5G Cellular Module Archives

Quectel Released Smart Module SE200ZC-AP for AI

From smart retail and service robots to dashcams and medical devices, AI vision is rapidly becoming a standard feature across various smart terminals. Deploying complex visual tasks—such as real-time recognition, object detection, and behavior analysis—places stringent demands on edge devices in terms of computing power, image quality, and power consumption. Striking the perfect balance among these three factors is the critical dividing line between a product that merely “works” and one that truly “excels.” Quectel’s newly launched SE200ZC-AP smart module is specifically designed to address this challenge.

Purpose-built for AI vision, the Quectel SE200ZC-AP is based on the Rockchip RV1126B/RV1126BJ platform. It seamlessly integrates 3 TOPS of NPU computing power, 4K ultra-HD encoding/decoding, and ultra-low power consumption into a compact form factor. It delivers high-performance, highly reliable edge AI solutions for scenarios including smart security, industrial vision, smart vehicles, service robots, medical imaging, and smart retail.

Lightweight Computing Foundation: Bringing Intelligence to the Edge
Lightweight, scenario-specific computing power is key to the rapid deployment of AI vision devices.

The Quectel SE200ZC-AP features a quad-core ARM Cortex-A53 CPU with a maximum clock speed of 1.6 GHz, integrated with a Neon acceleration engine and an FPU. This ensures an optimal balance of performance and energy efficiency, easily handling multitasking scenarios. Powered by a 3 TOPS NPU, it supports mixed-precision computing (INT4/INT8/INT16/FP16) and can smoothly run lightweight multimodal large models. Complex algorithmic inferences, such as facial recognition, object detection, behavior analysis, and audio parsing, are all completed locally on the device.

By pushing AI capabilities to the edge and performing inference locally, the Quectel smart module not only eliminates the risks of remote data transmission and safeguards user privacy but also minimizes response latency. This supports real-time intelligent decision-making, laying a solid foundation for vision applications in industrial and security sectors where real-time performance is paramount.

4K Ultra-HD Encoding & Decoding: Exceptional Frame-by-Frame Image Quality
Premium imaging is the cornerstone of AI vision terminals delivering real value.

Equipped with a high-performance multimedia processing engine, the SE200ZC-AP supports 4K@45fps H.265/H.264 encoding and 4K@30fps H.265/H.264 decoding. It also features dual parallel encoding capabilities (HEVC/JPEG and H.264/JPEG), allowing simultaneous output of multiple video streams. High-definition recording and real-time snapshot capture are effortlessly handled by a single hardware module.

In terms of image processing, the module supports 8MP AI-ISP and 12MP HDR ISP, offering outstanding spatial noise reduction and image enhancement. Notably, the AI-ISP utilizes dedicated hardware for independent processing, consuming zero NPU resources. This not only guarantees superior image quality but also reserves ample computing power for complex vision applications, perfectly balancing image fidelity with AI inference.

Its image capture capabilities are equally impressive, supporting up to five cameras with a maximum resolution of 12MP@30fps per channel. It features two 4-lane MIPI CSI interfaces that can be flexibly split into multiple 2-lane channels, along with one general-purpose DVP interface. This fully accommodates multi-camera scenarios such as multi-sensor stitching and panoramic surround views.

Ultra-Low Power Design: Tailored for Battery-Powered Applications
Beyond robust computing and high-definition imaging, battery life directly determines the practical viability of portable and outdoor devices.

The Quectel SE200ZC-AP adopts an ultra-low power design and features AOV3.0 low-power video recording technology. With a storage configuration of 1 GB LPDDR4x + 64 GB eMMC, its sleep current drops to an impressive 0.85 mA. Additionally, the module supports fast boot and low-power pre-recording functions, significantly reducing standby power consumption. This makes it particularly well-suited for battery-powered products like portable medical devices, wireless vehicle equipment, and inspection robots.

Comprehensive Hardware & Software Compatibility: Accelerating Time-to-Market
To meet the diverse needs across various industries, the SE200ZC-AP offers a robust support system encompassing software, hardware, and peripheral expansion. This effectively simplifies the development process and helps customers shorten their product launch cycles.

On the software front, the module is deeply compatible with Linux (Kernel 6.1) and Debian 12 operating systems, providing efficient support for application development and iterative upgrades across diverse scenarios.

On the hardware front, the SE200ZC-AP utilizes an LCC+LGA package with an ultra-compact footprint of just 40.0 × 40.0 × 2.9 mm, allowing for seamless integration into space-constrained smart terminals.

