SIMCom has officially announced its collaboration with Skylo, a pioneer in non-terrestrial network (NTN) communications, to commence the NTN certification process for its SIM7070G-HP-S module.
The SIMCOM SIM7070G-HP-S module, which is now undergoing certification, is an NTN module independently developed by SIMCom specifically for satellite IoT scenarios. It supports the 3GPP Release 17 5G IoT-NTN standard and is compatible with global satellite networks. Featuring an LCC+LGA package, the SIMCOM 5G module offers extensive interfaces and strong scalability. Its compact dimensions of 24×24×2.3mm allow for flexible integration into the design of various miniaturized IoT devices.
Leveraging SIMCom’s mature low-power technology, the SIM7070G-HP-S can extend device battery life to up to 10 years through Power Saving Mode (PSM) and extended Discontinuous Reception (eDRX) technologies. It offers coverage superior to GSM and is well-suited for satellite IoT communication scenarios that require low latency and low throughput.
The initiation of the NTN certification for the SIM7070G-HP-S module marks a deepening of the existing partnership between SIMCom and Skylo and represents a significant step in SIMCom’s strategic expansion into the satellite IoT sector. By combining its strengths in module R&D, manufacturing, and global presence with Skylo’s satellite network resources, SIMCom aims to transcend the limitations of traditional terrestrial networks and provide seamless, reliable connectivity for customers worldwide.
The SIM7070G-HP-S is suitable for a wide range of applications, including asset tracking, smart metering, and remote monitoring. It effectively fills connectivity gaps in remote areas, further expanding the application scope of SIMCom’s product portfolio. Moving forward, SIMCom will work with Skylo to accelerate the certification process, promote the global deployment of their solutions, achieve ubiquitous IoT coverage, and foster the high-quality development of the satellite IoT industry.
On March 31, Fibocom announced that its 5G module Fx550, developed based on Samsung’s Exynos Modem platform (including the LGA-packaged FG550 and M.2-packaged FM550), has officially entered mass production. The launch and mass production of this product not only mark the in-depth implementation of the strategic cooperation between Fibocom and Samsung but will also provide connection solutions with ultimate performance and excellent reliability for global 5G FWA (Fixed Wireless Access) and the broader IoT fields, such as wireless landlines, MiFi, and industry gateways.
A Powerful Alliance: Building New Heights in 5G Connectivity
This mass production is a core achievement of the deep strategic cooperation between Fibocom and Samsung. Samsung’s 5G chip solutions have been verified by massive shipments in the global market and are known for their high stability, excellent RF performance, and extensive global compatibility. Through technical integration, both parties aim to leverage their respective advantages in underlying chip architecture and industry application accumulation to jointly promote the deep penetration and popularization of 5G technology in vertical industries worldwide.
Jungwon Lee, Executive Vice President of Samsung Electronics and Head of the System LSI Modem R&D Team, stated, “Samsung is pleased to deepen its strategic cooperation with Fibocom to jointly advance next-generation 5G connectivity solutions for the global market. The successful mass production of the Fibocom 5G module confirms our shared commitment to innovation, performance, and reliability in providing cutting-edge connectivity for Fixed Wireless Access (FWA) and broadband IoT applications. In the AI era, we are jointly building the cornerstone of a smarter, more interconnected industry.”
Tao Xi, Vice President of Fibocom’s Wireless Solutions Business Group and General Manager of the MBB Business Unit, said, “We are very honored to have reached an exclusive cooperation agreement with Samsung Electronics, to be the first to achieve large-scale mass production, and to have our product validated by the market in the broader IoT sector. With the simultaneous advancement of multiple regional versions of the Fx550, including EAU, JP, and MEA, Fibocom will help global enterprises achieve ‘acceleration’ in the high-speed connectivity race.”
Core Advantages: Fx550 Empowering Digital Transformation
The Fx550 module leverages the Samsung Exynos Modem platform to set a new industry benchmark in advanced processing, transmission standards, and networking flexibility.
Supports Rel.16 Standard, Empowering High-Reliability Communication The Fx550 is fully compatible with the 3GPP Rel.16 standard. With its low latency and high bandwidth characteristics, it precisely meets the demands of the FWA and broader IoT fields for real-time data interaction and large-capacity transmission.
Multi-Carrier Aggregation Technology, Breaking Through Speed Limits In SA mode, the Fx550 supports up to NR 5CC carrier aggregation (200MHz bandwidth), with a peak downlink speed of 4.67Gbps. Its differential capability to flexibly and efficiently aggregate discrete spectrum within a narrow RF bandwidth provides unique commercial value for global operators to enhance user experience, ultimately empowering industry and home customers. In NSA mode, the Fx550 supports up to NR 2CC + LTE 5CC aggregation, with downlink speeds reaching as high as 6.47Gbps. In LTE networks, the Fx550 supports up to Cat.20, perfectly covering global 4G network capabilities. Breakthroughs in multi-carrier aggregation technology can effectively help operators improve spectrum utilization and ensure ultra-fast connections in complex network environments.
