5G Cellular Module Archives

Fibocom FG390 Takes the Lead in Supporting U6G

During NetworkX 2026, Fibocom’s flagship 5G-A FWA module, the FG390, received a major upgrade with U6G capabilities. Built on the MediaTek T930 platform, the brand-new U6G model (FG390-MEA-30) delivers world-leading support for U6G (NR n104). The Fibocom 5G module also enables cross-band carrier aggregation with Sub-6GHz, providing device-side product support for the next phase of 5G-A FWA network upgrades.

U6G Unlocks New Potential for FWA

U6G (Upper 6GHz) covers the 6425–7125 MHz frequency range and boasts 700MHz of spectrum resources. Its advantage of continuous large bandwidth can further boost network capacity and throughput, opening up new spectrum space for 5G-A FWA to advance toward 10-Gigabit wireless broadband. In terms of applications, U6G can support consumer-grade scenarios such as 10-Gigabit home broadband, 8K ultra-HD streaming, cloud gaming, and AR/VR immersive experiences. Simultaneously, it meets industry demands like wireless private lines for small and medium enterprises (SMEs) and smart campus networking.

The global U6G industry is accelerating its transition from technical verification to commercial deployment. The Middle East is leading the charge in commercial implementation. e& UAE has already launched the deployment of an Upper 6GHz commercial mobile network, with prior related tests achieving 10Gbps-level experiences.

In China, technical breakthroughs continue to emerge. Zhejiang Mobile completed an innovative verification of U6G, achieving a peak downlink rate of over 10Gbps through four-carrier aggregation. Europe is accelerating spectrum policies and field trials, with MasOrange and Ericsson recently completing 6GHz network tests to continually verify its capacity and coverage potential. Emerging markets in Latin America and Central Asia are also pushing forward with live network testing and scenario pilots, building a foundation for future regional commercialization.

As U6G deployment accelerates globally, the adaptation of new spectrum capabilities on the device side has become a crucial link for industry implementation.

Fibocom FG390 Upgrades U6G Capabilities

Featuring a brand-new hardware design, the FG390 further expands 5G-A FWA spectrum capabilities:

Spectrum Support: Added support for NR n104, covering the Upper 6GHz frequency band.
Carrier Aggregation: Supports the collaborative operation of U6G and Sub-6GHz, enabling cross-band carrier aggregation combinations such as CA_n41A-n104A and CA_n78A-n104A.
Platform Capability: Built on the 3GPP Release 18 MediaTek T930 platform, the T930 enables a peak 5G downlink rate of up to 10Gbps.

Relying on the synergy between U6G and Sub-6GHz alongside cross-band carrier aggregation capabilities, the FG390 can fully utilize the continuous large bandwidth of U6G to boost network capacity. Combined with the mature coverage of Sub-6GHz, it balances high-speed transmission with service continuity.

Targeting the U6G deployment demands in markets like the Middle East, the FG390 can further simplify customers’ product development and market adaptation. It reduces the complexity of certification and mass production, thereby shortening the time-to-market for FWA devices such as CPEs, outdoor ODUs, and enterprise gateways.

Jointly Advancing U6G Implementation

Su Wenguang, General Manager of the Wireless Communications Business Unit at MediaTek, stated:
“The MediaTek T930 is built for next-generation FWA applications, providing an advanced platform foundation for high-speed wireless broadband devices. We are delighted to see Fibocom continually expand the FG390’s capabilities based on the T930. Both parties will further leverage the synergistic advantages of the chipset platform and module products to jointly drive innovation in the 5G-Advanced FWA industry.”

Liu Sunzhi, General Manager of the MBB Business Unit at Fibocom, noted:
“As U6G accelerates toward commercialization, operators and device manufacturers need to transform new spectrum capabilities into deployable FWA products more quickly. The FG390 continuously refines its spectrum adaptation and product capabilities to address this demand, helping customers lower the development complexity of next-generation FWA products and speed up market introduction. Moving forward, Fibocom will continue to collaborate with MediaTek and global industry partners to advance U6G technical verification and commercial applications.”

In the face of the ongoing global evolution of 5G-A, Fibocom will further improve its FWA product portfolio, providing operators and equipment manufacturers with wireless broadband solutions that offer greater evolutionary capabilities.

Fibocom Debuts 5G Smart Module SC153

As AI applications rapidly expand to edge devices, smart equipment is evolving from simple data connectivity to real-time interaction and intelligent experiences. This evolution demands higher standards for fast, stable, and low-latency wireless connection capabilities.

On October 13, NetworkX 2026 officially kicked off, where Fibocom showcased its SC153 5G smart module for the first time. Built on the Qualcomm Snapdragon™ Q-4390 processor, this product targets the demands of next-generation smart terminals for high-speed connectivity and complex application scenarios, providing global customers with a high-performance and flexibly developed 5G connectivity solution.

