Huawei 5G CPE Pro 6 H165-383 Review

The Huawei 5G CPE Pro 6 H165-383 stands as a groundbreaking 5G wireless router designed to bridge the gap between cutting-edge 5G networks and everyday connectivity needs. As a flagship product in Huawei’s 5G ecosystem, it combines ultra-high-speed performance, versatile compatibility, and intelligent features to deliver a seamless transition into the 5G era.

1. Unparalleled 5G Performance
Equipped with Huawei’s new chipset, the world’s first 7nm multi-mode 5G modem, the 5G WiFi Router supports both NSA (Non-Standalone) and SA (Standalone) network architectures, ensuring compatibility with global 5G deployments. This dual-mode capability allows users to experience peak download speeds of up to 11.7 Gbps (practical tests) and theoretical peaks of 2.5Gbps, enabling 3-second downloads of HD movies and lag-free 8K video streaming. Its 5G Super Uplink technology integrates TDD and FDD frequencies, enhancing upload speeds by 20–60% and reducing latency by over 30%, making it ideal for real-time applications like cloud gaming and remote collaboration.

2. Advanced Wi-Fi and Coverage

The Huawei 5G CPE supports Wi-Fi 7 with dual-band concurrency (2.4 GHz and 5 GHz), achieving a combined theoretical speed of 3600Mbps . Huawei’s proprietary 5G Best Position Algorithm, accessible via the HUAWEI AI Life App, optimizes signal reception by identifying the ideal placement for the router. Its dual-polarized X-shaped antennas and beamforming technology extend coverage by 30%, ensuring stable connections even in complex environments like multi-story homes or offices.

3. Versatile Connectivity and Smart Integration

Beyond 5G, the Huawei CPE Pro 6 supports wired broadband via its Gigabit Ethernet port, ensuring backward compatibility with 4G/3G networks and serving as a high-performance traditional router. It can simultaneously connect up to 128 devices, leveraging MU-MIMO and OFDMA technologies to manage high-density IoT environments effortlessly. Integrated with HUAWEI HiLink, the router enables one-touch pairing with smart home devices, automatically synchronizing Wi-Fi credentials and serving as a centralized hub for smart ecosystems.

4. Robust Hardware and Design

The router features a sleek white design with a 12dBi high-gain antenna, enhancing signal reception. It includes multiple ports: one 2.5G Ethernet port, one Gigabit Ethernet port, one RJ11 for voice, and a SIM card slot, offering versatile connectivity options.

Weighing only 700g and featuring a compact design (99×107×215 mm), the CPE Pro 6 is highly portable, ideal for temporary setups in outdoor events, remote worksites, or travel scenarios. Its 360° signal reception and enhanced heat dissipation ensure reliability in diverse conditions, from urban apartments to rural areas lacking fiber infrastructure.

5. Future-Proof Applications

The CPE Pro 6 is not just a router but a gateway to transformative 5G applications. It supports network slicing and MEC (Multi-access Edge Computing), enabling low-latency use cases like telemedicine, autonomous vehicles, and industrial automation9. For gamers, the Game Turbo feature prioritizes gaming traffic and reduces latency, while enterprise users benefit from secure, high-speed connections for cloud services and 4K/8K live streaming.

Conclusion
The Huawei 5G CPE Pro 6 H165-383 redefines connectivity by merging 5G’s raw power with intelligent adaptability. Whether for households, businesses, or mobile scenarios, it delivers unparalleled speed, coverage, and versatility, positioning itself as an essential tool for the 5G-driven future. With global certifications and partnerships across 26+ operators, Huawei continues to lead the charge in making 5G accessible and transformative for all.

Fibocom Launched the FG390 5G Module Based on the MediaTek T930 Platform

On May 19, Fibocom, a global leader in wireless communication modules and AI solutions, unveiled its pioneering FG390 series 5G module based on the MediaTek T930 platform. Designed for MBB terminal products represented by 5G Fixed Wireless Access (FWA), the FG390 series will accelerate FWA industry development in application scenarios including CPE, ODU, MiFi, enterprise gateways, and industrial gateways through advanced wireless communication technologies.

