise buildings, or areas with weak signals, stable and high-speed 5G connectivity is ensured.

Tri-Band Uplink, More Efficient Connection
Support for 3Tx (5L) uplink technology adds a third transmitting antenna, boosting signal strength and uplink transmission efficiency. This not only effectively enhances network coverage and stability for multiple users online simultaneously but is also particularly suitable for high-bandwidth, low-latency application scenarios, empowering smart homes and enterprise innovation.

Ultra-Low Latency, Smoother Interaction
The solution incorporates MediaTek’s L4S (Low Latency, Low Loss, Scalable Throughput) software feature. While ensuring high throughput, it can reduce critical network latency to 1/20th of traditional solutions. This provides a foundational network capability for latency-sensitive applications like cloud gaming, remote real-time control, and high-definition video conferencing, enabling online interactions to feel as smooth as face-to-face communication.

Local Networking, Intelligent Interference Immunity
Through Wi-Fi 8’s Coordinated Spatial Reuse (Co-SR) and Coordinated Beamforming (Co-BF) technologies, the solution enables intelligent coordination and scheduling among multiple access points. In device-dense environments like smart homes, shopping malls, hotels, and offices, it significantly reduces co-channel interference, boosting overall transmission efficiency by over 25%. Even with hundreds of devices connected simultaneously, each terminal operates smoothly, easily resolving issues like lag and disconnections in multi-device networking.

Dynamic Optimization, Handling Congestion with Ease
Leveraging Wi-Fi 8’s Dynamic Spectrum Management technology, the solution can intelligently allocate channel resources during network congestion, significantly alleviating traffic jams in high-load scenarios. This boosts device throughput in complex environments by up to 80%, ensuring the network remains robust even when multiple users are simultaneously engaged in 4K streaming, large file downloads, and video calls.

More Open AI Scalability
By flexibly integrating a dedicated NPU processor, the solution equips the 5G CPE device with powerful edge AI computing and intelligent interaction capabilities. This enables autonomous scheduling and optimization of network resources, localized intelligent voice interaction, and dynamic distribution of tasks across the end, edge, and cloud, evolving the network from “passive connection” to “active service.”

Quectel Releases Next-Generation Flagship Smart Module SP895BD-AP

On January 6, the first day of the 2026 International Consumer Electronics Show (CES 2026), leading global IoT solutions provider Quectel announced the official launch of its next-generation flagship smart module, SP895BD-AP.

This module is powered by the Qualcomm Snapdragon™ Q-8750 processor, which offers enhanced graphics processing capabilities, superior imaging effects, and advanced AI computing performance. It is designed to meet the stringent demands of high-end devices such as video conferencing, ultra-high-definition displays, image synthesis, computation boards, smart retail, and smart home applications. It provides essential hardware support for the AIoT industry as it transitions from “basic intelligence” to “high-level smart computing.”

Quectel’s COO, Zhang Dong, stated: “At this critical juncture in the move toward ‘higher intelligence’ in AIoT, there is an explosive growth in the demand for computational power and multimedia processing capabilities in terminal devices. The newly launched flagship smart module SP895BD-AP is a key achievement for Quectel, grounded in industry needs and deepening our efforts in the edge intelligence field. Leveraging the Qualcomm Snapdragon Q-8750 processor, this module achieves significant performance enhancements in CPU, GPU, and AI engines, alongside 8K multimedia processing capabilities. It offers a solution that balances ‘computational power and energy efficiency’ for high-end AIoT scenarios, accelerating the digital transformation of the industry.”

Enhanced with 3nm Technology: A Double Leap in Performance and AI Computing Power

The SP895BD-AP redefines performance boundaries with its advanced hardware architecture. Featuring the Qualcomm Snapdragon Q-8750 processor, it employs a 3nm fabrication process and includes an octa-core high-performance Qualcomm Oryon™ CPU, with clock speeds reaching up to 2×4.32 GHz + 6×3.53 GHz. Compared to the previous generation (the 8 series chips), it achieves a 45% increase in CPU performance and a 44% improvement in energy efficiency. This allows it to maintain stable high-performance output in high-intensity scenarios such as multi-tasking and complex algorithm execution while minimizing power consumption, thereby balancing the demands for “computational power” and “energy consumption.”