The 5G smart module is currently in the debugging phase and is scheduled to enter mass production in the fourth quarter of 2026.

High-Speed 5G Connectivity Unleashes Terminal Potential

With the continuous growth of applications like high-definition video transmission, industrial data acquisition, and smart device interconnection, terminals face stricter requirements for high-speed data transmission and stable network connections.

The Fibocom SC153 is designed with advanced 5G communication capabilities, supporting the 3GPP Release 16 standard and covering 5G NR Sub-6GHz and LTE multi-mode connectivity. This satisfies the network performance and deployment flexibility required by diverse application scenarios.

In terms of connection performance, the Fibocom SC153 module supports both 5G SA and NSA dual-mode network architectures. It can achieve a maximum downlink rate of up to 2.3Gbps in SA mode and up to 2.5Gbps in EN-DC mode, delivering stable and efficient data transmission for HD video, industrial equipment, and smart terminals.

Flexible Design Meets Diverse Terminal Demands

Faced with the rapid iteration of smart terminals, customers look beyond communication performance; they also require more flexible hardware design and software development capabilities.

Fibocom SC153 features an LGA package design, providing a rich array of interface resources including MIPI Display, MIPI Camera, USB 3.1, UART, I²C, and SD. It also flexibly supports various network configurations like WiFi 5, WiFi 6e, and WiFi 7 to fit different terminal form factors and design needs.

At the same time, the Fibocom SC153 supports the Android operating system environment, offering a more flexible platform foundation for customers carrying out software development, application expansion, and terminal customization.

Leveraging its high-speed connectivity and flexible development traits, the Fibocom 5G smart module will help customers build a new generation of wireless products tailored for smart terminals, industrial equipment, and high-speed data applications.

Quectel Launches SE505FE 5G Smart Module

Keeping pace with this industry trend, Quectel officially unveiled its new SE505FE series of 5G smart modules today. The series natively supports Android 16 and is powered by an octa-core processor and a high-performance GPU, highly integrating graphics rendering, 5G connectivity, and multimedia capabilities into a single module.

With highly competitive cost-effectiveness, it directly addresses the rigid demands for real-time processing performance and human-machine interaction in scenarios such as commercial retail and smart industry, providing an AIoT foundation solution for next-generation smart terminals that combines performance with deployment flexibility.

Precise positioning: Android 16 + high cost-effectiveness, lowering the barrier for smart terminal deployment

Previously, enabling 5G connectivity and Android-based interaction on IoT devices often required stacking three separate circuit boards—an AP motherboard, a communication module, and a multimedia processing unit—resulting in high costs and extremely complex designs. The Quectel SE505FE offers a more cost-effective integrated solution that resolves this hardware stacking challenge.

More powerful core

Built on the MediaTek MT8863T platform, it features an octa-core processor (2× Cortex-A76 @ 2.4 GHz + 6× Cortex-A55 @ 2.0 GHz) and a Mali-G57 GPU. Based on the Arm Valhall architecture, the GPU delivers excellent graphics processing and energy efficiency. Without the need for an external host controller, it can comfortably handle complex graphics rendering, 2K HD video encoding/decoding, and edge computing tasks, ensuring smooth human-machine interaction and accurate visual presentation on smart terminals.

Smarter system

Equipped with native Android 16, it integrates interaction, multimedia, and device security management capabilities. This not only shortens time-to-market but also meets the stringent requirements of payment and industrial devices for data encryption, firmware verification, and remote management through a system-level multi-layer security framework. It also supports cross-device collaboration, making it easy to connect data links across smart buildings and production lines.

For the global market, the series is available in four variants: SE505FE-EM (Europe, Middle East, Africa, South Asia, etc.), SE505FE-NA (North America and Latin America), SE505FE-CN (China), and SE505FE-WF (Wi-Fi and Bluetooth only), precisely matching carrier band requirements in different regions.

The module adopts a compact standard LGA package measuring 42.5 × 56.5 × 2.9 mm. Its slim and compact form factor makes it an ideal fit for space-constrained portable devices, wall-mounted digital signage, and compact smart gateways.

Comprehensive connectivity and practical multimedia capabilities form the core of smart terminals

The Quectel SE505FE packs a full suite of wireless connectivity into a compact footprint. For cellular connectivity, it supports 5G Sub-6 GHz bands, complies with the 3GPP Release 16 standard, supports 4×4 MIMO and dual-SIM dual-standby, and is backward compatible with LTE Cat 4, ensuring stable connections in complex environments.

On top of that, the Quectel 5G Smart module integrates Wi-Fi 5, Bluetooth 5.2, and quad-mode GNSS positioning (GPS/BDS/GLONASS/Galileo), truly realizing a “single-module-as-terminal” connectivity architecture.