The Fibocom FG390 is a highly integrated and high-performance 5G module. Equipped with the cutting-edge MediaTek T930 chip platform manufactured using 4nm process technology, it integrates the MediaTek M90 5G modem and a quad-core ARM Cortex-A55 CPU while offering comprehensive functionalities and configurations. Supporting 3GPP Release-18 standards, it enables 6-component carrier aggregation (6CC CA) in Sub-6GHz 5G NR downlink and 5-layer 3Tx transmission in uplink, achieving maximum SA downlink speeds of 10Gbps and uplink speeds of 2.8Gbps for exceptional 5G performance. Additionally, the Fibocom FG390 incorporates 8Rx technology with 200MHz bandwidth, effectively improving spectrum efficiency by 40% at cell edges and significantly expanding signal coverage. The module can also be paired with dedicated NPU chips to create AI-powered gateway devices, delivering advanced network interaction capabilities enhanced by AI.

In this era of dual-driven 5G-Advanced and AI technology convergence, the Fibocom FG390 series will empower digital transformation across residential and enterprise scenarios through its leading technical specifications, innovative features, and rich peripheral components. This advancement will help accelerate investments and returns for operators and open markets in the communication terminal sector.

SIMCom Brings A High-Speed 5G+Wi-Fi 7 Indoor Router

In the current era of rapid AI technology development, smart devices are constantly evolving, and seamless, high-speed connectivity has become a key element in driving the development of next-generation applications. At the MWC25 World Mobile Communications Conference and the 2025 Embedded Exhibition in Germany, SIMCom  teamed up with industry-leading company Luxshare Precision to jointly showcase the 5G indoor CPE BE17000 Wi-Fi 7 Mesh Router, which significantly enhances smart terminal connectivity performance through cutting-edge 5G technology.

Relying on Luxshare Precision’s product development and manufacturing capabilities and SIMCom’s technological accumulation in communication modules, the collaboration provides high-performance, highly reliable wireless communication solutions for smart offices, industrial internet, commercial complexes, and other scenarios, promoting the large-scale application of 5G and Wi-Fi 7 technologies in vertical industries.

Technological Synergy: The Integration of 5G+Wi-Fi 7 Advantages

This 5G + WiFi 7 router integrates the SIMCom SIM8262E-M2 module, which enables 5G network capabilities simply by inserting a SIM card. With Wi-Fi 7 Mesh technology, it allows 5G networks to be shared among multiple Wi-Fi devices, achieving significant improvements in network coverage, transmission speed, and overall capacity.

5G Technology Advantages:

Based on Qualcomm’s Snapdragon X62 5G modem, it supports the main global 5G frequency bands. Whether in the Sub-6GHz or millimeter-wave frequency bands, it ensures stable transmission, meeting the communication needs of diverse scenarios.

Wi-Fi 7 Mesh Features:

By utilizing dynamic narrowband technology and multi-link aggregation, it optimizes network coverage and interference resistance. The 320MHz channel and 4K QAM technology provide high-speed transmission capabilities, supporting applications such as high-definition video playback, efficient file downloads, and smooth video conferencing.

The SIMCOM SIM8262E-M2 is a multi-band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module that supports R16 5G NSA/SA, with a transmission speed of up to 2.4Gbps. It has strong expandability with rich interfaces, including PCIe, USB3.1, GPIO, and more. It is compatible with terminal devices requiring high module dimensions and network speed, such as laptops, drones, industrial tablets, MiFi, dongles, DTUs, and AR/VR headsets.

Scenario Adaptability: Unlocking Application Value Across Multiple Fields

The 5G indoor CPE BE17000 Wi-Fi 7 Mesh Router, with its reliable performance, is suitable for various scenarios:

  • Commercial Office Scenarios: It builds a stable office network environment for enterprises, supporting the needs of multiple people working online simultaneously, video conferencing, and enhancing collaboration efficiency.
  • Home Use Scenarios: It meets the multi-device networking needs within homes, providing a smooth experience for audiovisual entertainment and smart home device integration.
  • Industrial Application Scenarios: In industrial parks, warehouses, logistics, and other environments, it ensures stable data transmission, supporting remote management and monitoring of smart devices, and promoting the development of industrial internet applications.

