Quectel Launched New 5G Sub-6GHz Smart Module SG520B

On December 13th, Quectel, a leading global IoT overall solution provider, announced the official launch of its new generation 5G Sub-6GHz smart module series, SG520B.


The Quectel SG520B  series supports various connectivity technologies including 5G, Wi-Fi 6E, and Bluetooth, with powerful multimedia capabilities. It is poised to directly meet the growing market demands for edge computing, graphic processing, and multimedia capabilities in vertical industries such as smart gateways, smart industry, smart retail, and handheld PDAs.

In terms of network connectivity, the Quectel SG520B series emphasizes comprehensiveness, featuring the latest Android 13 operating system and comprehensive coverage of 5G NSA/SA modes, Wi-Fi 6E, and Bluetooth connectivity.


On one hand, the Quectel SG520B series complies with the 3GPP Release 16 standard, backward compatible with LTE Cat 15/3G networks to ensure the stability of terminal network environments. Additionally, to minimize errors and optimize data speed, the SG520B series also provides 5G and LTE multiple-input multiple-output (MIMO) technology, allowing the receiver to simultaneously use multiple antennas on the same frequency band to enhance data transmission efficiency and quality. Excellent cellular network connectivity fundamentally empowers the SG520B series to meet the strict requirements of the current market for high-speed wireless communication, low latency, and broad connectivity.

Furthermore, the Quectel SG520B series also supports 2×2 MIMO Wi-Fi 6E, Wi-Fi dual-band synchronization (DBS), and other connectivity methods, with a peak data rate of up to 3.6Gbps. It is equipped with Bluetooth 5.2 and an integrated GNSS receiver configuration including GPS/GLONASS/BDS/Galileo/NavIC/QZSS/SBAS, simultaneously meeting the requirements for fast and accurate positioning and multiple network connection methods in environmental applications.


In terms of multimedia functionality, the Quectel SG520B series supports single-screen and multi-camera setups, as well as 1080p@60 fps video encoding and decoding capabilities, making it an ideal choice for industrial and consumer applications with high multimedia requirements, such as smart gateways, CPE, Mi-Fi devices, POS terminals, cash registers, dashcams, digital signage, and industrial PDAs. Additionally, the series integrates a rich set of interfaces including LCM, camera, touchscreen, UART, USB, I2C, and I2S, greatly expanding its application range in the IoT field and leaving room for performance expansion in the later stages.



To adapt to the differentiated demands of various regional markets globally, the SG520B series will launch four sub-models, including SG520B-CN for the domestic market, SG520B-EM for Europe, Asia-Pacific, Latin America, and Japan, SG520B-NA tailored for the North American region, and the Wi-Fi & Bluetooth version SG520B-WF.


In terms of package design, it adopts the classic LGA method, compatible with Quectel SG560D 5G smart module, and is expected to be stable in supply until 2030, making the SG520B series an outstanding all-around representative of Quectel 5G smart modules.

Fibocom Released 5G Smart Module SC171 at MWC2024

During the Mobile World Congress 2024, Fibocom announced: In addition to supporting the Android operating system, the 5G smart module SC171 is also compatible with Linux and Windows systems, helping more smart terminal customers iterate products quickly and expanding the coverage of intelligent applications.


The Fibocom SC171 series is designed based on the Qualcomm® QCM6490 IoT solution, featuring an 8-core high-performance processor (1 large core with a frequency of 2.7GHz + 3 large cores with a frequency of 2.4GHz + 4 small cores with a frequency of 1.95 GHz). The SC171 series integrates a high-performance GPU and high-speed HVX technology for image data processing. It supports dual-screen display at 2520×1080@60fps, and can simultaneously operate up to 5 cameras with powerful multimedia playback capabilities. With a computing power of up to 12TOPS, the SC171 efficiently processes data, integrates various AI algorithms, and helps terminals achieve edge computing and AI features.


In addition to being compatible with the smart Android operating system, the Fibocom 5G smart module SC171 is also pre-equipped with Linux and Windows systems, making it expandable to a more diverse range of IoT application terminals, such as smart cameras, industrial control machines, cash registers, vending machines, robots, and in-car devices.



In terms of communication, the SC171 series supports 5G/Wi-Fi 6 wireless communication, providing more flexible network access. As a global version of the 5G smart module, the SC171-GL is compatible with mainstream 5G frequency bands worldwide, meeting the different frequency band requirements of different terminals for 5G and helping customers quickly deploy in the global market. In terms of peripherals, the SC171 has various expansion interfaces such as dual USB, dual PCIe, MIPI, UART, SPI, I2C, making it the preferred solution for smart IoT terminals.



Zhao Yi, Vice President of Fibocom’s MC Division, said: The “5G+AI” joint empowerment drives the intelligent transformation of the industry, bringing revolutionary improvements to end-to-end deployment automation. The SC171, with a computing power of up to 12TOPS, supports mainstream operating systems such as Android, Linux, and Windows, and can be applied to a wider range of IoT scenarios, promoting the development of intelligent edge computing.



Quectel Released Rx255G Series RedCap with MediaTek

On February 22nd, Quectel, a leading global provider of IoT overall solutions, announced the upcoming launch of the Rx255G series 5G RedCap modules. This series of modules not only features key functions of 5G NR such as high reliability, low latency, and network slicing but also boasts advantages like compact design and ultra-low power consumption. It achieves a fine balance between cost, size, and performance, providing added momentum to the accelerated popularization of lightweight 5G.