The accompanying Qualcomm® Adreno™ 8 series GPU also exhibits outstanding performance, achieving a 40% increase in efficiency and energy optimization. Its unique tile-based architecture delivers stunning graphics effects and realistic environmental rendering capabilities, ensuring reliable performance for complex task handling and ultra-high-definition displays (8K Display/3D), easily meeting the high demands of graphic processing for high-end devices.

In the domain of edge AI computing, the SP895BD-AP brings groundbreaking advancements: the integrated AI engine achieves a computing power of up to 77 TOPS, marking a 45% increase over the previous generation. It supports INT4/INT8/INT16/FP16 full-precision computing modes, enabling real-time inference, and can even run large language models with up to 11 billion parameters on the edge. By integrating with multimodal perception technology, terminal devices equipped with this module can accurately recognize user contexts, facilitating multimodal interaction, and enabling generative AI assistants with real-time decision-making and personalized service capabilities, thereby establishing a “fully-covered, high-efficiency operation” foundation for edge AI development.

Multimedia Capabilities Maximized: 8K Ultra HD and Robust Imaging Input

In the field of multimedia processing, the SP895BD-AP sets a new benchmark. It supports 8K@30fps video encoding and 8K@60fps video decoding, significantly enhancing video bitrate processing and transmission efficiency. This enables “low latency transmission + high-fidelity reproduction” of ultra-high-definition videos, seamlessly aligning with the core requirements of 4K/8K ultra-high-definition displays and professional video conferencing equipment.

Its imaging input capabilities are equally robust: it features three integrated ISPs (image signal processors), capable of synchronously processing three streams of 48MP@30fps video input, and supports individual cameras with up to 108 million pixels for image capture, accurately capturing scene details to easily meet the needs of high-end imaging scenarios.

Flexible Adaptation: Hardware-Software Synergy Accelerating Scenario Implementation

To further adapt to the complex and diverse application ecosystem of AIoT, the SP895BD-AP has been fully optimized for its compatibility from “hardware flexibility” to “software compatibility.” Its hardware design utilizes LGA packaging, resulting in a compact size that can accommodate more product forms. Additionally, it is equipped with various peripheral interfaces, including MIPI DSI, CSI, PCIe, USB, I2S, UART, I2C, and SPI, to meet diverse display, audio, sensor, and communication expansion requirements, significantly enhancing scenario adaptability and deployment flexibility in AIoT applications.

On the software side, the module is designed to be compatible with a broader industry ecosystem, deeply supporting Android 15 and Linux operating systems, which greatly reduces the technological barriers for cross-field applications.

In the future, Quectel will continue to focus on the integration of edge intelligence and IoT technologies, investing and innovating to drive the deep development of industrial digital transformation with more cutting-edge products and more comprehensive solutions, injecting strong momentum into the construction of an intelligent world characterized by “everything being smart and full-domain perception.”

Quectel Releases Robot Computing Module SH602HA-AP at DDC2025

Recently, Quectel Communication officially launched the SH602HA-AP robot computing module, equipped with the Xuri®5 intelligent computing chip for sweet potato robots, which was showcased at the DDC2025 Sweet Potato Robot Developer Conference.

As a core computing solution for the new generation of general-purpose robots, the Quectel SH602HA-AP module boasts high computing power of 10 TOPS, an RTK + binocular vision fusion solution, and advanced on-device large model operation capabilities. These key advantages provide robots with essential technological support for precise navigation and obstacle avoidance, dynamic environmental perception, and more. This advancement aids industries in upgrading from “functional execution” to “perception and decision-making,” thus accelerating the commercialization process of robots on a larger scale.

