Quectel Smart module Archives

Quectel Launches SE505FE 5G Smart Module

Keeping pace with this industry trend, Quectel officially unveiled its new SE505FE series of 5G smart modules today. The series natively supports Android 16 and is powered by an octa-core processor and a high-performance GPU, highly integrating graphics rendering, 5G connectivity, and multimedia capabilities into a single module.

With highly competitive cost-effectiveness, it directly addresses the rigid demands for real-time processing performance and human-machine interaction in scenarios such as commercial retail and smart industry, providing an AIoT foundation solution for next-generation smart terminals that combines performance with deployment flexibility.

Precise positioning: Android 16 + high cost-effectiveness, lowering the barrier for smart terminal deployment

Previously, enabling 5G connectivity and Android-based interaction on IoT devices often required stacking three separate circuit boards—an AP motherboard, a communication module, and a multimedia processing unit—resulting in high costs and extremely complex designs. The Quectel SE505FE offers a more cost-effective integrated solution that resolves this hardware stacking challenge.

More powerful core

Built on the MediaTek MT8863T platform, it features an octa-core processor (2× Cortex-A76 @ 2.4 GHz + 6× Cortex-A55 @ 2.0 GHz) and a Mali-G57 GPU. Based on the Arm Valhall architecture, the GPU delivers excellent graphics processing and energy efficiency. Without the need for an external host controller, it can comfortably handle complex graphics rendering, 2K HD video encoding/decoding, and edge computing tasks, ensuring smooth human-machine interaction and accurate visual presentation on smart terminals.

Smarter system

Equipped with native Android 16, it integrates interaction, multimedia, and device security management capabilities. This not only shortens time-to-market but also meets the stringent requirements of payment and industrial devices for data encryption, firmware verification, and remote management through a system-level multi-layer security framework. It also supports cross-device collaboration, making it easy to connect data links across smart buildings and production lines.

For the global market, the series is available in four variants: SE505FE-EM (Europe, Middle East, Africa, South Asia, etc.), SE505FE-NA (North America and Latin America), SE505FE-CN (China), and SE505FE-WF (Wi-Fi and Bluetooth only), precisely matching carrier band requirements in different regions.

The module adopts a compact standard LGA package measuring 42.5 × 56.5 × 2.9 mm. Its slim and compact form factor makes it an ideal fit for space-constrained portable devices, wall-mounted digital signage, and compact smart gateways.

Comprehensive connectivity and practical multimedia capabilities form the core of smart terminals

The Quectel SE505FE packs a full suite of wireless connectivity into a compact footprint. For cellular connectivity, it supports 5G Sub-6 GHz bands, complies with the 3GPP Release 16 standard, supports 4×4 MIMO and dual-SIM dual-standby, and is backward compatible with LTE Cat 4, ensuring stable connections in complex environments.

On top of that, the Quectel 5G Smart module integrates Wi-Fi 5, Bluetooth 5.2, and quad-mode GNSS positioning (GPS/BDS/GLONASS/Galileo), truly realizing a “single-module-as-terminal” connectivity architecture.

On the multimedia side, which directly shapes user experience, the SE505FE is also well equipped: it supports camera input up to 32 MP at 30 fps and 2K video encoding/decoding at 30 fps. With complete audio input and output interfaces, it delivers clear visuals and smooth operation whether used for on-site recording by industrial inspection devices or for continuously playing promotional content on retail advertising displays.

Industrial-grade reliability and flexible interfaces for demanding scenarios

IoT devices often operate in harsh environments, and the SE505FE ensures stable 24/7 operation with industrial-grade reliability.

Wide temperature range

It supports an industrial-grade operating temperature range from -35°C to +75°C, maintaining stable performance whether deployed in cold outdoor environments or high-temperature factory facilities.

Ample storage

It comes standard with 4 GB LPDDR4X + 64 GB eMMC, with an optional 8 GB + 128 GB configuration (expandable up to 12 GB + 512 GB), and supports SD card expansion up to 2 TB, meeting high-volume local storage needs.

Rich interfaces

It provides USB 3.1, dual UART, 106 GPIOs, and multiple reusable interfaces including I2C, SPI, and I2S. Together with seven antenna interfaces, it covers the connectivity needs of most peripherals for industrial PDAs, smart gateways, in-vehicle devices, and more.

Certification-ready

It will support major global market access certifications including FCC, CE, and CCC, and the entire series complies with RoHS and REACH environmental standards, helping customers bring products to target markets quickly and efficiently.