With the continuous expansion of AI applications, high-speed, stable, and adaptive connectivity will play a crucial role in various industries, opening new development opportunities for intelligent manufacturing, smart healthcare, smart cities, and more. SIMCom will continue to increase R&D investment, drive technological innovation, and work with partners to build an interconnected smart world.

SIMCOM AI 5G 6G Products in MWC 2025

AI
At this year’s MWC, Artificial Intelligence (AI) was undoubtedly the brightest star. With the explosion of generative AI technology, more and more companies are starting to apply it across various fields. From intelligent customer service to autonomous driving, from content creation to office collaboration, AI is gradually permeating every aspect of our lives. Especially in the fields of consumer electronics and payments, the integration of AI technology has made devices such as smartphones, PCs, smart glasses, smart payment systems, and smart toys more intelligent and personalized.

SIMCOM participated in this year’s MWC by showcasing a series of products, such as the high-performance smart module SIM9650L and the 4G smart module SIM8965. These modules integrate cutting-edge AI algorithms and hardware design, providing powerful computing and data processing capabilities, thus driving the intelligent upgrade of smart terminal devices.

SIMCOM also made its debut by launching the SIMCom AI Stack, a full-stack AI solution based on its AIoT module matrix, aimed at helping customers address the pain points in the practical application of AI on the edge. This solution helps to build a complete and efficient value chain for edge-side AI.

In the future, SIMCOM will soon introduce more high-performance smart modules, working with global partners to accelerate the implementation of edge-side AI applications.

5G

As the upgraded version of 5G technology, 5G-Advanced (5G-A) also attracted significant attention at this year’s MWC. 5G-A not only improves network performance but more importantly, it begins to deeply integrate with various industries, driving digital transformation across sectors.

At the exhibition, several telecom operators showcased practical use cases of 5G-A technology in fields such as industrial IoT, low-altitude economy, and remote healthcare. Major telecommunications equipment manufacturers also demonstrated end-to-end solutions and industry application cases based on 5G-A technology, gradually bringing 5G-A technology to life.

SIMCOM has also strategically entered the 5G-A field early on. The SIMCOM SIM8390, an upgraded version of 5G, supports Sub-6GHz and mmWave frequency bands, offering higher speeds, lower latency, greater connection scale, and lower energy consumption. It has become favored by industry customers in high-speed applications and premium markets in Europe.

SIMCOM’s 5G-A strategy focuses not only on technological upgrades but also on industry adaptability. By collaborating with operators and equipment manufacturers, SIMCOM offers end-to-end solutions that help customers quickly integrate the full chain from network deployment to application, acting as an “accelerator” for enterprise digital transformation.

6G

At this year’s MWC, many companies showcased their latest research results and future plans regarding 6G technology.

Currently, 6G technology is expected to be fully commercialized around 2030, with transmission rates potentially reaching 1Tbps, far exceeding current 5G capabilities. Additionally, 6G will support AI-native networks, holographic communication, low Earth orbit satellite networks, and other advanced technologies, driving the arrival of the Internet of Everything era. In the consumer electronics sector, the introduction of 6G technology will empower smart terminal devices with higher performance and richer functionalities.

Although the commercialization of 6G is still some years away, SIMCOM has already laid the groundwork for its technological advancement. In 2023, the company launched the SIM7070G-HP-S, a satellite communication module supporting 3GPP NTN (Non-Terrestrial Networks). This module supports 3GPP Rel-17 (IoT-NTN) satellite communications in the L-band (B255) and S-band (B256/B23) frequency ranges. It also supports Cat-M/Cat-NB2 wireless communication modes and can be applied in maritime, transportation, agriculture, and energy sectors, contributing to the promotion and implementation of satellite IoT applications.