Furthermore, the module is equipped with a rich array of peripheral interfaces, including MIPI_DPHY/DVP/LCDC, MIPI CSI, SAI, PDM, DSM, ADC, I2C, GMAC, USB 3.0/2.0, SPI, CAN FD, SDIO, and UART. These enable rapid expansion of functions such as image capture, screen display, audio input, and local storage.

Additionally, the module supports external connection to Quectel’s 4G, Wi-Fi 6, audio, and GNSS modules. This provides a one-stop solution for the entire “perception-computation-communication” chain, ensuring seamless coordination across local data collection, AI analysis, wireless transmission, and location tracking.

Quectel Launches the SP805FL Series AI Computing Modules

On June 25, during the MWC Shanghai 2026 exhibition, Quectel officially unveiled its first flagship AI computing module series based on the MediaTek platform: the SP805FL series (available in WF and AP variants). This launch establishes a crucial pathway for integrating advanced AI computing power into end-device applications across various industries.

Equipped with MediaTek’s flagship Genio Pro 5100 chip, this product seamlessly combines robust computing power, outstanding graphics and imaging capabilities, and a rich array of interfaces. It fully supports the deployment of physical AI, on-device large language models (LLMs), and multimodal interactions. The module is widely applicable to high-end scenarios such as robotics, smart helmets, 3D scanning/printing, computing boards, smart retail, large-screen displays, and smart homes, empowering customers to seize the initiative in the wave of edge computing and AI-native applications.

Flagship CPU Architecture: Effortlessly Handling Complex Tasks at the Edge

The Quectel SP805FL features a full octa-core Arm v9.2 architecture, comprising 1x Cortex-X925, 3x Cortex-X4, and 4x Cortex-A720 cores. Built on a 3nm manufacturing process, it effortlessly manages multitasking and complex computations.

In practical applications, even when a robot simultaneously performs navigation computing, visual recognition, and voice dialogue, it maintains smooth responsiveness, eliminating lag and latency. For devices like industrial tablets and 3D scanners that require real-time processing of massive amounts of data, its massive performance headroom makes “millisecond-level reconstruction” a reality.

50+ TOPS NPU: Enabling Fully Independent On-Device AI Operation

The successful deployment of on-device AI relies heavily on dedicated AI computing power. The Quectel SP805FL integrates MediaTek’s 8th-generation NPU, delivering over 50 TOPS of AI computing power. It supports full-precision computing (INT4/INT8/INT16/FP16), enabling the efficient deployment of various AI large models. With multimodal interaction and scene perception capabilities, it provides robust support for the large-scale deployment of on-device AI.

Leveraging its powerful AI performance, devices can independently handle complex AI inference tasks. Whether it is a smart helmet used for underground or field operations, service robots, or smart retail terminals, they can operate stably in offline or congested network environments, respond to commands in milliseconds, and simultaneously safeguard data privacy.

All-Scenario Multimedia and Connectivity: Meeting Rigorous Industrial Demands

In terms of multimedia capabilities, the SP805FL supports simultaneous multi-screen display and 8K encoding/decoding, catering to scenarios with stringent requirements for image quality and multi-screen display, such as 3D scanning/printing, commercial large screens, and smart retail.

Regarding wireless connectivity, the Quectel SP805FL-WF variant is equipped with Wi-Fi 7 and Bluetooth 6.0, enabling high-speed, stable wireless data transmission. It also integrates multi-constellation GNSS positioning, compatible with GPS/BDS/GLONASS/Galileo/QZSS/NAVIC, and supports L1+L5 dual-frequency positioning, providing precise positioning services for intelligent transportation and logistics platforms.

Designed for industrial-grade scenarios, the product supports a wide operating temperature range of -35°C to +75°C, making it capable of handling various complex industrial environments. Global certifications, including CE, RCM, FCC, and IC, are currently in progress to meet global compliance deployment requirements in the future.

Massive Interfaces for Flexible Expansion: Simplifying Development, Reducing Costs, and Boosting Efficiency

The SP805FL offers an interface lineup that far exceeds conventional smart modules, boasting exceptional scalability. In addition to traditional interfaces such as MIPI DSI/CSI, I2S, UART, SDIO, I2C, and SPI, it supports multiple PCIe lanes and dual Gigabit Ethernet ports, significantly enhancing its flexibility and adaptability in on-device AI applications.

Adopting a compact LGA package design, the module allows high computing power to be seamlessly integrated into smaller end products. Developers do not need to add external interface or computing chips; a single module can satisfy most device connectivity requirements, effectively simplifying hardware design and shortening R&D cycles.