Open Architecture, Optimizing System Costs The Fx550 adopts a high-performance Modem architecture and has completed in-depth adaptation with mainstream industry AP (Application Processor) solutions, such as Broadcom and Realtek. This deep compatibility gives developers more flexible design choices, allowing for optimal control of development costs while ensuring overall device performance. It also provides global ODMs with diversified product choices, helping end customers create product differentiation. In addition, the Fx550 is compatible with operating systems such as Linux, OpenWRT, RDK-B, and PrpIOS, which facilitates the rapid development of FWA devices, reuse of software assets, and quick upgrades to the latest Wi-Fi Mesh versions, improving the Wi-Fi compatibility of CPE devices.
Global Layout: Multiple Versions Covering Mainstream Markets
To meet the network access standards of different regions, the Fx550 has simultaneously launched multiple regional versions, including FG550-EAU(Europe/Asia/Australia), FM550-EAU (Europe/Asia/Australia), FG550-JP (Japan), FG550-NA (North America), and FG550-MEA (Middle East/Africa). Currently, the Fx550 can provide product services and technical support for multiple regions around the world.
The mass production of the Fx550 is a key step for Fibocom in building a global 5G ecosystem. In the future, Fibocom will continue to work with global industry partners like Samsung to delve deeper into 5G technology innovation. Through continuously iterated connectivity solutions, it will accelerate the prosperity and popularization of 5G FWA and IoT applications worldwide.
On March 11, during embedded world 2026, Quectel announced the official launch of its new-generation SH603FC series, an AI computing smart module based on MediaTek’s G520 chip platform.
As Quectel’s first high-performance module to feature this platform, the SH603FC series offers three variants: Wi-Fi 6, Wi-Fi 6E, and AP. It is designed to create an integrated intelligent hardware foundation for diverse scenarios such as industrial applications, robotics, smart retail, in-vehicle aftermarket entertainment devices, and edge computing, empowering various industries to achieve digital transformation and intelligent upgrades.
Robust Performance: Building the Cornerstone of Universal Intelligence
Quectel SH603FC series incorporates a CPU architecture featuring A78 + A55 cores, manufactured using TSMC’s 6nm process. It integrates a high-performance AI processing unit, enabling efficient on-device execution of complex AI model operations like facial recognition, product detection, and behavior analysis. This essentially equips terminal devices with a “smart brain,” facilitating a leap from passive response to proactive thinking.
This capability for “proactive thinking” is reshaping operational processes across industries:
On industrial production lines, real-time defect detection can immediately identify faulty products, significantly improving yield rates and efficiency.
For delivery robots, intelligent environmental perception allows for rapid identification of obstacles and path changes, enabling smoother and safer autonomous operation.
In smart stores, local analysis of foot traffic and customer behavior not only reduces reliance on cloud bandwidth but also ensures the privacy and security of commercial data from the source.
The Quectel AI module is not only equipped with a “smart brain” capable of handling complex AI computations but also possesses “sharp eyes” for capturing high-definition visuals. Its multimedia processing capabilities are particularly impressive, with the dual-screen display function precisely addressing the “one-device, multiple-screens” demands in sectors like commercial displays, in-vehicle aftermarket entertainment, and self-service kiosks. Through interface multiplexing solutions such as MIPI, eDP, and DP, the series supports dual-screen display at resolutions up to 2560×1600 at 60fps. This not only reduces hardware BOM costs but also expands the dimensions of interaction.
The flexible “one-chip, dual-screen” architecture elevates device interaction experiences to a new level.
On a vending machine, the main screen can loop 4K product advertisements, while the secondary screen displays real-time transaction QR codes and inventory information, achieving efficient synergy between advertising and transactions.
For smart payment terminals, the staff screen handles checkout operations, while the customer screen clearly shows the purchase details and promotional offers, enhancing transaction transparency and the consumer experience.
In in-vehicle aftermarket systems, the central control screen provides the driver with real-time information like navigation and vehicle status, while a screen for the passenger or a roof-mounted display can be used freely for entertainment, balancing driving safety with passenger experience.
Versatile Adaptability: Excelling in Diverse Application Environments
Leveraging its robust comprehensive performance and rich interface resources (such as PCIe, USB, RGMII, etc.), the SH603FC series has become a core driver for intelligent upgrades across multiple fields, injecting powerful momentum into the digital transformation of various industries.