This year’s MWC 2025 highlighted three cutting-edge technologies: AI, 5G-A, and 6G, showcasing the latest trends and innovative achievements in the global telecommunications industry. As a pioneer in the global IoT communication module industry, SIMCOM actively participated and demonstrated its strong capabilities and forward-thinking vision in the field of communication technology. As these technologies continue to develop and be applied, we will usher in a more intelligent, digital, and interconnected future.

Quectel 5G RedCap Module RG255C-GL Passes Certification from Two Major North American Operators

Recently, Quectel’s 5G RedCap module RG255C-GL achieved another milestone by successfully passing the certification from two major North American operators. This certification marks that the module now fully meets the high standards of North American carriers, offering more efficient and reliable RedCap connectivity to local users, further strengthening Quectel’s competitive edge in the global IoT market.

Technological Innovation: Lightweight 5G Empowering Vertical Industries

The Quectel RG255C-GL module is based on the Qualcomm® Snapdragon® X35 platform and is equipped with 5G RedCap technology, specifically designed for high-speed IoT scenarios. As a lightweight 5G technology defined by the 3GPP R17 standard, RedCap reduces the number of terminal antennas, lowers modulation complexity, and decreases bandwidth requirements. While retaining key 5G benefits like low latency, high reliability, and network slicing, it significantly optimizes device cost, size, and power consumption, filling the market gap between traditional eMBB and LPWA.

This 5G Redcap module supports 5G Sub-6 Standalone (SA) mode and LTE Cat 4 networks, with peak download speeds of 223 Mbps and peak upload speeds of 123 Mbps, making it suitable for entry-level FWA applications, industrial sensors, and high-definition video transmission in mid- to high-speed IoT scenarios. It also supports key 5G features such as 5G LAN, uRLLC, and network slicing. In terms of positioning, the RG255C-GL integrates Qualcomm® IZat™ location technology, supporting global mainstream satellite positioning systems such as GPS, GLONASS, BDS, Galileo, and NavIC, providing precise location services for smart terminals.

High Integration Design: “Compact Size” Empowering “Large Scenarios”

The Quectel RG255C-GL adopts an LGA package with dimensions of 32.0 mm × 29.0 mm × 2.4 mm, making it compact in design. The Quectel 5G module’s size is consistent with and compatible with Quectel’s classic LTE Cat 4 module EG2x series, significantly reducing the hardware adjustment requirements for customers migrating from 4G to 5G, shortening development cycles, and lowering mass production costs. Additionally, the Quectel 5G module integrates a variety of interfaces, including USB 2.0, PCIe 2.0, PCM, UART, SGMII, and SPI, and can be paired with multiple Quectel antennas, helping terminal manufacturers quickly bring products to market and seize business opportunities.

Previously, the Quectel RG255C-GL had successfully obtained GCF global certification, North American FCC, IC, PTCRB certifications, European CE certification, and Australian RCM certification. With this latest certification from two major North American operators, the module will promote the large-scale deployment of 5G RedCap technology in global FWA and industrial automation scenarios. Moving forward, Quectel will continue to deepen its cooperation with global operators and industry partners, empowering the digital transformation of various industries with innovative technologies.

Fibocom Launches LPWA Cat.M Module MQ780-GL

On March 5, during the 2025 World Mobile Congress (MWC Barcelona 2025), Fibocom unveiled the compact Cat.M module MQ780-GL, based on the Qualcomm® E51 4G modem and RF solution. The Fibocom MQ780-GL, with its four core advantages of ultra-compact size, ultra-low power consumption, global frequency band coverage, and stable network compatibility, provides cost-effective IoT connectivity solutions for scenarios such as smart metering, asset tracking, and smart cities, accelerating the commercialization of LPWA technology on a large scale.

Dual-Mode Support, Flexible Deployment

Fibocom MQ780-GL supports 3GPP Release 14 Cat.M1 and NB-IoT standards, allowing automatic mode switching based on the network environment to maximize coverage and connection reliability. The 4G LPWA module is compatible with global mainstream frequency bands, suitable for LPWA network deployments in North America, Europe, Asia, and other regions, facilitating stable global connections.