The launch of the Quectel SP805FL marks a critical leap for smart modules, transforming them from mere “data transmission pipelines” into “independent on-device decision-making units.”

Quectel’s 5G+AI Smart Module AS830M Passes AEC-Q104 Test

Recently, Quectel’s professional-grade AS830M 5G+AI cabin-connectivity integrated smart cockpit module has officially passed the AEC-Q104 automotive-grade qualification test. This milestone signifies that the AS830M fully meets the stringent requirements of top-tier global automotive electronics supply chains in System-in-Package (SiP) design, multi-chip thermal management, signal integrity, and end-to-end automotive-grade quality management.

The Quectel AS830M’s successful completion of this standard thoroughly validates its stability, safety, and durability in complex in-vehicle environments, earning authoritative endorsement. Furthermore, the module has secured essential domestic certifications, including NAL, CCC, and SRRC, ensuring it possesses all necessary market access qualifications.

In terms of performance, the Quectel AS830M module is built on the Qualcomm QCM8538 platform and features a 4nm process chip, seamlessly integrating 5G connectivity, multi-screen 8K display interaction, and edge AI capabilities. Powered by an 8-core CPU delivering up to 200K DMIPS, its dedicated NPU provides 48 TOPS of comprehensive AI computing power. This enables the smooth execution of complex AI tasks, including edge large language models, machine vision, and multimodal interaction. The Quectel 5G AI module also supports 6-screen synchronization, 8K@30 display output, and the connection of up to 17 cameras. Additionally, its highly integrated SiP packaging and LXC container isolation technology deeply merge communication and cockpit functions without interference, directly addressing the fragmentation and latency pain points of traditional cockpit systems.

For automakers and Tier 1 suppliers, the significance of the AS830M passing the AEC-Q104 test goes far beyond mere “compliance”; it delivers a truly “plug-and-play,” automotive-grade, highly integrated cabin-connectivity solution. Under the traditional model, automakers had to conduct module-level reliability testing independently, a process often characterized by long cycles, high costs, and significant risks. The AS830M 5G AI Module fundamentally transforms this landscape by alleviating customers’ redundant testing burdens, significantly reducing system failure risks and supply chain management costs, and effectively shortening the time-to-market for OEM production, thereby accelerating the safe and rapid deployment of premium smart cockpits.

Currently, the Quectel AS830M has been selected by multiple leading domestic automakers and is accelerating toward mass production. Looking ahead, Quectel will continue to advance AEC-Q104 compliance testing for cabin-connectivity modules with varying computing specifications, supporting domain controller convergence in the automotive industry and providing customers with an expanded portfolio of premium cabin-connectivity solutions.

Quectel AR588MA 5G-A Automotive-Grade Module Empowers TBox-P Platform

Recently, Jingwei Hirain’s TBox-P platform, built on Quectel’s automotive-grade 5G-A module AR588MA, has officially entered mass production. This provides full-link support for intelligent connected vehicles—from the communication core to the in-vehicle system—helping drive large-scale commercial adoption of advanced intelligent driving. The Jingwei Hirain TBox-P platform powered by Quectel’s AR588MA has already secured mass production design wins from multiple L4 autonomous driving customers.

What exactly does the powerful AR588MA “core” bring to the TBox-P platform?

Say Goodbye to Weak Signal Anxiety: AI-Powered Intelligent Network Selection Lets Vehicles Proactively “Choose the Signal”

Underground garages, tunnels, mountainous areas, urban canyons… the in-vehicle network environment is complex and ever-changing. Traditional in-vehicle communication can only “passively wait for a signal,” leading to poor experience and insufficient stability in weak signal areas.

The Quectel AR588MA breaks this deadlock. It features an embedded AI vehicle network engine with three key capabilities: scene recognition, intelligent switching, and signal compensation. It not only senses vehicle speed, location, and environment in real time but also autonomously learns base station handover patterns. When a vehicle enters a weak signal area like an underground garage, the AI engine predicts this in advance and dynamically optimizes network selection. Combined with an adaptive antenna compensation algorithm, it significantly enhances signal penetration in weak signal areas, achieving a qualitative leap from “passive connection” to “active optimization.”

5G-A Onboard: Greater Bandwidth, Faster Response, Stronger Capabilities

The AR588MA module is built on MediaTek’s 5G-A platform MT2739 and complies with the 3GPP R18 standard. It delivers a peak downlink rate of up to 9.0 Gbps and a peak uplink rate of over 2.5 Gbps. Compared to traditional 5G, this is not just a doubling of numbers—it’s a leap in experience.