Leveraging its strong processing performance, connectivity, and multimedia capabilities, the SE505FE can be widely applied across multiple industries:

Commercial retail: countertop POS terminals, smart POS systems, digital signage/advertising displays
Industrial and professional applications: handheld PDAs, tablets, smart two-way radios, audio/video recorders
Smart hardware: AR/VR devices, smart gateways, smart home products, smart wearables

From retail terminals to industrial production lines, and from smart cities to mobile mobility, the deep integration of 5G and Android is redefining the development paradigm for IoT devices. Going forward, Quectel will continue to expand its Android smart module portfolio, lowering design barriers and strengthening global support to help 5G IoT evolve from “usable” to “highly usable,” accelerating intelligent upgrades across industries.

Quectel Released Smart Module SE200ZC-AP for AI

From smart retail and service robots to dashcams and medical devices, AI vision is rapidly becoming a standard feature across various smart terminals. Deploying complex visual tasks—such as real-time recognition, object detection, and behavior analysis—places stringent demands on edge devices in terms of computing power, image quality, and power consumption. Striking the perfect balance among these three factors is the critical dividing line between a product that merely “works” and one that truly “excels.” Quectel’s newly launched SE200ZC-AP smart module is specifically designed to address this challenge.

Purpose-built for AI vision, the Quectel SE200ZC-AP is based on the Rockchip RV1126B/RV1126BJ platform. It seamlessly integrates 3 TOPS of NPU computing power, 4K ultra-HD encoding/decoding, and ultra-low power consumption into a compact form factor. It delivers high-performance, highly reliable edge AI solutions for scenarios including smart security, industrial vision, smart vehicles, service robots, medical imaging, and smart retail.

Lightweight Computing Foundation: Bringing Intelligence to the Edge
Lightweight, scenario-specific computing power is key to the rapid deployment of AI vision devices.

The Quectel SE200ZC-AP features a quad-core ARM Cortex-A53 CPU with a maximum clock speed of 1.6 GHz, integrated with a Neon acceleration engine and an FPU. This ensures an optimal balance of performance and energy efficiency, easily handling multitasking scenarios. Powered by a 3 TOPS NPU, it supports mixed-precision computing (INT4/INT8/INT16/FP16) and can smoothly run lightweight multimodal large models. Complex algorithmic inferences, such as facial recognition, object detection, behavior analysis, and audio parsing, are all completed locally on the device.

By pushing AI capabilities to the edge and performing inference locally, the Quectel smart module not only eliminates the risks of remote data transmission and safeguards user privacy but also minimizes response latency. This supports real-time intelligent decision-making, laying a solid foundation for vision applications in industrial and security sectors where real-time performance is paramount.

4K Ultra-HD Encoding & Decoding: Exceptional Frame-by-Frame Image Quality
Premium imaging is the cornerstone of AI vision terminals delivering real value.

Equipped with a high-performance multimedia processing engine, the SE200ZC-AP supports 4K@45fps H.265/H.264 encoding and 4K@30fps H.265/H.264 decoding. It also features dual parallel encoding capabilities (HEVC/JPEG and H.264/JPEG), allowing simultaneous output of multiple video streams. High-definition recording and real-time snapshot capture are effortlessly handled by a single hardware module.

In terms of image processing, the module supports 8MP AI-ISP and 12MP HDR ISP, offering outstanding spatial noise reduction and image enhancement. Notably, the AI-ISP utilizes dedicated hardware for independent processing, consuming zero NPU resources. This not only guarantees superior image quality but also reserves ample computing power for complex vision applications, perfectly balancing image fidelity with AI inference.

Its image capture capabilities are equally impressive, supporting up to five cameras with a maximum resolution of 12MP@30fps per channel. It features two 4-lane MIPI CSI interfaces that can be flexibly split into multiple 2-lane channels, along with one general-purpose DVP interface. This fully accommodates multi-camera scenarios such as multi-sensor stitching and panoramic surround views.

Ultra-Low Power Design: Tailored for Battery-Powered Applications
Beyond robust computing and high-definition imaging, battery life directly determines the practical viability of portable and outdoor devices.

The Quectel SE200ZC-AP adopts an ultra-low power design and features AOV3.0 low-power video recording technology. With a storage configuration of 1 GB LPDDR4x + 64 GB eMMC, its sleep current drops to an impressive 0.85 mA. Additionally, the module supports fast boot and low-power pre-recording functions, significantly reducing standby power consumption. This makes it particularly well-suited for battery-powered products like portable medical devices, wireless vehicle equipment, and inspection robots.

Comprehensive Hardware & Software Compatibility: Accelerating Time-to-Market
To meet the diverse needs across various industries, the SE200ZC-AP offers a robust support system encompassing software, hardware, and peripheral expansion. This effectively simplifies the development process and helps customers shorten their product launch cycles.

On the software front, the module is deeply compatible with Linux (Kernel 6.1) and Debian 12 operating systems, providing efficient support for application development and iterative upgrades across diverse scenarios.

On the hardware front, the SE200ZC-AP utilizes an LCC+LGA package with an ultra-compact footprint of just 40.0 × 40.0 × 2.9 mm, allowing for seamless integration into space-constrained smart terminals.