In the industrial sector, it supports a wide operating temperature range from -35°C to +75°C, providing robust AI computing power and stable operation for industrial tablets and control equipment, facilitating real-time production data collection and analysis, and advancing the implementation of Industry 4.0.
In the smart retail sector, it empowers smart vending machines and self-checkout systems with intelligent payment processing and real-time inventory monitoring, making store operations more efficient and services more attentive.
In the commercial display sector, its high-definition display capabilities make content dissemination on advertising players and large-screen terminals more engaging, effectively enhancing brand presentation and communication efficiency.
Furthermore, the module features a compact LGA+LCC form factor and fully supports multiple operating systems, including Android 15, Yocto, and Ubuntu. It can be flexibly adapted to various devices such as robots, in-vehicle aftermarket entertainment systems, smart intercom recorders, and smart home appliances. It provides a one-stop hardware solution to meet the intelligent upgrade needs of different industries and scenarios.
Currently, samples for the SH603FC series are available for testing. Customers are welcome to inquire and collaborate to unlock the boundless possibilities of edge intelligence together.
On March 5th, Fibocom officially launched the FG205 module and a 5G MiFi solution based on the Qualcomm QMB415 platform. The QMB415 platform has been adapted for the Linux operating system. Leveraging a deeply customized hardware architecture and reduced storage requirements, it provides an optimized solution and more reliable supply stability for wireless broadband applications.
Deep Hardware Customization: Streamlined Design Directly Targeting Core MiFi Needs
Built upon the Qualcomm SM4450, the QMB415 platform has been highly customized for wireless broadband application scenarios. Unlike the redundant design of traditional smartphone chip platforms, this solution achieves “precision tailoring” in its architecture: it reduces redundant CPU processing power and eliminates the GPU, focusing specifically on network connection efficiency.
Software System: Linux OS Ends “Memory Anxiety”
The most significant highlight of the MiFi solution released by Fibocom is its support for the Linux operating system. Previously, most 5G SoC platforms utilized the Android operating system, which requires substantial memory capacity, typically ≥3GB. After adapting this solution to the Linux OS, the maximum memory requirement is only 1GB. This solution lowers the storage configuration, achieving cost-effectiveness while also significantly mitigating the supply and price risks associated with storage, an often “uncontrollable” factor.
Platform Evolution: Pin-Pin Compatibility for Rapid Iteration
To help customers shorten product time-to-market, this solution fully considers the continuity of hardware design. The Fibocom 5G module, based on the QMB415 platform, maintains the same dimensional layout as Fibocom’s FG180/190 series modules based on the Snapdragon X72/X75. Through pin-pin compatible design, device manufacturers can quickly switch between and iterate products with different performance levels on the same hardware platform without the need for redesigning the circuit board.
Regarding Wi-Fi adaptation for the Fibocom FG205, Fibocom will launch a series of solutions supporting Wi-Fi 5/6/6E/7. This will further enrich Fibocom’s MBB product portfolio, comprehensively meet the full range of customer requirements across different tiers, and provide the wireless broadband industry with solutions offering better cost optimization and more reliable supply.
On March 5th, during the Mobile World Congress (MWC) 2026 in Barcelona, Quectel, a global supplier of IoT total solutions, in collaboration with UNISOC, unveiled a new series of 5G modules based on UNISOC’s three major platforms: the 5G eMBB V620, V610, and the 5G RedCap V527. This new product matrix, characterized by high-end performance, compact design, and lightweight features, marks a new journey towards the large-scale application of the 5G Internet of Things.
Flagship Performance, Redefining the 5G Experience
The RG620UA/RM520UA series 5G modules, built on the UNISOC V620 platform, deliver robust 5G data rates, a quad-core A55 processor, rich Ethernet configurations, and Wi-Fi 7/Wi-Fi 6 connectivity. Simultaneously, they continue to optimize and innovate in areas such as ENDC combinations, RAM+ROM solutions, and adaptation for QuecOpen and OpenWRT/PrplOS. This precisely meets the urgent market demand for high-performance, highly flexible terminals in the 5G FWA sector.
Extreme Compactness, Unlocking New Possibilities for Portability
Targeting space-constrained scenarios like global portable terminals and power IoT applications, Quectel has launched the compact 5G modules RG258UB-GL/RG258UB-CN based on the UNISOC V610 platform. This series employs a highly integrated packaging process, reducing the volume by approximately one-third compared to traditional 5G LGA modules. This frees up more design flexibility for devices like portable mobile hotspots (MHS) and compact power terminals. They also deliver robust performance, fully supporting 5G SA/NSA dual modes and global full network compatibility, with an optimized RF solution to ensure signal stability. By selecting core domestic components, they effectively mitigate supply chain risks while achieving a better balance between performance and cost, helping customers quickly respond to the growing demand for consumer electronics and IoT portable devices in global markets.