On the multimedia side, which directly shapes user experience, the SE505FE is also well equipped: it supports camera input up to 32 MP at 30 fps and 2K video encoding/decoding at 30 fps. With complete audio input and output interfaces, it delivers clear visuals and smooth operation whether used for on-site recording by industrial inspection devices or for continuously playing promotional content on retail advertising displays.

Industrial-grade reliability and flexible interfaces for demanding scenarios

IoT devices often operate in harsh environments, and the SE505FE ensures stable 24/7 operation with industrial-grade reliability.

Wide temperature range

It supports an industrial-grade operating temperature range from -35°C to +75°C, maintaining stable performance whether deployed in cold outdoor environments or high-temperature factory facilities.

Ample storage

It comes standard with 4 GB LPDDR4X + 64 GB eMMC, with an optional 8 GB + 128 GB configuration (expandable up to 12 GB + 512 GB), and supports SD card expansion up to 2 TB, meeting high-volume local storage needs.

Rich interfaces

It provides USB 3.1, dual UART, 106 GPIOs, and multiple reusable interfaces including I2C, SPI, and I2S. Together with seven antenna interfaces, it covers the connectivity needs of most peripherals for industrial PDAs, smart gateways, in-vehicle devices, and more.

Certification-ready

It will support major global market access certifications including FCC, CE, and CCC, and the entire series complies with RoHS and REACH environmental standards, helping customers bring products to target markets quickly and efficiently.

Leveraging its strong processing performance, connectivity, and multimedia capabilities, the SE505FE can be widely applied across multiple industries:

Commercial retail: countertop POS terminals, smart POS systems, digital signage/advertising displays
Industrial and professional applications: handheld PDAs, tablets, smart two-way radios, audio/video recorders
Smart hardware: AR/VR devices, smart gateways, smart home products, smart wearables

From retail terminals to industrial production lines, and from smart cities to mobile mobility, the deep integration of 5G and Android is redefining the development paradigm for IoT devices. Going forward, Quectel will continue to expand its Android smart module portfolio, lowering design barriers and strengthening global support to help 5G IoT evolve from “usable” to “highly usable,” accelerating intelligent upgrades across industries.

Quectel Released Smart Module SE200ZC-AP for AI

From smart retail and service robots to dashcams and medical devices, AI vision is rapidly becoming a standard feature across various smart terminals. Deploying complex visual tasks—such as real-time recognition, object detection, and behavior analysis—places stringent demands on edge devices in terms of computing power, image quality, and power consumption. Striking the perfect balance among these three factors is the critical dividing line between a product that merely “works” and one that truly “excels.” Quectel’s newly launched SE200ZC-AP smart module is specifically designed to address this challenge.

Purpose-built for AI vision, the Quectel SE200ZC-AP is based on the Rockchip RV1126B/RV1126BJ platform. It seamlessly integrates 3 TOPS of NPU computing power, 4K ultra-HD encoding/decoding, and ultra-low power consumption into a compact form factor. It delivers high-performance, highly reliable edge AI solutions for scenarios including smart security, industrial vision, smart vehicles, service robots, medical imaging, and smart retail.

Lightweight Computing Foundation: Bringing Intelligence to the Edge
Lightweight, scenario-specific computing power is key to the rapid deployment of AI vision devices.

The Quectel SE200ZC-AP features a quad-core ARM Cortex-A53 CPU with a maximum clock speed of 1.6 GHz, integrated with a Neon acceleration engine and an FPU. This ensures an optimal balance of performance and energy efficiency, easily handling multitasking scenarios. Powered by a 3 TOPS NPU, it supports mixed-precision computing (INT4/INT8/INT16/FP16) and can smoothly run lightweight multimodal large models. Complex algorithmic inferences, such as facial recognition, object detection, behavior analysis, and audio parsing, are all completed locally on the device.

By pushing AI capabilities to the edge and performing inference locally, the Quectel smart module not only eliminates the risks of remote data transmission and safeguards user privacy but also minimizes response latency. This supports real-time intelligent decision-making, laying a solid foundation for vision applications in industrial and security sectors where real-time performance is paramount.

4K Ultra-HD Encoding & Decoding: Exceptional Frame-by-Frame Image Quality
Premium imaging is the cornerstone of AI vision terminals delivering real value.

Equipped with a high-performance multimedia processing engine, the SE200ZC-AP supports 4K@45fps H.265/H.264 encoding and 4K@30fps H.265/H.264 decoding. It also features dual parallel encoding capabilities (HEVC/JPEG and H.264/JPEG), allowing simultaneous output of multiple video streams. High-definition recording and real-time snapshot capture are effortlessly handled by a single hardware module.