Furthermore, the module is equipped with a rich array of peripheral interfaces, including MIPI_DPHY/DVP/LCDC, MIPI CSI, SAI, PDM, DSM, ADC, I2C, GMAC, USB 3.0/2.0, SPI, CAN FD, SDIO, and UART. These enable rapid expansion of functions such as image capture, screen display, audio input, and local storage.

Additionally, the module supports external connection to Quectel’s 4G, Wi-Fi 6, audio, and GNSS modules. This provides a one-stop solution for the entire “perception-computation-communication” chain, ensuring seamless coordination across local data collection, AI analysis, wireless transmission, and location tracking.

Quectel Launches New-Generation AI Computing Smart Module SH603FC

On March 11, during embedded world 2026, Quectel announced the official launch of its new-generation SH603FC series, an AI computing smart module based on MediaTek’s G520 chip platform.

As Quectel’s first high-performance module to feature this platform, the SH603FC series offers three variants: Wi-Fi 6, Wi-Fi 6E, and AP. It is designed to create an integrated intelligent hardware foundation for diverse scenarios such as industrial applications, robotics, smart retail, in-vehicle aftermarket entertainment devices, and edge computing, empowering various industries to achieve digital transformation and intelligent upgrades.

Robust Performance: Building the Cornerstone of Universal Intelligence

Quectel SH603FC series incorporates a CPU architecture featuring A78 + A55 cores, manufactured using TSMC’s 6nm process. It integrates a high-performance AI processing unit, enabling efficient on-device execution of complex AI model operations like facial recognition, product detection, and behavior analysis. This essentially equips terminal devices with a “smart brain,” facilitating a leap from passive response to proactive thinking.

This capability for “proactive thinking” is reshaping operational processes across industries:

On industrial production lines, real-time defect detection can immediately identify faulty products, significantly improving yield rates and efficiency.
For delivery robots, intelligent environmental perception allows for rapid identification of obstacles and path changes, enabling smoother and safer autonomous operation.
In smart stores, local analysis of foot traffic and customer behavior not only reduces reliance on cloud bandwidth but also ensures the privacy and security of commercial data from the source.

Dual-Screen Display: Unleashing Unlimited High-Definition Interaction

The Quectel AI module is not only equipped with a “smart brain” capable of handling complex AI computations but also possesses “sharp eyes” for capturing high-definition visuals. Its multimedia processing capabilities are particularly impressive, with the dual-screen display function precisely addressing the “one-device, multiple-screens” demands in sectors like commercial displays, in-vehicle aftermarket entertainment, and self-service kiosks. Through interface multiplexing solutions such as MIPI, eDP, and DP, the series supports dual-screen display at resolutions up to 2560×1600 at 60fps. This not only reduces hardware BOM costs but also expands the dimensions of interaction.

The flexible “one-chip, dual-screen” architecture elevates device interaction experiences to a new level.

On a vending machine, the main screen can loop 4K product advertisements, while the secondary screen displays real-time transaction QR codes and inventory information, achieving efficient synergy between advertising and transactions.
For smart payment terminals, the staff screen handles checkout operations, while the customer screen clearly shows the purchase details and promotional offers, enhancing transaction transparency and the consumer experience.
In in-vehicle aftermarket systems, the central control screen provides the driver with real-time information like navigation and vehicle status, while a screen for the passenger or a roof-mounted display can be used freely for entertainment, balancing driving safety with passenger experience.

Versatile Adaptability: Excelling in Diverse Application Environments

Leveraging its robust comprehensive performance and rich interface resources (such as PCIe, USB, RGMII, etc.), the SH603FC series has become a core driver for intelligent upgrades across multiple fields, injecting powerful momentum into the digital transformation of various industries.

In the industrial sector, it supports a wide operating temperature range from -35°C to +75°C, providing robust AI computing power and stable operation for industrial tablets and control equipment, facilitating real-time production data collection and analysis, and advancing the implementation of Industry 4.0.
In the smart retail sector, it empowers smart vending machines and self-checkout systems with intelligent payment processing and real-time inventory monitoring, making store operations more efficient and services more attentive.
In the commercial display sector, its high-definition display capabilities make content dissemination on advertising players and large-screen terminals more engaging, effectively enhancing brand presentation and communication efficiency.

Furthermore, the module features a compact LGA+LCC form factor and fully supports multiple operating systems, including Android 15, Yocto, and Ubuntu. It can be flexibly adapted to various devices such as robots, in-vehicle aftermarket entertainment systems, smart intercom recorders, and smart home appliances. It provides a one-stop hardware solution to meet the intelligent upgrade needs of different industries and scenarios.

Currently, samples for the SH603FC series are available for testing. Customers are welcome to inquire and collaborate to unlock the boundless possibilities of edge intelligence together.