Simply put, under ideal network conditions, downloading an HD movie in the cabin takes just a few seconds, and communication between the vehicle, the cloud, and roadside units happens with near-zero latency. This combination of ultra-high bandwidth and ultra-low latency paves the way for high-speed data pathways for advanced driver assistance and vehicle-to-everything (V2X) applications, making intelligent driving systems faster and safer.

No Single Point of Failure: DSDA Dual SIM Dual Active Creates “Double Insurance”

Advanced intelligent driving cannot rely on a single network. If the communication link is interrupted, the consequences could be disastrous. Ordinary “dual SIM dual standby” only supports both SIMs in standby simultaneously—when one card is on a call, data on the other card is interrupted. The DSDA (Dual SIM Dual Active) supported by the AR588MA allows both SIM cards to operate independently and concurrently without interfering with each other, truly enabling simultaneous network connectivity.

Even if one carrier’s network is congested or a base station fails, the other network seamlessly takes over, ensuring core services such as remote monitoring, NG-eCall emergency calling, and vehicle dispatching remain uninterrupted. This true dual-network redundancy builds an unbreakable communication safety foundation for L4 autonomous driving.

High Reliability & Easy Compatibility: Fast Upgrades, Global Availability

The reliability of in-vehicle products directly affects driving safety. The Quectel 5G Module strictly follows automotive-grade design standards, meets AEC-Q100 Grade 2 requirements and ISO 21434 cybersecurity standards, and operates stably under extreme temperatures (-40°C to +105°C) and vibrations. It also supports NG‑eCall emergency calling and L1+L5 dual-band GNSS high-precision positioning, providing dual benefits for vehicle safety and precise navigation.

In terms of upgrades and adaptation, the AR588MA features a highly compatible design. It is pin-to-pin compatible with Quectel’s existing automotive 5G series modules on the hardware side, and uses the QuecOpen architecture on the software side. Traditional 5G projects can smoothly upgrade to 5G-A without starting from scratch, greatly shortening development cycles and reducing costs. Additionally, the module supports global frequency bands, meeting the mass production needs of automakers in different regions and accelerating global deployment.

SIMCom Partners with Skylo to Initiate NTN Certification for SIM7070G-HP-S Module

SIMCom has officially announced its collaboration with Skylo, a pioneer in non-terrestrial network (NTN) communications, to commence the NTN certification process for its SIM7070G-HP-S module.

The SIMCOM SIM7070G-HP-S module, which is now undergoing certification, is an NTN module independently developed by SIMCom specifically for satellite IoT scenarios. It supports the 3GPP Release 17 5G IoT-NTN standard and is compatible with global satellite networks. Featuring an LCC+LGA package, the SIMCOM 5G module offers extensive interfaces and strong scalability. Its compact dimensions of 24×24×2.3mm allow for flexible integration into the design of various miniaturized IoT devices.

Leveraging SIMCom’s mature low-power technology, the SIM7070G-HP-S can extend device battery life to up to 10 years through Power Saving Mode (PSM) and extended Discontinuous Reception (eDRX) technologies. It offers coverage superior to GSM and is well-suited for satellite IoT communication scenarios that require low latency and low throughput.

The initiation of the NTN certification for the SIM7070G-HP-S module marks a deepening of the existing partnership between SIMCom and Skylo and represents a significant step in SIMCom’s strategic expansion into the satellite IoT sector. By combining its strengths in module R&D, manufacturing, and global presence with Skylo’s satellite network resources, SIMCom aims to transcend the limitations of traditional terrestrial networks and provide seamless, reliable connectivity for customers worldwide.

The SIM7070G-HP-S is suitable for a wide range of applications, including asset tracking, smart metering, and remote monitoring. It effectively fills connectivity gaps in remote areas, further expanding the application scope of SIMCom’s product portfolio. Moving forward, SIMCom will work with Skylo to accelerate the certification process, promote the global deployment of their solutions, achieve ubiquitous IoT coverage, and foster the high-quality development of the satellite IoT industry.

Fibocom 5G Module Fx550 Officially Enters Global Mass Production

On March 31, Fibocom announced that its 5G module Fx550, developed based on Samsung’s Exynos Modem platform (including the LGA-packaged FG550 and M.2-packaged FM550), has officially entered mass production. The launch and mass production of this product not only mark the in-depth implementation of the strategic cooperation between Fibocom and Samsung but will also provide connection solutions with ultimate performance and excellent reliability for global 5G FWA (Fixed Wireless Access) and the broader IoT fields, such as wireless landlines, MiFi, and industry gateways.