In terms of image processing, the module supports 8MP AI-ISP and 12MP HDR ISP, offering outstanding spatial noise reduction and image enhancement. Notably, the AI-ISP utilizes dedicated hardware for independent processing, consuming zero NPU resources. This not only guarantees superior image quality but also reserves ample computing power for complex vision applications, perfectly balancing image fidelity with AI inference.

Its image capture capabilities are equally impressive, supporting up to five cameras with a maximum resolution of 12MP@30fps per channel. It features two 4-lane MIPI CSI interfaces that can be flexibly split into multiple 2-lane channels, along with one general-purpose DVP interface. This fully accommodates multi-camera scenarios such as multi-sensor stitching and panoramic surround views.

Ultra-Low Power Design: Tailored for Battery-Powered Applications
Beyond robust computing and high-definition imaging, battery life directly determines the practical viability of portable and outdoor devices.

The Quectel SE200ZC-AP adopts an ultra-low power design and features AOV3.0 low-power video recording technology. With a storage configuration of 1 GB LPDDR4x + 64 GB eMMC, its sleep current drops to an impressive 0.85 mA. Additionally, the module supports fast boot and low-power pre-recording functions, significantly reducing standby power consumption. This makes it particularly well-suited for battery-powered products like portable medical devices, wireless vehicle equipment, and inspection robots.

Comprehensive Hardware & Software Compatibility: Accelerating Time-to-Market
To meet the diverse needs across various industries, the SE200ZC-AP offers a robust support system encompassing software, hardware, and peripheral expansion. This effectively simplifies the development process and helps customers shorten their product launch cycles.

On the software front, the module is deeply compatible with Linux (Kernel 6.1) and Debian 12 operating systems, providing efficient support for application development and iterative upgrades across diverse scenarios.

On the hardware front, the SE200ZC-AP utilizes an LCC+LGA package with an ultra-compact footprint of just 40.0 × 40.0 × 2.9 mm, allowing for seamless integration into space-constrained smart terminals.

Furthermore, the module is equipped with a rich array of peripheral interfaces, including MIPI_DPHY/DVP/LCDC, MIPI CSI, SAI, PDM, DSM, ADC, I2C, GMAC, USB 3.0/2.0, SPI, CAN FD, SDIO, and UART. These enable rapid expansion of functions such as image capture, screen display, audio input, and local storage.

Additionally, the module supports external connection to Quectel’s 4G, Wi-Fi 6, audio, and GNSS modules. This provides a one-stop solution for the entire “perception-computation-communication” chain, ensuring seamless coordination across local data collection, AI analysis, wireless transmission, and location tracking.

Quectel Launches the SP805FL Series AI Computing Modules

On June 25, during the MWC Shanghai 2026 exhibition, Quectel officially unveiled its first flagship AI computing module series based on the MediaTek platform: the SP805FL series (available in WF and AP variants). This launch establishes a crucial pathway for integrating advanced AI computing power into end-device applications across various industries.

Equipped with MediaTek’s flagship Genio Pro 5100 chip, this product seamlessly combines robust computing power, outstanding graphics and imaging capabilities, and a rich array of interfaces. It fully supports the deployment of physical AI, on-device large language models (LLMs), and multimodal interactions. The module is widely applicable to high-end scenarios such as robotics, smart helmets, 3D scanning/printing, computing boards, smart retail, large-screen displays, and smart homes, empowering customers to seize the initiative in the wave of edge computing and AI-native applications.

Flagship CPU Architecture: Effortlessly Handling Complex Tasks at the Edge

The Quectel SP805FL features a full octa-core Arm v9.2 architecture, comprising 1x Cortex-X925, 3x Cortex-X4, and 4x Cortex-A720 cores. Built on a 3nm manufacturing process, it effortlessly manages multitasking and complex computations.

In practical applications, even when a robot simultaneously performs navigation computing, visual recognition, and voice dialogue, it maintains smooth responsiveness, eliminating lag and latency. For devices like industrial tablets and 3D scanners that require real-time processing of massive amounts of data, its massive performance headroom makes “millisecond-level reconstruction” a reality.

50+ TOPS NPU: Enabling Fully Independent On-Device AI Operation

The successful deployment of on-device AI relies heavily on dedicated AI computing power. The Quectel SP805FL integrates MediaTek’s 8th-generation NPU, delivering over 50 TOPS of AI computing power. It supports full-precision computing (INT4/INT8/INT16/FP16), enabling the efficient deployment of various AI large models. With multimodal interaction and scene perception capabilities, it provides robust support for the large-scale deployment of on-device AI.

Leveraging its powerful AI performance, devices can independently handle complex AI inference tasks. Whether it is a smart helmet used for underground or field operations, service robots, or smart retail terminals, they can operate stably in offline or congested network environments, respond to commands in milliseconds, and simultaneously safeguard data privacy.