Compact Size, Ultra-Low Power Consumption

Fibocom MQ780-GL incorporates advanced power management technology, supporting PSM (Power Saving Mode) and eDRX (extended Discontinuous Reception) functions, significantly extending the battery life of devices. In PSM mode, the standby current is as low as microampere level (μA), making it suitable for devices such as water meters and gas meters that require more than 10 years of battery life. The Fibocom 4G module adopts an LCC+LGA package design, suitable for space-constrained IoT devices.

Enhanced Performance, Rich Interfaces

Fibocom MQ780-GL supports a variety of network protocols such as MQTT/CoAP/LwM2M, and is compatible with standard interfaces such as UART/I2C/I2S, facilitating expansion to more IoT devices. In terms of positioning capabilities, the MQ780-GL has built-in Soft GPS positioning function, meeting the high-precision positioning needs of scenarios such as asset tracking. Fibocom MQ780-GL also has a built-in hardware-level security engine, supporting data encryption and security authentication, ensuring the security of device and network communication.

Fibocom and MediaTek Collaborate to Demonstrate FG370 Module with Modem AI and 3Tx+L4S

On March 5, during the 2025 Mobile World Congress (MWC Barcelona 2025), Fibocom and MediaTek jointly demonstrated the technical performance of the FG370 module based on the MediaTek T830 platform, featuring Modem AI and 3Tx (3-antenna transmission) + L4S (Low Latency, Low Loss, and Scalable Throughput). These features meet the product development needs of global leading operators for 5G FWA (Fixed Wireless Access) and MiFi (Mobile Broadband) in their respective application scenarios, including precise network prediction, intelligent network selection strategies, and optimized air interface performance.

Fibocom FG370, equipped with MMAI (MediaTek Modem AI), significantly enhances network connection efficiency in four weak-signal scenarios: high-speed railways, underground environments, airports, and remote suburban areas. In airports, AI-driven network prediction improves network search speed by over 50%. In outdoor mobile scenarios, MMAI provides an AI hiking mode, optimizing weak-signal and high-power consumption issues, resulting in a 10% energy saving for devices. In high-speed railway scenarios, Fibocom 5G AI module with MMAI ensures faster and more stable terminal connectivity, while in underground environments, it enables rapid 5G network recovery.

Most connected terminals support only two transmission chains, which greatly limits uplink throughput. Fibocom FG370, applied in 5G FWA and MiFi, utilizes 3Tx technology to support three transmission chains, significantly boosting peak uplink throughput. According to Fibocom’s lab tests, compared to 2Tx, 3Tx can increase throughput by up to 68% by adding spatial streams. The L4S technology provides terminals with a low-latency, low-packet-loss, and scalable throughput network experience. Tests show that combining 3Tx and L4S delivers 1.9 times the bandwidth of 2Tx while significantly reducing latency.

Additionally, The FG370 5G AI Module supports 8Rx and 3GPP Rel-17 standards, including HUPE TDD PC2/PC1.5 and FDD PC2 communication capabilities, greatly improving signal quality at the cell edge and enhancing throughput. Fibocom assists global leading operators in rapidly developing 5G FWA and MiFi products, reducing development costs while improving efficiency. Based on user needs, Fibocom will continue to develop and support key 5G technologies, enabling the widespread adoption of 5G FWA and MiFi in more scenarios.

QuecPi Alpha Open-Source Smart Ecosystem Development Board by Quectel Launches at MWC

At the 2025 World Mobile Communication Conference (MWC), Quectel officially launched its QuecPi Alpha smart ecosystem development board for the global market.

The development board, built on the Qualcomm Snapdragon™ QCS6490 processor, is compatible with multiple open-source operating systems. It boasts high performance, rich multimedia capabilities, high integration, a variety of interfaces, low power consumption, broad applicability, and low development costs.

As an open-source innovation product focused on ecosystem building, the QuecPi Alpha aims to provide an efficient, flexible innovation platform to accelerate breakthroughs in edge-side intelligent technology and promote the rapid implementation of related applications.