Lightweight and Slim, Accelerating the Popularization of 5G
Based on UNISOC’s new generation high-performance 5G RedCap IoT communication chip, the V527, Quectel has introduced the RG155UC-CN lightweight module targeting the IoT market where cost and performance are both critical. This module features an ultra-small, ultra-thin design, reducing volume by 46% and thickness by 17% compared to traditional packaging. It supports a rich software ecosystem, significantly lowering the barrier to upgrading lightweight 5G terminals, and is widely adaptable to consumer and industrial terminals such as smart wearables, tablets, and industrial sensors.
Furthermore, the UniHALO solution, developed by Quectel based on UNISOC’s full range of 5G IoT platforms, has now been successfully adapted to the OpenWRT 24.10 version. This solution aims to provide developers with a more stable and efficient software development environment by simplifying the design process, improving system performance, and effectively reducing DDR and Flash resource overhead. It fully leverages hardware potential, further lowering the development threshold for 5G terminals.
Anchored by Customer Value, Building a Global Digital Future Together
Currently, Quectel 5G modules based on the three UNISOC platforms are widely deployed across various fields including smart industry, smart grid, smart logistics, and consumer electronics. The entire product series adopts low-power design, helping to improve terminal battery life by over 20%, deeply aligning with the “Dual Carbon” goals. The V527 and V610 platforms, with their high cost-performance ratio, lower the barrier to 5G access, injecting momentum into the digital development of emerging markets. The V620 platform, with its outstanding performance, provides a high-speed, low-latency network experience that is truly both “affordable and high-quality.”
In addition to the two previously unveiled AI modules SIM9650W and SIM9780, SIMCom also launched five new IoT modules at MWC 2026: the A8805X, SIM7672JP, A7665SA, A7600C, and SIM7082G. Covering 5G, 4G, and LPWA categories, these modules focus on practical connectivity and balanced performance, catering to diverse fields such as automotive, industrial, and civil applications, providing stable and cost-effective hardware support for global IoT deployment.
The A8805X has obtained the IATF16949:2016 automotive-grade certification. With dimensions of 37.5 × 33.0 × 3.0 mm and an LGA package, it supports a wide operating temperature range from -40°C to +85°C, making it suitable for harsh automotive environments. It also features excellent EMC protection capabilities to handle challenging electromagnetic conditions.
Leveraging 5G RedCap lightweight technology, the SIMCOM 5G Module balances 5G low latency and low power consumption, achieving downlink speeds of up to 226Mbps and uplink speeds of 120Mbps on 5G NR. It is ideal for automotive T-Box and industrial AGV applications, particularly in scenarios with frequent interference and demanding transmission requirements, such as factory workshops. The 5G Redcap module is available in European (A8805E) and Chinese (A8805C) versions, each tailored to regional frequency bands, providing reliable 5G connectivity for automotive and industrial intelligence.
Three 4G Modules Launched Simultaneously Compact and practical, suitable for a wide range of scenarios.
SIM7672JP: Measuring 24.0 × 24.0 × 2.4 mm with an LCC + LGA package, this module offers a rich set of interfaces and integrates a multi-GNSS receiver. It supports software features such as FOTA, SSL, and LBS, and is package-compatible with the A7672 and SIM7000 series. Tailored for Japan’s regional frequency bands, it is ideal for shared devices and smart POS terminals, enabling rapid deployment.
A7665SA: With dimensions of 17.6 × 15.7 × 2.1 mm and a compact LGA package, this Cat.1 bis module delivers downlink speeds of 10Mbps and uplink speeds of 5Mbps. It supports FOTA, LBS, MQTT, and other functions, and is package-compatible with the SIM800C and SIM7080G series. Designed for South America’s regional frequency bands, it solves integration challenges for small terminals and is suitable for high-volume production scenarios such as e-bikes and smart locks, offering excellent cost performance.
A7600C: A high-performance LTE Cat.4 module with dimensions of 30.0 × 30.0 × 2.5 mm and an LCC + LGA package. It supports FOTA, LBS, SSL, and other features, and is package-compatible with previous generations, enabling a smooth transition from 3G to LTE. It supports seamless fallback to multiple networks, is tailored for China’s regional frequency bands, and can connect to external Wi-Fi modules. It is suitable for various fields such as automotive and industrial routers, combining broad coverage with high reliability.
SIM7082G An LPWA long-endurance module designed to meet the low-power requirements of massive IoT deployments.