All-Scenario Multimedia and Connectivity: Meeting Rigorous Industrial Demands

In terms of multimedia capabilities, the SP805FL supports simultaneous multi-screen display and 8K encoding/decoding, catering to scenarios with stringent requirements for image quality and multi-screen display, such as 3D scanning/printing, commercial large screens, and smart retail.

Regarding wireless connectivity, the Quectel SP805FL-WF variant is equipped with Wi-Fi 7 and Bluetooth 6.0, enabling high-speed, stable wireless data transmission. It also integrates multi-constellation GNSS positioning, compatible with GPS/BDS/GLONASS/Galileo/QZSS/NAVIC, and supports L1+L5 dual-frequency positioning, providing precise positioning services for intelligent transportation and logistics platforms.

Designed for industrial-grade scenarios, the product supports a wide operating temperature range of -35°C to +75°C, making it capable of handling various complex industrial environments. Global certifications, including CE, RCM, FCC, and IC, are currently in progress to meet global compliance deployment requirements in the future.

Massive Interfaces for Flexible Expansion: Simplifying Development, Reducing Costs, and Boosting Efficiency

The SP805FL offers an interface lineup that far exceeds conventional smart modules, boasting exceptional scalability. In addition to traditional interfaces such as MIPI DSI/CSI, I2S, UART, SDIO, I2C, and SPI, it supports multiple PCIe lanes and dual Gigabit Ethernet ports, significantly enhancing its flexibility and adaptability in on-device AI applications.

Adopting a compact LGA package design, the module allows high computing power to be seamlessly integrated into smaller end products. Developers do not need to add external interface or computing chips; a single module can satisfy most device connectivity requirements, effectively simplifying hardware design and shortening R&D cycles.

The launch of the Quectel SP805FL marks a critical leap for smart modules, transforming them from mere “data transmission pipelines” into “independent on-device decision-making units.”

Quectel’s 5G+AI Smart Module AS830M Passes AEC-Q104 Test

Recently, Quectel’s professional-grade AS830M 5G+AI cabin-connectivity integrated smart cockpit module has officially passed the AEC-Q104 automotive-grade qualification test. This milestone signifies that the AS830M fully meets the stringent requirements of top-tier global automotive electronics supply chains in System-in-Package (SiP) design, multi-chip thermal management, signal integrity, and end-to-end automotive-grade quality management.

The Quectel AS830M’s successful completion of this standard thoroughly validates its stability, safety, and durability in complex in-vehicle environments, earning authoritative endorsement. Furthermore, the module has secured essential domestic certifications, including NAL, CCC, and SRRC, ensuring it possesses all necessary market access qualifications.

In terms of performance, the Quectel AS830M module is built on the Qualcomm QCM8538 platform and features a 4nm process chip, seamlessly integrating 5G connectivity, multi-screen 8K display interaction, and edge AI capabilities. Powered by an 8-core CPU delivering up to 200K DMIPS, its dedicated NPU provides 48 TOPS of comprehensive AI computing power. This enables the smooth execution of complex AI tasks, including edge large language models, machine vision, and multimodal interaction. The Quectel 5G AI module also supports 6-screen synchronization, 8K@30 display output, and the connection of up to 17 cameras. Additionally, its highly integrated SiP packaging and LXC container isolation technology deeply merge communication and cockpit functions without interference, directly addressing the fragmentation and latency pain points of traditional cockpit systems.

For automakers and Tier 1 suppliers, the significance of the AS830M passing the AEC-Q104 test goes far beyond mere “compliance”; it delivers a truly “plug-and-play,” automotive-grade, highly integrated cabin-connectivity solution. Under the traditional model, automakers had to conduct module-level reliability testing independently, a process often characterized by long cycles, high costs, and significant risks. The AS830M 5G AI Module fundamentally transforms this landscape by alleviating customers’ redundant testing burdens, significantly reducing system failure risks and supply chain management costs, and effectively shortening the time-to-market for OEM production, thereby accelerating the safe and rapid deployment of premium smart cockpits.

Currently, the Quectel AS830M has been selected by multiple leading domestic automakers and is accelerating toward mass production. Looking ahead, Quectel will continue to advance AEC-Q104 compliance testing for cabin-connectivity modules with varying computing specifications, supporting domain controller convergence in the automotive industry and providing customers with an expanded portfolio of premium cabin-connectivity solutions.

Quectel AR588MA 5G-A Automotive-Grade Module Empowers TBox-P Platform

Recently, Jingwei Hirain’s TBox-P platform, built on Quectel’s automotive-grade 5G-A module AR588MA, has officially entered mass production. This provides full-link support for intelligent connected vehicles—from the communication core to the in-vehicle system—helping drive large-scale commercial adoption of advanced intelligent driving. The Jingwei Hirain TBox-P platform powered by Quectel’s AR588MA has already secured mass production design wins from multiple L4 autonomous driving customers.