In terms of core configuration, the Quectel SH602HA-AP module runs on the Ubuntu operating system. The embedded Xuri 5 chip is based on the advanced BPU Bayesian architecture and integrates abundant heterogeneous computing resources, offering up to 10 TOPS of AI computing power. This performance level can easily handle mainstream scenarios such as lawn mowers, cleaning robots, companion robots, and delivery robots, supporting efficient completion of full-stack computing tasks locally. It can also smoothly operate complex AI models and the latest algorithms such as Transformer, BEV, and Occupancy on the edge. Compared to traditional solutions, robots utilizing this module can not only accomplish basic object recognition and path planning but also efficiently realize advanced intelligent behaviors like scene understanding, natural language interaction, and dynamic obstacle avoidance.

More importantly, the Quectel SH602HA-AP achieves breakthroughs in low energy consumption while outputting high-performance AI computing power. In the complex field of robot terminal computing, it delivers better decision-making and task execution within limited time and computational resources, while also better aligning with the stringent requirements for heat dissipation control and lightweight design in robots.

If the computing architecture serves as the “intelligence core” of a robot, then the perception system acts as its “five senses,” interacting with the surrounding world. The SH602HA-AP module creates a complete integrated perception system, realizing an edge-side closed loop of “perception-computation-decision.”

In terms of perception capability, the module fully supports various sensor signal inputs and fusion processes, including LiDAR, structured light, ToF (Time of Flight), and voice. It incorporates core robotic perception algorithms such as dual-camera depth computation, AI + VSLAM (visual simultaneous localization and mapping), and 3D point cloud computation, combined with voice recognition capabilities, endowing robots with comprehensive intelligent abilities of “seeing, hearing, computing, and judging.”

In multimedia and visual processing, the SH602HA-AP performs exceptionally well, featuring a newly designed ISP 2.0 (Image Signal Processor) optimized for robotic scenarios, enhancing both latency and quality. The module’s maximum processing capability reaches 3840×2160@60fps, supporting advanced technologies such as 3D-NR (three-dimensional noise reduction), WDR (wide dynamic range), and HDR (high dynamic range), allowing it to accurately capture high-definition visual data in complex lighting environments. Additionally, it supports 4K@60fps video encoding and decoding, meeting the core demands for real-time visual transmission and processing in robots.

The interface configuration of the SH602HA-AP is remarkably versatile, encompassing 1×BT.1120, 1×DSI, 1×RGMII, 1×USB 3.0, 1×USB 2.0, 1×SDIO, 7×UART, 7×I2C, 1×QSPI, 2×I2S, and other abundant interfaces. Moreover, the module supports flexible external communication and positioning modules such as Quectel 5G, LTE Cat 1/4, Wi-Fi 6, and GNSS, allowing for quick integration of communication and high-precision positioning capabilities across various robotic applications.

Zhang Dong, COO of Quectel Communication, stated, “From lawn mowers and sweepers to cutting-edge humanoid robots, various forms of robots are profoundly reshaping human production and lifestyle. Quectel is committed to providing a solid edge-side computing and communication foundation for intelligent robots. The launch of the SH602HA-AP module not only achieves dual upgrades in computing and perception but, more importantly, significantly lowers the development threshold for high-end intelligent robots, injecting core momentum into industry innovation.”

Quectel Launchs the Automotive-grade 5G R18 Module AR588MA

On January 4, just before the 2026 International Consumer Electronics Show (CES 2026), Quectel Communications, a global leader in IoT and V2X (Vehicle-to-Everything) solutions, announced the launch of its automotive-grade 5G-A module AR588MA, compliant with the 3GPP R18 standard.

This series of 5G modules is built on MediaTek’s world’s first 5G-A platform, MT2739, achieving four core breakthroughs: comprehensive signal coverage, high-speed data transmission, AI-based intelligent network adaptation, and automotive-grade safety assurance. These features strongly support the innovative development of the next-generation intelligent connected vehicles. Currently, the module is offering engineering samples externally, and several leading automotive companies have already initiated the implementation of the AR588MA series.