Addressing the need for low power consumption and long endurance in IoT, the SIM7082G features a compact LCC + LGA package with dimensions of 17.6 × 15.7 × 2.3 mm. Equipped with PSM and eDRX power-saving technologies, it supports battery life of up to 10 years, eliminating the need for frequent battery replacements. Additionally, it supports full-band Cat-M and NB-IoT, covering global frequency ranges. With AT command compatibility with the SIM7080G series and extensive certifications, it is ideal for long-term operation scenarios such as smart meters and remote smoke detectors, providing sustained connectivity for smart energy and environmental monitoring.
From 5G RedCap automotive-grade connectivity to precise 4G regional deployment and LPWA long-endurance scenarios, the five new IoT modules prioritize practicality, avoid redundancy, and balance performance with cost, aligning with the deployment needs of various industries. The simultaneous launch of these five new products further enriches SIMCom’s IoT product portfolio. With core advantages of stability, reliability, and cost-effectiveness, they provide global partners with more precise IoT connectivity hardware options.
MWC 2026 is in full swing, and the deep integration of AI and mobile communications has become one of the most-watched core trends on the exhibition floor!
Seizing the moment with a dual-product launch, SIMCom unveiled its second new 5G AI module, the SIM9780, following the debut of the AI computing module SIM9650W. Precisely targeting the intelligent automotive industry, this SIMCOM 5G AI module centers on a combination of 5G and 8 TOPS of practical computing power. It is tailored for core scenarios such as in-car navigation, integrated cockpit and parking systems, and intelligent in-car robots, delivering a “essential needs” solution for the transformation towards smarter vehicles.
Partners familiar with SIMCom know that we consistently adhere to the principle of “practical technology, implementation is paramount.” The SIMCOM SIM9780 precisely addresses the pain points of the automotive industry with three core highlights that clearly demonstrate its capabilities:
The Golden Combination of 5G + 8 TOPS: More Practical
The 8 TOPS computing power of the SIM9780 is perfectly suited for core requirements like in-car voice interaction, local data inference, and image recognition – avoiding wasted calculating while effectively controlling hardware costs. Paired with optional 5G NSA/SA dual-mode support, it is compatible with all major network standards and covers the frequency bands of over 200 global operators. With a downlink speed of up to 2.4Gbps, tasks like HD map updates, remote data interaction, and online video streaming are smooth and lag-free, achieving both sufficient computing power and guaranteed transmission speed.
Automotive Quality: Stability is Paramount
For automotive products, stability is always the top priority! The SIM9780 meets the demands of complex in-vehicle environments, supporting an ultra-wide operating temperature range from -40°C to +85°C. Whether in the cold north or the hot south, it operates stably. The LGA package design and multiple storage configuration options cater to the hardware requirements of different in-vehicle devices. Running on the Android 13 operating system and supporting multiple firmware upgrade methods, it simplifies development and maintenance, allowing partners to avoid unnecessary complications.
More Than Just Automotive: “Cross-Border” Versatility
Featuring a built-in Mali-G57 quad-core GPU supporting 4K@60fps video encoding/decoding and asynchronous multi-screen display, it can easily handle tasks like environmental perception and data computation for integrated cockpit/parking systems, and voice interaction and intelligent response for in-car robots. Rich interfaces including USB3.0 and MIPI allow flexible connection to external sensors, cameras, and central control screens for expanded smart functions. It is also adaptable to scenarios like in-car navigation, remote vehicle security monitoring, and in-vehicle infotainment systems.
Beyond its core automotive applications, the SIM9780 truly “shines across borders”! In addition to covering application scenarios such as integrated cockpit/parking, intelligent in-car robots, in-car navigation, remote vehicle security, and in-car audio/video, it can also easily empower devices like industrial PDAs and smart POS terminals – one module addressing diverse needs across multiple fields.
The debut of the SIM9780 marks another precise strategic move by SIMCom in the intelligent automotive arena. On the future path of smart mobility, SIMCom will continue to advance with global partners, leveraging more practical technology combinations to make the implementation of in-car intelligence simpler and more efficient, ensuring that every technological innovation genuinely empowers thousands of industries.
With the core theme of “The IQ Era,” MWC 2026 focuses on the deep integration of AI and mobile communications, serving as a vital platform for global technology companies to showcase core technologies and strategize for future. On the first day of the exhibition, SIMCom officially launched its new AI computing module, the SIM9650W. Eschewing the hype of extreme computing power, this 5G AI module centers on practical 12 TOPS computing power combined with full-scenario adaptability. Echoing the conference’s theme of AI implementation, it provides a cost-effective, implementable core solution for the intelligent transformation of diverse industries.