A Powerful Alliance: Building New Heights in 5G Connectivity

This mass production is a core achievement of the deep strategic cooperation between Fibocom and Samsung. Samsung’s 5G chip solutions have been verified by massive shipments in the global market and are known for their high stability, excellent RF performance, and extensive global compatibility. Through technical integration, both parties aim to leverage their respective advantages in underlying chip architecture and industry application accumulation to jointly promote the deep penetration and popularization of 5G technology in vertical industries worldwide.

Jungwon Lee, Executive Vice President of Samsung Electronics and Head of the System LSI Modem R&D Team, stated, “Samsung is pleased to deepen its strategic cooperation with Fibocom to jointly advance next-generation 5G connectivity solutions for the global market. The successful mass production of the Fibocom 5G module confirms our shared commitment to innovation, performance, and reliability in providing cutting-edge connectivity for Fixed Wireless Access (FWA) and broadband IoT applications. In the AI era, we are jointly building the cornerstone of a smarter, more interconnected industry.”

Tao Xi, Vice President of Fibocom’s Wireless Solutions Business Group and General Manager of the MBB Business Unit, said, “We are very honored to have reached an exclusive cooperation agreement with Samsung Electronics, to be the first to achieve large-scale mass production, and to have our product validated by the market in the broader IoT sector. With the simultaneous advancement of multiple regional versions of the Fx550, including EAU, JP, and MEA, Fibocom will help global enterprises achieve ‘acceleration’ in the high-speed connectivity race.”

Core Advantages: Fx550 Empowering Digital Transformation

The Fx550 module leverages the Samsung Exynos Modem platform to set a new industry benchmark in advanced processing, transmission standards, and networking flexibility.

Supports Rel.16 Standard, Empowering High-Reliability Communication
The Fx550 is fully compatible with the 3GPP Rel.16 standard. With its low latency and high bandwidth characteristics, it precisely meets the demands of the FWA and broader IoT fields for real-time data interaction and large-capacity transmission.
Multi-Carrier Aggregation Technology, Breaking Through Speed Limits
In SA mode, the Fx550 supports up to NR 5CC carrier aggregation (200MHz bandwidth), with a peak downlink speed of 4.67Gbps. Its differential capability to flexibly and efficiently aggregate discrete spectrum within a narrow RF bandwidth provides unique commercial value for global operators to enhance user experience, ultimately empowering industry and home customers. In NSA mode, the Fx550 supports up to NR 2CC + LTE 5CC aggregation, with downlink speeds reaching as high as 6.47Gbps. In LTE networks, the Fx550 supports up to Cat.20, perfectly covering global 4G network capabilities. Breakthroughs in multi-carrier aggregation technology can effectively help operators improve spectrum utilization and ensure ultra-fast connections in complex network environments.
Open Architecture, Optimizing System Costs
The Fx550 adopts a high-performance Modem architecture and has completed in-depth adaptation with mainstream industry AP (Application Processor) solutions, such as Broadcom and Realtek. This deep compatibility gives developers more flexible design choices, allowing for optimal control of development costs while ensuring overall device performance. It also provides global ODMs with diversified product choices, helping end customers create product differentiation. In addition, the Fx550 is compatible with operating systems such as Linux, OpenWRT, RDK-B, and PrpIOS, which facilitates the rapid development of FWA devices, reuse of software assets, and quick upgrades to the latest Wi-Fi Mesh versions, improving the Wi-Fi compatibility of CPE devices.

Global Layout: Multiple Versions Covering Mainstream Markets

To meet the network access standards of different regions, the Fx550 has simultaneously launched multiple regional versions, including FG550-EAU(Europe/Asia/Australia), FM550-EAU (Europe/Asia/Australia), FG550-JP (Japan), FG550-NA (North America), and FG550-MEA (Middle East/Africa). Currently, the Fx550 can provide product services and technical support for multiple regions around the world.

The mass production of the Fx550 is a key step for Fibocom in building a global 5G ecosystem. In the future, Fibocom will continue to work with global industry partners like Samsung to delve deeper into 5G technology innovation. Through continuously iterated connectivity solutions, it will accelerate the prosperity and popularization of 5G FWA and IoT applications worldwide.