Quectel’s Chief Operating Officer Zhang Dong said, “We are always committed to providing developers and enterprise users with efficient, flexible innovation platforms. The launch of QuecPi Alpha is a significant breakthrough for Quectel in the edge computing and open-source ecosystem fields. We believe this product will bring more possibilities to the AIoT industry, driving the widespread application of smart technologies globally.”

Open-Source, Efficient, Flexible

QuecPi Alpha is powered by the Qualcomm Snapdragon QCS6490 processor, featuring an 8-core CPU, 8GB/4GB LPDDR4X RAM, and up to 12 TOPS of AI computing power. It supports open-source operating systems like Linux and Ubuntu and is equipped with Qualcomm® Adreno™ 642L/643 GPU, showing outstanding flexibility and efficiency in processing AI tasks such as image and video data.

Additionally, QuecPi Alpha supports dual-display functionality, compatible with both DisplayPort (DP) interfaces and LCM (liquid crystal module), or DP and HDMI (high-definition multimedia interface). This feature provides developers with abundant display options, expanding application scenarios and enabling QuecPi Alpha to meet the high-speed, multimedia, and AI computing requirements in industrial and consumer applications.

Wide Application in AIoT Scenarios

With its powerful AI capabilities and high flexibility, QuecPi Alpha can meet the diversified needs of object recognition, image recognition, and other functions in numerous AIoT application scenarios, even in complex environments, providing reliable technical support for customers.

For example, in intelligent transportation and smart security, QuecPi Alpha can quickly and accurately identify and label vehicles, license plates, pedestrians, and other objects in complex scenarios, demonstrating its exceptional performance in edge computing and low-latency processing. This ability significantly enhances data transmission and processing efficiency, providing strong support for real-time decision-making in areas like traffic management.

QuecPi Alpha also integrates Wi-Fi 2.4 & 5G, IEEE 802.11a/b/g/n/ac, and Bluetooth 5.0 technology, with a Type-C power interface, external eMMC and SSD support, and a variety of peripheral interfaces, including PCIe, USB 3.1 Type-C, (U)SIM, UART, GPIO, MIPI camera interface, HDMI output, and gigabit Ethernet interface.

These features cater to developers and intelligent terminal manufacturers’ diverse development needs, covering AIoT industry applications like AI edge computing, industrial robots, service/companion/education/entertainment robots, industrial control, multimedia terminals, digital signage, and smart homes.

Building the Open-Source Ecosystem

In addition to excelling in traditional industrial fields, QuecPi Alpha also offers numerous impressive application scenarios in the open-source ecosystem, reshaping our lives with cutting-edge technology.

Developers in the digital lifestyle field can use QuecPi Alpha to build personalized home media centers, offering an intelligent audio-visual entertainment experience.

Smart security companies can use QuecPi Alpha’s open-source image recognition algorithm library to achieve accurate identification and tracking of people and vehicles and intelligently analyze abnormal behaviors like intrusions and loitering, ensuring safety.

Research teams can develop on the QuecPi Alpha development board, leveraging open-source deep learning frameworks and algorithm libraries to accelerate research and explore the infinite possibilities of artificial intelligence.

To further accelerate customer product launch, Quectel provides comprehensive, multi-level software customization services and value-added services, including system customization and optimization, industry function customization, full-spectrum multimedia services, hardware and device debugging, algorithm development, and product certification assistance.

It is noteworthy that the QuecPi Alpha smart ecosystem development board offers a long lifecycle, with stable supply guaranteed until 2036, meeting the needs of industrial and consumer smart devices for longevity and high reliability.

Currently, the development board is in the engineering sample stage, and developers worldwide can purchase it through 4gltemall.com store and other e-commerce channels for product development and testing. Quectel also provides technical support to developers purchasing engineering samples, assisting them with any issues encountered during product development.