What exactly does the powerful AR588MA “core” bring to the TBox-P platform?

Say Goodbye to Weak Signal Anxiety: AI-Powered Intelligent Network Selection Lets Vehicles Proactively “Choose the Signal”

Underground garages, tunnels, mountainous areas, urban canyons… the in-vehicle network environment is complex and ever-changing. Traditional in-vehicle communication can only “passively wait for a signal,” leading to poor experience and insufficient stability in weak signal areas.

The Quectel AR588MA breaks this deadlock. It features an embedded AI vehicle network engine with three key capabilities: scene recognition, intelligent switching, and signal compensation. It not only senses vehicle speed, location, and environment in real time but also autonomously learns base station handover patterns. When a vehicle enters a weak signal area like an underground garage, the AI engine predicts this in advance and dynamically optimizes network selection. Combined with an adaptive antenna compensation algorithm, it significantly enhances signal penetration in weak signal areas, achieving a qualitative leap from “passive connection” to “active optimization.”

5G-A Onboard: Greater Bandwidth, Faster Response, Stronger Capabilities

The AR588MA module is built on MediaTek’s 5G-A platform MT2739 and complies with the 3GPP R18 standard. It delivers a peak downlink rate of up to 9.0 Gbps and a peak uplink rate of over 2.5 Gbps. Compared to traditional 5G, this is not just a doubling of numbers—it’s a leap in experience.

Simply put, under ideal network conditions, downloading an HD movie in the cabin takes just a few seconds, and communication between the vehicle, the cloud, and roadside units happens with near-zero latency. This combination of ultra-high bandwidth and ultra-low latency paves the way for high-speed data pathways for advanced driver assistance and vehicle-to-everything (V2X) applications, making intelligent driving systems faster and safer.

No Single Point of Failure: DSDA Dual SIM Dual Active Creates “Double Insurance”

Advanced intelligent driving cannot rely on a single network. If the communication link is interrupted, the consequences could be disastrous. Ordinary “dual SIM dual standby” only supports both SIMs in standby simultaneously—when one card is on a call, data on the other card is interrupted. The DSDA (Dual SIM Dual Active) supported by the AR588MA allows both SIM cards to operate independently and concurrently without interfering with each other, truly enabling simultaneous network connectivity.

Even if one carrier’s network is congested or a base station fails, the other network seamlessly takes over, ensuring core services such as remote monitoring, NG-eCall emergency calling, and vehicle dispatching remain uninterrupted. This true dual-network redundancy builds an unbreakable communication safety foundation for L4 autonomous driving.

High Reliability & Easy Compatibility: Fast Upgrades, Global Availability

The reliability of in-vehicle products directly affects driving safety. The Quectel 5G Module strictly follows automotive-grade design standards, meets AEC-Q100 Grade 2 requirements and ISO 21434 cybersecurity standards, and operates stably under extreme temperatures (-40°C to +105°C) and vibrations. It also supports NG‑eCall emergency calling and L1+L5 dual-band GNSS high-precision positioning, providing dual benefits for vehicle safety and precise navigation.

In terms of upgrades and adaptation, the AR588MA features a highly compatible design. It is pin-to-pin compatible with Quectel’s existing automotive 5G series modules on the hardware side, and uses the QuecOpen architecture on the software side. Traditional 5G projects can smoothly upgrade to 5G-A without starting from scratch, greatly shortening development cycles and reducing costs. Additionally, the module supports global frequency bands, meeting the mass production needs of automakers in different regions and accelerating global deployment.

SIMCom Partners with Skylo to Initiate NTN Certification for SIM7070G-HP-S Module

SIMCom has officially announced its collaboration with Skylo, a pioneer in non-terrestrial network (NTN) communications, to commence the NTN certification process for its SIM7070G-HP-S module.

The SIMCOM SIM7070G-HP-S module, which is now undergoing certification, is an NTN module independently developed by SIMCom specifically for satellite IoT scenarios. It supports the 3GPP Release 17 5G IoT-NTN standard and is compatible with global satellite networks. Featuring an LCC+LGA package, the SIMCOM 5G module offers extensive interfaces and strong scalability. Its compact dimensions of 24×24×2.3mm allow for flexible integration into the design of various miniaturized IoT devices.

Leveraging SIMCom’s mature low-power technology, the SIM7070G-HP-S can extend device battery life to up to 10 years through Power Saving Mode (PSM) and extended Discontinuous Reception (eDRX) technologies. It offers coverage superior to GSM and is well-suited for satellite IoT communication scenarios that require low latency and low throughput.