The SIMCOM SIM9650W breaks away from the misconception that “higher computing power is always better.” It focuses on actual industry needs, balancing performance and cost to precisely address the challenge of computing power during AI implementation across various sectors, truly enabling AI technology to enter practical application scenarios.
Key Specification Highlights
12 TOPS Practical Computing Power Core
Stable AI computing power reaching 12 TOPS. This can easily handle real-time analysis of multiple high-definition video streams and abnormal behavior recognition in security scenarios, as well as local data inference and device linkage control in industrial edge computing. It is also suitable for small to medium-scale AI applications in retail, government affairs, etc., covering diverse needs from basic intelligence to mid-to-high-end computing power, avoiding waste and maximizing cost-effectiveness.
Powerful Multimedia and Interaction Capabilities
Integrates an Adreno™ 643 GPU, supports 4K video encoding/decoding and dual-screen display with different content. It can smoothly support immersive graphics rendering for VR/AR devices and high-definition display with multitasking in smart cockpits, making multimedia interaction experiences smoother and more stable.
High-Speed, Stable Full-Scenario Connectivity
The SIMCOM 5G AI Module integrates 2×2 MIMO Wi-Fi 6E, supporting the 2.4GHz, 5GHz, and 6GHz bands with throughput up to 3.6Gbps. It also integrates Bluetooth 5.2, ensuring stable, high-speed data transmission for devices in dense wireless environments. Whether it’s real-time data synchronization between devices and the cloud in a smart factory or the immediate upload of customer traffic analysis data in a mall, reliable connectivity is guaranteed.
Industrial-Grade Reliability and Expandability
Features a wide operating temperature range from -35°C to +75°C, confidently handling challenges in complex environments like outdoor vehicles, unattended retail kiosks, and industrial sites. It offers rich hardware interfaces including multiple MIPI-CSI camera interfaces and PCIe Gen3, allowing flexible connection to various peripherals and adapting to complex environments like automotive, industrial, and outdoor retail.
What Can 12 TOPS Do?
12 TOPS of AI computing power means terminal devices can handle more complex, real-time AI tasks, moving from simple “seeing” to “understanding” and reacting quickly.
More Accurate Real-Time Visual Recognition
In smart retail scenarios, an intelligent weighing scale or self-checkout terminal equipped with the SIM9650W can process multiple camera streams simultaneously, instantly and accurately identifying hundreds of types of vegetables, fruits, or bakery items with similar shapes and colors, multiplying checkout efficiency.
More Complex Multimodal Analysis
In industrial quality inspection, devices can run multiple AI models concurrently, such as appearance detection, OCR reading, and abnormal sound analysis, performing comprehensive automated product inspection to enhance production quality and efficiency.
Smoother Immersive Interaction
For devices like helmets or service robots, 12 TOPS of computing power is sufficient to support real-time SLAM (Simultaneous Localization and Mapping), gesture recognition, and object interaction, providing users with a smooth and natural immersive experience.
Rich Scenarios: Empowering Intelligent Upgrades Across Industries
The SIM9650W can be widely applied in cutting-edge fields such as smart retail, smart industry, intelligent automotive, public safety, and emerging consumer electronics, delivering core value to customers:
Cost Reduction, Faster Time-to-Market
The practical computing power configuration avoids redundant investment. Combined with mature technical support, it effectively shortens customer product R&D cycles and reduces overall costs.
Enhanced Product Competitiveness
Balances performance, cost, and reliability, enabling customers to create more differentiated, competitive, and cost-effective terminal products.
Ensuring Stability and Ease of Implementation
Industrial-grade design ensures stable operation in complex environments. The validated computing platform significantly lowers the threshold and risk of AI project implementation.
Leading a New Direction for On-Device AI Implementation
Looking ahead, SIMCom will continue to iterate its AI module products guided by real-world industry demands, collaborating with global partners to drive deep integration of AI technology across thousands of industries. The goal is to make practical computing power a reliable support for enterprise intelligent upgrades and empower more partners to achieve efficient AI implementation.
On January 9, during the 2026 International Consumer Electronics Show (CES 2026), Quectel, a global leading provider of IoT total solutions, announced the launch of its groundbreaking 5G-Advanced module series RG660Qx, compliant with the 3GPP R18 standard. This series is set to redefine the performance benchmarks and experiential boundaries of next-generation smart connectivity through the power of cutting-edge technology integration.