Quectel Launches New-Generation AI Computing Smart Module SH603FC

On March 11, during embedded world 2026, Quectel announced the official launch of its new-generation SH603FC series, an AI computing smart module based on MediaTek’s G520 chip platform.

As Quectel’s first high-performance module to feature this platform, the SH603FC series offers three variants: Wi-Fi 6, Wi-Fi 6E, and AP. It is designed to create an integrated intelligent hardware foundation for diverse scenarios such as industrial applications, robotics, smart retail, in-vehicle aftermarket entertainment devices, and edge computing, empowering various industries to achieve digital transformation and intelligent upgrades.

Robust Performance: Building the Cornerstone of Universal Intelligence

Quectel SH603FC series incorporates a CPU architecture featuring A78 + A55 cores, manufactured using TSMC’s 6nm process. It integrates a high-performance AI processing unit, enabling efficient on-device execution of complex AI model operations like facial recognition, product detection, and behavior analysis. This essentially equips terminal devices with a “smart brain,” facilitating a leap from passive response to proactive thinking.

This capability for “proactive thinking” is reshaping operational processes across industries:

On industrial production lines, real-time defect detection can immediately identify faulty products, significantly improving yield rates and efficiency.
For delivery robots, intelligent environmental perception allows for rapid identification of obstacles and path changes, enabling smoother and safer autonomous operation.
In smart stores, local analysis of foot traffic and customer behavior not only reduces reliance on cloud bandwidth but also ensures the privacy and security of commercial data from the source.

Dual-Screen Display: Unleashing Unlimited High-Definition Interaction

The Quectel AI module is not only equipped with a “smart brain” capable of handling complex AI computations but also possesses “sharp eyes” for capturing high-definition visuals. Its multimedia processing capabilities are particularly impressive, with the dual-screen display function precisely addressing the “one-device, multiple-screens” demands in sectors like commercial displays, in-vehicle aftermarket entertainment, and self-service kiosks. Through interface multiplexing solutions such as MIPI, eDP, and DP, the series supports dual-screen display at resolutions up to 2560×1600 at 60fps. This not only reduces hardware BOM costs but also expands the dimensions of interaction.

The flexible “one-chip, dual-screen” architecture elevates device interaction experiences to a new level.

On a vending machine, the main screen can loop 4K product advertisements, while the secondary screen displays real-time transaction QR codes and inventory information, achieving efficient synergy between advertising and transactions.
For smart payment terminals, the staff screen handles checkout operations, while the customer screen clearly shows the purchase details and promotional offers, enhancing transaction transparency and the consumer experience.
In in-vehicle aftermarket systems, the central control screen provides the driver with real-time information like navigation and vehicle status, while a screen for the passenger or a roof-mounted display can be used freely for entertainment, balancing driving safety with passenger experience.

Versatile Adaptability: Excelling in Diverse Application Environments

Leveraging its robust comprehensive performance and rich interface resources (such as PCIe, USB, RGMII, etc.), the SH603FC series has become a core driver for intelligent upgrades across multiple fields, injecting powerful momentum into the digital transformation of various industries.

In the industrial sector, it supports a wide operating temperature range from -35°C to +75°C, providing robust AI computing power and stable operation for industrial tablets and control equipment, facilitating real-time production data collection and analysis, and advancing the implementation of Industry 4.0.
In the smart retail sector, it empowers smart vending machines and self-checkout systems with intelligent payment processing and real-time inventory monitoring, making store operations more efficient and services more attentive.
In the commercial display sector, its high-definition display capabilities make content dissemination on advertising players and large-screen terminals more engaging, effectively enhancing brand presentation and communication efficiency.

Furthermore, the module features a compact LGA+LCC form factor and fully supports multiple operating systems, including Android 15, Yocto, and Ubuntu. It can be flexibly adapted to various devices such as robots, in-vehicle aftermarket entertainment systems, smart intercom recorders, and smart home appliances. It provides a one-stop hardware solution to meet the intelligent upgrade needs of different industries and scenarios.

Currently, samples for the SH603FC series are available for testing. Customers are welcome to inquire and collaborate to unlock the boundless possibilities of edge intelligence together.

Fibocom Launches 5G MiFi Solution Based on Qualcomm QMB415 Platform with Linux OS

On March 5th, Fibocom officially launched the FG205 module and a 5G MiFi solution based on the Qualcomm QMB415 platform. The QMB415 platform has been adapted for the Linux operating system. Leveraging a deeply customized hardware architecture and reduced storage requirements, it provides an optimized solution and more reliable supply stability for wireless broadband applications.