The initiation of the NTN certification for the SIM7070G-HP-S module marks a deepening of the existing partnership between SIMCom and Skylo and represents a significant step in SIMCom’s strategic expansion into the satellite IoT sector. By combining its strengths in module R&D, manufacturing, and global presence with Skylo’s satellite network resources, SIMCom aims to transcend the limitations of traditional terrestrial networks and provide seamless, reliable connectivity for customers worldwide.

The SIM7070G-HP-S is suitable for a wide range of applications, including asset tracking, smart metering, and remote monitoring. It effectively fills connectivity gaps in remote areas, further expanding the application scope of SIMCom’s product portfolio. Moving forward, SIMCom will work with Skylo to accelerate the certification process, promote the global deployment of their solutions, achieve ubiquitous IoT coverage, and foster the high-quality development of the satellite IoT industry.

Fibocom 5G Module Fx550 Officially Enters Global Mass Production

On March 31, Fibocom announced that its 5G module Fx550, developed based on Samsung’s Exynos Modem platform (including the LGA-packaged FG550 and M.2-packaged FM550), has officially entered mass production. The launch and mass production of this product not only mark the in-depth implementation of the strategic cooperation between Fibocom and Samsung but will also provide connection solutions with ultimate performance and excellent reliability for global 5G FWA (Fixed Wireless Access) and the broader IoT fields, such as wireless landlines, MiFi, and industry gateways.

A Powerful Alliance: Building New Heights in 5G Connectivity

This mass production is a core achievement of the deep strategic cooperation between Fibocom and Samsung. Samsung’s 5G chip solutions have been verified by massive shipments in the global market and are known for their high stability, excellent RF performance, and extensive global compatibility. Through technical integration, both parties aim to leverage their respective advantages in underlying chip architecture and industry application accumulation to jointly promote the deep penetration and popularization of 5G technology in vertical industries worldwide.

Jungwon Lee, Executive Vice President of Samsung Electronics and Head of the System LSI Modem R&D Team, stated, “Samsung is pleased to deepen its strategic cooperation with Fibocom to jointly advance next-generation 5G connectivity solutions for the global market. The successful mass production of the Fibocom 5G module confirms our shared commitment to innovation, performance, and reliability in providing cutting-edge connectivity for Fixed Wireless Access (FWA) and broadband IoT applications. In the AI era, we are jointly building the cornerstone of a smarter, more interconnected industry.”

Tao Xi, Vice President of Fibocom’s Wireless Solutions Business Group and General Manager of the MBB Business Unit, said, “We are very honored to have reached an exclusive cooperation agreement with Samsung Electronics, to be the first to achieve large-scale mass production, and to have our product validated by the market in the broader IoT sector. With the simultaneous advancement of multiple regional versions of the Fx550, including EAU, JP, and MEA, Fibocom will help global enterprises achieve ‘acceleration’ in the high-speed connectivity race.”

Core Advantages: Fx550 Empowering Digital Transformation

The Fx550 module leverages the Samsung Exynos Modem platform to set a new industry benchmark in advanced processing, transmission standards, and networking flexibility.

Supports Rel.16 Standard, Empowering High-Reliability Communication
The Fx550 is fully compatible with the 3GPP Rel.16 standard. With its low latency and high bandwidth characteristics, it precisely meets the demands of the FWA and broader IoT fields for real-time data interaction and large-capacity transmission.
Multi-Carrier Aggregation Technology, Breaking Through Speed Limits
In SA mode, the Fx550 supports up to NR 5CC carrier aggregation (200MHz bandwidth), with a peak downlink speed of 4.67Gbps. Its differential capability to flexibly and efficiently aggregate discrete spectrum within a narrow RF bandwidth provides unique commercial value for global operators to enhance user experience, ultimately empowering industry and home customers. In NSA mode, the Fx550 supports up to NR 2CC + LTE 5CC aggregation, with downlink speeds reaching as high as 6.47Gbps. In LTE networks, the Fx550 supports up to Cat.20, perfectly covering global 4G network capabilities. Breakthroughs in multi-carrier aggregation technology can effectively help operators improve spectrum utilization and ensure ultra-fast connections in complex network environments.
Open Architecture, Optimizing System Costs
The Fx550 adopts a high-performance Modem architecture and has completed in-depth adaptation with mainstream industry AP (Application Processor) solutions, such as Broadcom and Realtek. This deep compatibility gives developers more flexible design choices, allowing for optimal control of development costs while ensuring overall device performance. It also provides global ODMs with diversified product choices, helping end customers create product differentiation. In addition, the Fx550 is compatible with operating systems such as Linux, OpenWRT, RDK-B, and PrpIOS, which facilitates the rapid development of FWA devices, reuse of software assets, and quick upgrades to the latest Wi-Fi Mesh versions, improving the Wi-Fi compatibility of CPE devices.