Among the series, the Quectel RG660QA is based on the Qualcomm X85 platform, maximizing the peak performance of 5G-A; while the Quectel RG660QB is equipped with the Qualcomm X82 platform, precisely meeting the demands of mainstream high-end connected smart applications. This series of modules uniquely combines key capabilities including ultra-high-speed 5G-A communication, collaboration with Wi-Fi 8, and AI enhancement. They can also be upgraded to support NB NTN satellite communication, thus comprehensively empowering next-generation cutting-edge smart applications such as home and commercial wireless broadband, high-definition mobile video, and high-performance mobile hotspots, injecting a stronger sense of “futurism” into terminal devices. The first batch of engineering samples from the RG660Qx series has officially been released to global customers, with the Quectel RG660QB series expected to go commercial in Q1 2026.
Quectel COO Zhang Dong stated, “The Quectel RG660Qx series not only elevates 5G communication capabilities to a new level but also represents a future-oriented integrated smart product. Leveraging the Qualcomm X8x platform, this series offers extremely high speed, outstanding performance, and exceptional reliability, precisely matching the multiple connectivity, computing, and intelligence needs of ultra-high-speed fixed wireless access (FWA), enterprise-grade gateways, and high-end consumer electronics. We hope that the RG660Qx series significantly lowers the threshold for innovation for our customers and accelerates the emergence of next-generation smart terminals.”
High-Speed and Stable Dual Online: Maximizing 5G-A Communication Strength
In terms of core communication performance, the RG660Qx supports a maximum of 8-channel or 6-channel receiving in the downlink, and supports FDD (2 Layers) + TDD (2 Layers) UL Switch. With advanced Multi-Input Multi-Output (MIMO) technology, the RG660Qx series excels in increasing data transmission rates, optimizing signal quality, and ensuring connection stability, capable of providing high-speed, stable wireless experiences for next-generation 5G applications, including gigabit-level fixed wireless access, essential enterprise services, and high-capacity mobile broadband.
Meanwhile, the RG660Qx series can be upgraded to support Dual SIM Dual Standby (DSDS) and Dual SIM Dual Active (DSDA) functions, flexibly adapting to multi-carrier network switching needs and confidently addressing complex global network environments to ensure continuous online access for businesses.
For key scenarios like indoor 5G CPE, this series of modules can simultaneously support Wi-Fi 7 and Wi-Fi 8 technologies across the 2.4 GHz, 5 GHz, and 6 GHz bands, and integrate Bluetooth functionality, building a comprehensive intelligent interconnect ecosystem. Its Ethernet interface supports rates of up to 10 Gbps, enabling large-capacity data transmission for ultra-high-definition video streaming and enterprise-grade networks. Supporting power level 1, it can effectively extend signal coverage, further enhancing coverage capability in FWA deployment scenarios.
Integration of Multiple Advanced Capabilities Empowering All-Scenario Smart Connectivity
AI enhancement capability is one of the core highlights of the RG660Qx series. Through modem capability upgrades and AI-enhanced Wi-Fi, along with a dedicated AI co-processor featuring 24 TOPS of computing power, this series of modules can easily realize intelligent interaction functions such as voice control. Additionally, it supports external AI computing power modules to further enhance edge-side data processing and intelligent decision-making capabilities, providing core computing support for scenario-based applications of smart terminals.
Besides AI capabilities, the RG660Qx series simultaneously reinforces all-scenario connectivity capabilities: it supports a variety of interfaces including USXGMII, USB, and PCIe, allowing deep cooperation with Wi-Fi chipsets to fully leverage the advantages of Wi-Fi 8 in network reliability and intelligence, significantly enhancing the application experience of devices such as 5G CPE and high-performance mobile hotspots.
The breakthrough in all-area coverage capabilities further underscores the technological foresight of the RG660Qx: the Quectel 5G module can be upgraded to support the NB NTN satellite communication function (requires specific hardware design), forming a complementary relationship with terrestrial network coverage, achieving stable connectivity in remote areas, oceans, deserts, and other locations without ground network availability.
Hassle-Free Hardware Upgrades Accelerating Industry Implementation
To accelerate industry adoption, the RG660Qx series is Pin-to-Pin compatible with Quectel’s previous 5G module series RG650x, allowing customers to use the same recommended Wi-Fi chips and physical layer chip solutions from the RG650x series without the need to reconstruct hardware design for swift upgrades, significantly simplifying R&D processes and optimizing supply chain efficiency. Meanwhile, Quectel can also provide high-performance antenna products and comprehensive technical support to help customers speed up product development and shorten the time to market.
From breakthroughs in 5G-A link performance to forward-looking interconnect strategies with Wi-Fi 8, along with synergies between AI enhancements and industry applications, the Quectel RG660Qx series not only demonstrates global leadership in communications technology but also establishes a foundation for next-generation smart terminal innovation through all-scenario coverage and flexible hardware compatibility. In the future, Quectel will continue to drive technological innovation, deepen industry collaboration, and accelerate the transition of 5G-A technology from “standard specifications” to “large-scale applications.”