Deep Hardware Customization: Streamlined Design Directly Targeting Core MiFi Needs

Built upon the Qualcomm SM4450, the QMB415 platform has been highly customized for wireless broadband application scenarios. Unlike the redundant design of traditional smartphone chip platforms, this solution achieves “precision tailoring” in its architecture: it reduces redundant CPU processing power and eliminates the GPU, focusing specifically on network connection efficiency.

Software System: Linux OS Ends “Memory Anxiety”

The most significant highlight of the MiFi solution released by Fibocom is its support for the Linux operating system. Previously, most 5G SoC platforms utilized the Android operating system, which requires substantial memory capacity, typically ≥3GB. After adapting this solution to the Linux OS, the maximum memory requirement is only 1GB. This solution lowers the storage configuration, achieving cost-effectiveness while also significantly mitigating the supply and price risks associated with storage, an often “uncontrollable” factor.

Platform Evolution: Pin-Pin Compatibility for Rapid Iteration

To help customers shorten product time-to-market, this solution fully considers the continuity of hardware design. The Fibocom 5G module, based on the QMB415 platform, maintains the same dimensional layout as Fibocom’s FG180/190 series modules based on the Snapdragon X72/X75. Through pin-pin compatible design, device manufacturers can quickly switch between and iterate products with different performance levels on the same hardware platform without the need for redesigning the circuit board.

Regarding Wi-Fi adaptation for the Fibocom FG205, Fibocom will launch a series of solutions supporting Wi-Fi 5/6/6E/7. This will further enrich Fibocom’s MBB product portfolio, comprehensively meet the full range of customer requirements across different tiers, and provide the wireless broadband industry with solutions offering better cost optimization and more reliable supply.

Quectel Launches New 5G Modules at MWC2026

On March 5th, during the Mobile World Congress (MWC) 2026 in Barcelona, Quectel, a global supplier of IoT total solutions, in collaboration with UNISOC, unveiled a new series of 5G modules based on UNISOC’s three major platforms: the 5G eMBB V620, V610, and the 5G RedCap V527. This new product matrix, characterized by high-end performance, compact design, and lightweight features, marks a new journey towards the large-scale application of the 5G Internet of Things.

Flagship Performance, Redefining the 5G Experience

The RG620UA/RM520UA series 5G modules, built on the UNISOC V620 platform, deliver robust 5G data rates, a quad-core A55 processor, rich Ethernet configurations, and Wi-Fi 7/Wi-Fi 6 connectivity. Simultaneously, they continue to optimize and innovate in areas such as ENDC combinations, RAM+ROM solutions, and adaptation for QuecOpen and OpenWRT/PrplOS. This precisely meets the urgent market demand for high-performance, highly flexible terminals in the 5G FWA sector.

Extreme Compactness, Unlocking New Possibilities for Portability

Targeting space-constrained scenarios like global portable terminals and power IoT applications, Quectel has launched the compact 5G modules RG258UB-GL/RG258UB-CN based on the UNISOC V610 platform. This series employs a highly integrated packaging process, reducing the volume by approximately one-third compared to traditional 5G LGA modules. This frees up more design flexibility for devices like portable mobile hotspots (MHS) and compact power terminals. They also deliver robust performance, fully supporting 5G SA/NSA dual modes and global full network compatibility, with an optimized RF solution to ensure signal stability. By selecting core domestic components, they effectively mitigate supply chain risks while achieving a better balance between performance and cost, helping customers quickly respond to the growing demand for consumer electronics and IoT portable devices in global markets.

Lightweight and Slim, Accelerating the Popularization of 5G

Based on UNISOC’s new generation high-performance 5G RedCap IoT communication chip, the V527, Quectel has introduced the RG155UC-CN lightweight module targeting the IoT market where cost and performance are both critical. This module features an ultra-small, ultra-thin design, reducing volume by 46% and thickness by 17% compared to traditional packaging. It supports a rich software ecosystem, significantly lowering the barrier to upgrading lightweight 5G terminals, and is widely adaptable to consumer and industrial terminals such as smart wearables, tablets, and industrial sensors.

Furthermore, the UniHALO solution, developed by Quectel based on UNISOC’s full range of 5G IoT platforms, has now been successfully adapted to the OpenWRT 24.10 version. This solution aims to provide developers with a more stable and efficient software development environment by simplifying the design process, improving system performance, and effectively reducing DDR and Flash resource overhead. It fully leverages hardware potential, further lowering the development threshold for 5G terminals.