SIMCom Unveils Full-Stack AI + Multi-Module Matrix at MWC 2025 Barcelona

From March 3-6, the highly anticipated “MWC 2025 World Mobile Communication Conference” was grandly held in Barcelona, Spain. As the premier event in the global mobile communication industry, MWC 2025 gathered the world’s top tech innovators and industry leaders. At this conference, SIMCom showcased its AI and GNSS modules, along with products and terminals spanning 5G, 4G, LPWA, and other fields. These can be applied in various scenarios such as smart payments, smart vehicles, smart industries, smart healthcare, and smart cities, demonstrating SIMCom’s deep expertise and latest achievements in the AIoT field.

Europe, the world’s second-largest IoT market, is undergoing a profound transformation from “scalable connectivity” to “intelligent and low-carbon solutions.” As a leader in the IoT communication sector, SIMCom chose Europe as one of its primary expansion destinations from the early stages, winning widespread recognition in the European market through years of accumulation and innovation.

SIMCom AI Stack: Full-Stack AI + Multi-Module Matrix Sparks Attention

On the first day of the exhibition, SIMCom’s Vice President Wang Benxi ignited the audience with a specialized AI presentation and unveiled SIMCom’s first full-stack AI solution.

SIMCom AI Stack is a full-stack AI solution carefully crafted by SIMCom for edge-side intelligent applications, offering computing power configurations ranging from 1 TOPS to over 40 TOPS. Built on the SIMCom AIoT module matrix, it integrates cutting-edge AI algorithms and efficient hardware design, covering a wide range of AI models and practical tools. This provides users with the core engine for the era of connected intelligence.

From smart home interactions to precision detection in smart industries, SIMCom AI Stack offers robust technical support for intelligent upgrades across various industries, injecting tremendous power. It quickly attracted the enthusiastic attention and discussions of the audience upon its debut.

5G, AI, GNSS Modules: Multi-Faceted Evolution

In addition, SIMCom’s Regional Sales Director for Europe, Mads Wendelin Fischer, delivered a keynote focusing on next-generation products. He shared SIMCom’s series of R&D achievements in 5G, AI, and GNSS fields, including the domestically developed 5G module A8230, the high-performance AI module SIM8965, and the cost-effective single-frequency 4-star GNSS modules SIM32EA and SIM65M-C. These modules have been optimized in terms of platform, performance, size, power consumption, and compatibility, providing richer and more flexible solutions to global customers.

In the 5G field, SIMCom’s A8230 module, based on the domestically developed ASR1903 platform, is a compact, lightweight, and cost-effective 5G RedCap module. It adopts 3GPP Rel-17 RedCap technology, backward compatible with 4G, supports 5G SA mode, multi-access edge computing, and other advanced features, making it ideal for applications in smart homes, wearable devices, industrial automation, and smart cities.

In the AI field, the SIM8965 module is a high-performance 4G Android intelligent module equipped with a Qualcomm 8-core 64-bit Kryo260 processor, with a frequency of up to 2.0GHz, an Adreno 610@950MHz GPU, and dual HVX512. It supports multiple HD cameras and capacitive touchscreens, delivering high-speed data transmission and multimedia AI processing capabilities.

In the GNSS field, SIMCOM SIM32EA supports four satellite systems: GPS, GLONASS, Galileo, and QZSS, with 47 GNSS receiving channels. It can simultaneously receive and process multiple satellite signals. Integrated with an antenna for easy design, its AIROHA high-sensitivity navigation engine ensures high sensitivity, accuracy, and fast first-fix time (TTFF) while maintaining low power consumption.

SIMCOM SIM65M-C module, with its compact size and support for five satellite systems (BEIDOU, GPS, GLONASS, GALILEO, QZSS), high cost-performance, and CE, ROHS, and REACH certifications, is an ideal choice for global GNSS customers.

Scene-Based Implementation: Edge AI Leading Digital Transformation

At the MWC 2025 venue, SIMCom’s booth was crowded with attendees, and the new generation of modules captured the attention of numerous professionals and media. The launch of SIMCom AI Stack sparked intense discussions.