RedCap, also known as Reduced Capability, is a lightweight technology introduced by 3GPP in the 5G Release 17 phase, representing a new technical standard protocol. This technology integrates 5G’s low latency, high reliability, and network slicing features into a more cost-competitive lightweight architecture. For applications requiring 5G features but not necessarily high data rates and large bandwidth, RedCap technology offers an economical and efficient solution.

Low Power Consumption, High Performance, and Competitive Cost Highlights


The MediaTek T300 series 5G RedCap platform embedded in the Rx255G series modules features MediaTek’s 5G RedCap UltraSave functionality, reducing power consumption by 60% compared to existing 4G IoT modules. Compared to 5G Enhanced Mobile Broadband (eMBB) modems, power consumption is reduced by 70%. Additionally, when enabling R17 power-saving features, an extra 10% power saving is achieved.


The Rx255G series supports 5G Standalone (SA) and LTE Cat 4 dual-mode. It supports 20MHz bandwidth, 256QAM/64QAM modulation, with maximum downlink and uplink speeds reaching 220 Mbps and 121 Mbps respectively. Additionally, this series of modules supports GNSS positioning and other functions.


Norbert Muhrer, President and Chief Sales Officer of Quectel, stated: “We are pleased to once again bring new 5G RedCap module products to the global market. For IoT applications, the Rx255G series RedCap modules not only realize the key functions of 5G NR but also avoid high power consumption and costs, achieving a fine balance in all aspects and providing better support for a wide range of scenarios that require ultra-reliable low-latency communication (URLLC) and network slicing.”


Evan Su, General Manager of MediaTek’s Wireless Communication Business Unit, said: “The T300 series is the world’s first 6nm RF SoC single-chip solution that supports RedCap. RedCap technology is a key enabler for driving the popularization of 5G, empowering our customers with optimized components and enabling various applications to access 5G networks at more competitive costs.”


Compatible Design, Widespread Applications


In terms of external design, the Rx255G series offers multiple packaging options, including LGA, M.2, and Mini PCIe, providing various interfaces including USB 2.0 and PCIe 1.0. Additionally, this series of modules is compatible with Quectel’s Cat 4 modules EG2x and EC2x series, offering customers a more expedited solution for migrating from Cat 4 to 5G.


The Rx255G series is highly suitable for applications such as smart grids, video networking, connected vehicles, POS terminals, industrial automation, and FWA (Fixed Wireless Access).


The Quectel 5G modules can be used together with a variety of Quectel antenna products, allowing end customers to purchase antennas tailored to their actual application scenarios, thus shortening the time to market for products.

Fibocom Released New 5G RedCap Module FM330 at MWC 2024

During the Mobile World Congress MWC 2024, Fibocom released the RedCap module FM330 series based on the MediaTek T300 platform, accelerating the prosperity of 5G-A. The Fibocom FM330 series and its solutions adopt the globally advanced RedCap scheme to meet the high-energy efficiency requirements of mobile broadband and industrial interconnection.


The Fibocom FM330 series adopts the world’s first 6nm process and integrated RF single-chip RedCap solution (RFSOC) MediaTek T300 development, and simultaneously launches multi-scenario solutions. The MediaTek T300 integrates a single-core Arm Cortex-A35 CPU in a compact area, further reducing power consumption and streamlining size.



The new Fibocom 5G module complies with the 3GPP R17 evolution standard and has excellent energy efficiency, enhanced network coverage, and low latency characteristics. In the Sub-6GHz frequency band, the maximum transmission bandwidth of the FM330 series module is reduced to 20MHz, and the transmit and receive antennas are trimmed to 1T2R, supporting more global 5G mid-low frequency bands including n79. Thanks to the maximum modulation capability of uplink and downlink 256QAM, the downlink throughput of the FM330 series reaches up to 227Mbps, and the uplink throughput reaches 122Mbps. The FM330 series adopts the M.2 packaging method of 30mm*42mm, compatible with the Fibocom LTE Cat.6 module FM101 series, facilitating the smooth iteration of existing 4G terminals to 5G.



During the conference, Fibocom demonstrated the RedCap Dongle solution based on the FM330 series, flexibly meeting the mobile broadband application needs of global customers. The plug-and-play FM330 series RedCap Dongle solution is compatible with various operating systems, including Windows, Linux, Android, etc., enabling users to enjoy 5G networks anytime, anywhere. The FM330 series RedCap Dongle solution is connected to the host computer through a standard USB interface, suitable for industrial equipment such as desktops, laptops, tablets, fixed-mobile convergence terminals, drones, industrial control computers, etc., with networking needs.



The 5G RedCap module FM330 series and solutions will further accelerate the evolution of terminals such as Dongle, CPE, PC, and IPC to 5G-A, promote 5G achieving ten-gigabit downstream, gigabit upstream, intrinsic intelligence, and advance the integration innovation of 5G with perception, AI, computing power, and new generation information technology.




Tao Xi, Vice President of Fibocom MBB Business Unit, said: RedCap is a key technology driving the commercialization of 5G, helping FWA applications extend to FWA-Lite entry-level, accelerating the deep penetration of 5G into households, enterprises, and outdoor third spaces. Fibocom, in collaboration with MediaTek, globally launched the module FM330 series and solutions based on the T300 platform, helping operators enter the new era of 5G-A, and providing the market with one-stop, diversified, and high-performance RedCap Dongle, Hybrid CPE, and other solutions. In the future, Fibocom will continue to maintain close cooperation with MediaTek, break through the boundaries of 5G smart interconnection applications, and achieve long-term win-win cooperation between the two parties.