On January 4, just before the 2026 International Consumer Electronics Show (CES 2026), Quectel Communications, a global leader in IoT and V2X (Vehicle-to-Everything) solutions, announced the launch of its automotive-grade 5G-A module AR588MA, compliant with the 3GPP R18 standard.
This series of 5G modules is built on MediaTek’s world’s first 5G-A platform, MT2739, achieving four core breakthroughs: comprehensive signal coverage, high-speed data transmission, AI-based intelligent network adaptation, and automotive-grade safety assurance. These features strongly support the innovative development of the next-generation intelligent connected vehicles. Currently, the module is offering engineering samples externally, and several leading automotive companies have already initiated the implementation of the AR588MA series.
“Ground + Satellite” Full Coverage, More Reliable High-Speed Transmission
As an automotive-grade module based on MediaTek’s first 5G-A platform, the Quectel AR588MA series modules feature leading modem performance in the industry. It includes a built-in quad-core Cortex-A55 CPU with a clock speed of up to 2.3GHz, enhanced upstream transmission capabilities, and ultra-low latency, supporting a bandwidth of 400 MHz and NR 5CC, with downstream speeds reaching up to 9.0 Gbps and upstream speeds exceeding 2.5 Gbps. It also supports DSDA (Dual SIM Dual Active) functionality, enabling more efficient and stable data transmission and real-time processing while maintaining stable network connections, thereby laying a solid communication foundation for the safety and reliability of advanced driver-assistance systems.
At the same time, Quectel AR588MA has achieved significant breakthroughs in comprehensive communication capabilities. It not only supports 5G-A technology but also integrates satellite communication functions. Combined with enhanced low-frequency reception performance and adaptive network signal compensation algorithms, it significantly improves network performance while ensuring full-scenario communication coverage. Even in weak signal areas like basements and remote mountain regions, vehicles can maintain stable connectivity, effectively addressing the pain points of ground network coverage blind spots and ensuring communication continuity in complex environments.
In terms of wireless performance optimization, the AR588MA is compatible with a six-port antenna design, deeply adapting to Quectel’s high-performance intelligent antenna solutions, thus achieving deep integration of module and antenna performance, providing users with wide coverage and strong signal wireless network performance.
AI Intelligent Adaptation, Smoother Network Experience
During this critical period of advancement in intelligent connected vehicles, users have raised higher demands for the smoothness of in-vehicle network experiences.
One of AR588MA’s core competitive advantages lies in its deep integration of AI technology with in-vehicle communication, achieving an upgrade from “passive connectivity” to “active adaptation.” The module features an intelligent driving scene recognition system and an AI network optimization engine, with processing capacities of 25K DMIPS for quad-core and 13K DMIPS for dual-core. It can real-time integrate multidimensional data, including vehicle positioning, speed, and road conditions, automatically matching optimal network modes, significantly enhancing network speed and connection stability, and providing users with a smoother in-vehicle network experience.
Automotive-Grade Core Quality, Dual Assurance of Safety and Reliability
The reliability of automotive products is directly related to driving safety. The Quectel AR588MA strictly adheres to automotive-grade design standards and safety systems, fulfilling AEC-Q100 Grade 2 automotive specifications to ensure product reliability and durability in extreme environments. Additionally, it complies with ISO 21434 automotive cybersecurity management standards and supports Secure Boot and RoT (Root of Trust), combined with Hypervisor hardware isolation technology to provide a more stable connectivity experience and more reliable safety assurances for in-vehicle communication.
On the functional side, the AR588MA fully supports eCall/NG-eCall emergency calling systems, which can automatically trigger a call and transmit critical data such as vehicle location and accident type to emergency centers in the event of a collision or other emergencies, buying precious time for rescue operations. To further enhance vehicle positioning reliability, this module also integrates GNSS positioning capabilities, supporting dual-frequency positioning with L1 and L5, outputting at a frequency of up to 30Hz, providing precise location support for path planning and lane-level navigation for assisted driving.
Compatible Design for Easy Upgrades, Accelerating 5G-A Implementation in Vehicles
To reduce customer development costs and shorten product launch cycles, the AR588MA employs a highly compatible design approach at both hardware and software levels.
On the hardware front, it is pin-to-pin compatible with Quectel automotive 5G modulesAG581A, AG56xN, and AG519M series, allowing customers to quickly upgrade from traditional 5G to 5G-A. On the software side, it utilizes the QuecOpen architecture, leveraging excellent cross-platform and cross-system compatibility to assist automotive enterprises in seamless system migration, significantly shortening product development and validation cycles.