“Ground + Satellite” Full Coverage, More Reliable High-Speed Transmission

As an automotive-grade module based on MediaTek’s first 5G-A platform, the Quectel AR588MA series modules feature leading modem performance in the industry. It includes a built-in quad-core Cortex-A55 CPU with a clock speed of up to 2.3GHz, enhanced upstream transmission capabilities, and ultra-low latency, supporting a bandwidth of 400 MHz and NR 5CC, with downstream speeds reaching up to 9.0 Gbps and upstream speeds exceeding 2.5 Gbps. It also supports DSDA (Dual SIM Dual Active) functionality, enabling more efficient and stable data transmission and real-time processing while maintaining stable network connections, thereby laying a solid communication foundation for the safety and reliability of advanced driver-assistance systems.

At the same time, Quectel AR588MA has achieved significant breakthroughs in comprehensive communication capabilities. It not only supports 5G-A technology but also integrates satellite communication functions. Combined with enhanced low-frequency reception performance and adaptive network signal compensation algorithms, it significantly improves network performance while ensuring full-scenario communication coverage. Even in weak signal areas like basements and remote mountain regions, vehicles can maintain stable connectivity, effectively addressing the pain points of ground network coverage blind spots and ensuring communication continuity in complex environments.

In terms of wireless performance optimization, the AR588MA is compatible with a six-port antenna design, deeply adapting to Quectel’s high-performance intelligent antenna solutions, thus achieving deep integration of module and antenna performance, providing users with wide coverage and strong signal wireless network performance.

AI Intelligent Adaptation, Smoother Network Experience

During this critical period of advancement in intelligent connected vehicles, users have raised higher demands for the smoothness of in-vehicle network experiences.

One of AR588MA’s core competitive advantages lies in its deep integration of AI technology with in-vehicle communication, achieving an upgrade from “passive connectivity” to “active adaptation.” The module features an intelligent driving scene recognition system and an AI network optimization engine, with processing capacities of 25K DMIPS for quad-core and 13K DMIPS for dual-core. It can real-time integrate multidimensional data, including vehicle positioning, speed, and road conditions, automatically matching optimal network modes, significantly enhancing network speed and connection stability, and providing users with a smoother in-vehicle network experience.

Automotive-Grade Core Quality, Dual Assurance of Safety and Reliability

The reliability of automotive products is directly related to driving safety. The Quectel AR588MA strictly adheres to automotive-grade design standards and safety systems, fulfilling AEC-Q100 Grade 2 automotive specifications to ensure product reliability and durability in extreme environments. Additionally, it complies with ISO 21434 automotive cybersecurity management standards and supports Secure Boot and RoT (Root of Trust), combined with Hypervisor hardware isolation technology to provide a more stable connectivity experience and more reliable safety assurances for in-vehicle communication.

On the functional side, the AR588MA fully supports eCall/NG-eCall emergency calling systems, which can automatically trigger a call and transmit critical data such as vehicle location and accident type to emergency centers in the event of a collision or other emergencies, buying precious time for rescue operations. To further enhance vehicle positioning reliability, this module also integrates GNSS positioning capabilities, supporting dual-frequency positioning with L1 and L5, outputting at a frequency of up to 30Hz, providing precise location support for path planning and lane-level navigation for assisted driving.

Compatible Design for Easy Upgrades, Accelerating 5G-A Implementation in Vehicles

To reduce customer development costs and shorten product launch cycles, the AR588MA employs a highly compatible design approach at both hardware and software levels.

On the hardware front, it is pin-to-pin compatible with Quectel automotive 5G modules AG581A, AG56xN, and AG519M series, allowing customers to quickly upgrade from traditional 5G to 5G-A. On the software side, it utilizes the QuecOpen architecture, leveraging excellent cross-platform and cross-system compatibility to assist automotive enterprises in seamless system migration, significantly shortening product development and validation cycles.