Anchored by Customer Value, Building a Global Digital Future Together

Currently, Quectel 5G modules based on the three UNISOC platforms are widely deployed across various fields including smart industry, smart grid, smart logistics, and consumer electronics. The entire product series adopts low-power design, helping to improve terminal battery life by over 20%, deeply aligning with the “Dual Carbon” goals. The V527 and V610 platforms, with their high cost-performance ratio, lower the barrier to 5G access, injecting momentum into the digital development of emerging markets. The V620 platform, with its outstanding performance, provides a high-speed, low-latency network experience that is truly both “affordable and high-quality.”

SIMCOM Launches 5 New IoT Modules at MWC2026

In addition to the two previously unveiled AI modules SIM9650W and SIM9780, SIMCom also launched five new IoT modules at MWC 2026: the A8805X, SIM7672JP, A7665SA, A7600C, and SIM7082G. Covering 5G, 4G, and LPWA categories, these modules focus on practical connectivity and balanced performance, catering to diverse fields such as automotive, industrial, and civil applications, providing stable and cost-effective hardware support for global IoT deployment.

The A8805X has obtained the IATF16949:2016 automotive-grade certification. With dimensions of 37.5 × 33.0 × 3.0 mm and an LGA package, it supports a wide operating temperature range from -40°C to +85°C, making it suitable for harsh automotive environments. It also features excellent EMC protection capabilities to handle challenging electromagnetic conditions.

Leveraging 5G RedCap lightweight technology, the SIMCOM 5G Module balances 5G low latency and low power consumption, achieving downlink speeds of up to 226Mbps and uplink speeds of 120Mbps on 5G NR. It is ideal for automotive T-Box and industrial AGV applications, particularly in scenarios with frequent interference and demanding transmission requirements, such as factory workshops. The 5G Redcap module is available in European (A8805E) and Chinese (A8805C) versions, each tailored to regional frequency bands, providing reliable 5G connectivity for automotive and industrial intelligence.

Three 4G Modules Launched Simultaneously
Compact and practical, suitable for a wide range of scenarios.

SIM7672JP: Measuring 24.0 × 24.0 × 2.4 mm with an LCC + LGA package, this module offers a rich set of interfaces and integrates a multi-GNSS receiver. It supports software features such as FOTA, SSL, and LBS, and is package-compatible with the A7672 and SIM7000 series. Tailored for Japan’s regional frequency bands, it is ideal for shared devices and smart POS terminals, enabling rapid deployment.

A7665SA: With dimensions of 17.6 × 15.7 × 2.1 mm and a compact LGA package, this Cat.1 bis module delivers downlink speeds of 10Mbps and uplink speeds of 5Mbps. It supports FOTA, LBS, MQTT, and other functions, and is package-compatible with the SIM800C and SIM7080G series. Designed for South America’s regional frequency bands, it solves integration challenges for small terminals and is suitable for high-volume production scenarios such as e-bikes and smart locks, offering excellent cost performance.

A7600C: A high-performance LTE Cat.4 module with dimensions of 30.0 × 30.0 × 2.5 mm and an LCC + LGA package. It supports FOTA, LBS, SSL, and other features, and is package-compatible with previous generations, enabling a smooth transition from 3G to LTE. It supports seamless fallback to multiple networks, is tailored for China’s regional frequency bands, and can connect to external Wi-Fi modules. It is suitable for various fields such as automotive and industrial routers, combining broad coverage with high reliability.

SIM7082G
An LPWA long-endurance module designed to meet the low-power requirements of massive IoT deployments.

Addressing the need for low power consumption and long endurance in IoT, the SIM7082G features a compact LCC + LGA package with dimensions of 17.6 × 15.7 × 2.3 mm. Equipped with PSM and eDRX power-saving technologies, it supports battery life of up to 10 years, eliminating the need for frequent battery replacements. Additionally, it supports full-band Cat-M and NB-IoT, covering global frequency ranges. With AT command compatibility with the SIM7080G series and extensive certifications, it is ideal for long-term operation scenarios such as smart meters and remote smoke detectors, providing sustained connectivity for smart energy and environmental monitoring.

From 5G RedCap automotive-grade connectivity to precise 4G regional deployment and LPWA long-endurance scenarios, the five new IoT modules prioritize practicality, avoid redundancy, and balance performance with cost, aligning with the deployment needs of various industries. The simultaneous launch of these five new products further enriches SIMCom’s IoT product portfolio. With core advantages of stability, reliability, and cost-effectiveness, they provide global partners with more precise IoT connectivity hardware options.