Global Layout: Multiple Versions Covering Mainstream Markets

To meet the network access standards of different regions, the Fx550 has simultaneously launched multiple regional versions, including FG550-EAU(Europe/Asia/Australia), FM550-EAU (Europe/Asia/Australia), FG550-JP (Japan), FG550-NA (North America), and FG550-MEA (Middle East/Africa). Currently, the Fx550 can provide product services and technical support for multiple regions around the world.

The mass production of the Fx550 is a key step for Fibocom in building a global 5G ecosystem. In the future, Fibocom will continue to work with global industry partners like Samsung to delve deeper into 5G technology innovation. Through continuously iterated connectivity solutions, it will accelerate the prosperity and popularization of 5G FWA and IoT applications worldwide.

Quectel Launches New-Generation AI Computing Smart Module SH603FC

On March 11, during embedded world 2026, Quectel announced the official launch of its new-generation SH603FC series, an AI computing smart module based on MediaTek’s G520 chip platform.

As Quectel’s first high-performance module to feature this platform, the SH603FC series offers three variants: Wi-Fi 6, Wi-Fi 6E, and AP. It is designed to create an integrated intelligent hardware foundation for diverse scenarios such as industrial applications, robotics, smart retail, in-vehicle aftermarket entertainment devices, and edge computing, empowering various industries to achieve digital transformation and intelligent upgrades.

Robust Performance: Building the Cornerstone of Universal Intelligence

Quectel SH603FC series incorporates a CPU architecture featuring A78 + A55 cores, manufactured using TSMC’s 6nm process. It integrates a high-performance AI processing unit, enabling efficient on-device execution of complex AI model operations like facial recognition, product detection, and behavior analysis. This essentially equips terminal devices with a “smart brain,” facilitating a leap from passive response to proactive thinking.

This capability for “proactive thinking” is reshaping operational processes across industries:

On industrial production lines, real-time defect detection can immediately identify faulty products, significantly improving yield rates and efficiency.
For delivery robots, intelligent environmental perception allows for rapid identification of obstacles and path changes, enabling smoother and safer autonomous operation.
In smart stores, local analysis of foot traffic and customer behavior not only reduces reliance on cloud bandwidth but also ensures the privacy and security of commercial data from the source.

Dual-Screen Display: Unleashing Unlimited High-Definition Interaction

The Quectel AI module is not only equipped with a “smart brain” capable of handling complex AI computations but also possesses “sharp eyes” for capturing high-definition visuals. Its multimedia processing capabilities are particularly impressive, with the dual-screen display function precisely addressing the “one-device, multiple-screens” demands in sectors like commercial displays, in-vehicle aftermarket entertainment, and self-service kiosks. Through interface multiplexing solutions such as MIPI, eDP, and DP, the series supports dual-screen display at resolutions up to 2560×1600 at 60fps. This not only reduces hardware BOM costs but also expands the dimensions of interaction.

The flexible “one-chip, dual-screen” architecture elevates device interaction experiences to a new level.

On a vending machine, the main screen can loop 4K product advertisements, while the secondary screen displays real-time transaction QR codes and inventory information, achieving efficient synergy between advertising and transactions.
For smart payment terminals, the staff screen handles checkout operations, while the customer screen clearly shows the purchase details and promotional offers, enhancing transaction transparency and the consumer experience.
In in-vehicle aftermarket systems, the central control screen provides the driver with real-time information like navigation and vehicle status, while a screen for the passenger or a roof-mounted display can be used freely for entertainment, balancing driving safety with passenger experience.

Versatile Adaptability: Excelling in Diverse Application Environments

Leveraging its robust comprehensive performance and rich interface resources (such as PCIe, USB, RGMII, etc.), the SH603FC series has become a core driver for intelligent upgrades across multiple fields, injecting powerful momentum into the digital transformation of various industries.

In the industrial sector, it supports a wide operating temperature range from -35°C to +75°C, providing robust AI computing power and stable operation for industrial tablets and control equipment, facilitating real-time production data collection and analysis, and advancing the implementation of Industry 4.0.
In the smart retail sector, it empowers smart vending machines and self-checkout systems with intelligent payment processing and real-time inventory monitoring, making store operations more efficient and services more attentive.
In the commercial display sector, its high-definition display capabilities make content dissemination on advertising players and large-screen terminals more engaging, effectively enhancing brand presentation and communication efficiency.

Furthermore, the module features a compact LGA+LCC form factor and fully supports multiple operating systems, including Android 15, Yocto, and Ubuntu. It can be flexibly adapted to various devices such as robots, in-vehicle aftermarket entertainment systems, smart intercom recorders, and smart home appliances. It provides a one-stop hardware solution to meet the intelligent upgrade needs of different industries and scenarios.

Currently, samples for the SH603FC series are available for testing. Customers are welcome to inquire and collaborate to unlock the boundless possibilities of edge intelligence together.