During the exhibition, SIMCom also showcased its high-end modules such as the 5G RedCap series SIM8230, the 5G series SIM8270, SIM8260, as well as high, mid, and entry-level intelligent modules, catering to various needs for computing power and frequency bands. Meanwhile, the 4G module series A7683E, SIM7600, and LPWA module series Y7080E, SIM7070 were also presented. These modules can be widely applied in scenarios like smart factories, vehicle-road collaboration, low-carbon cities, and robotics, helping drive the digital and green energy transformation of industries in the European market and embedding edge AI across various industries.

Looking ahead, SIMCom will continue to focus on cutting-edge technological trends, launching smarter and more efficient products and solutions. Together with global partners, it will continue to push forward the development of the IoT communication industry, contributing more wisdom and strength to the prosperous development of the global IoT industry.

Quectel Launches 5G Module RG620UA-EU with Support for 3GPP R16

On February 28, Quectel, in collaboration with UNISOC, officially launched the RG620UA-EU module, which fully supports 5G R16 features. The Quectel 5G module is developed based on the UNISOC V620 platform, equipped with a 4-core Arm® Cortex®-A55 CPU, and complies with the 3GPP R16 standard. It excels in transmission rates, computing power, and key R16 features, offering excellent 5G connectivity performance for various sectors such as Fixed Wireless Access (FWA) and industrial manufacturing.

Quectel COO Zhang Dong stated, “The launch of RG620UA-EU is another significant achievement in the deep cooperation between Quectel and UNISOC. This 5G AI module not only meets the demand for high-speed and stable connections in the FWA market but also demonstrates great potential in the industrial intelligence and AI application sectors. It injects new vitality into the thriving 5G market and will provide users with a richer, more diverse, and intelligent 5G connectivity experience.”

UNISOC Executive Vice President Zhou Chen commented, “UNISOC has been deeply focused on the 5G vertical industry sector for many years. The V620 is the next-generation product from UNISOC, providing deeper empowerment for 5G FWA and vertical industries. Quectel is an in-depth partner of UNISOC, and the launch of RG620UA-EU will further empower industries such as industrial manufacturing globally. Both parties will continue to work together to promote the widespread application of 5G technology, supporting the digital transformation of various industries.”

Targeting the FWA Market, Adapting to Users of Different Scales

Globally, the FWA market is experiencing rapid growth, with tremendous market potential. Quectel’s RG620UA-EU performs excellently in terms of network coverage, transmission speed, and connection stability, perfectly meeting the demands of the 5G FWA market.

Quectel RG620UA-EU supports both 5G Standalone (SA) and Non-Standalone (NSA) networks, backward compatible with 4G and 3G, and is adaptable to major networks worldwide. It also supports mainstream frequency combinations such as NR CA, LTE CA, ENDC, and others for more efficient data transmission and better network coverage. Additionally, the module supports HPUE PC1.5, improving coverage range and signal transmission quality by 3dB compared to PC2.

In terms of transmission speed, RG620UA-EU supports Super Uplink technology and a variety of non-supplementary uplink (NUL) and supplementary uplink (SUL) combinations, meeting the demand for high-speed network connections in various application scenarios. In SA networks, the module can achieve a maximum downlink speed of 4.67 Gbps and an uplink speed of 1.875 Gbps, offering an ultra-fast connection experience to users.

Additionally, Quectel has deeply analyzed the network needs of users of different scales and will launch a series of targeted overall solutions for FWA, focusing on cost control, functional expansion, and service upgrades.

Empowering the 5G to B Sector with Full Support for R16 Features

Beyond the FWA market, the RG620UA-EU also has great potential in the 5G to B industry, especially in the industrial sector.

With the support of the UNISOC V620 platform, the RG620UA-EU fully supports 5G R16 features, including 5G TSN (Time Sensitive Network), 5G LAN, URLLC (Ultra-Reliable Low Latency Communication), high-precision positioning, high-precision timing, low power consumption, and more. This injects new vitality into its application in industrial sectors, further driving the development of industrial intelligence.

Quectel RG620UA-EU brings revolutionary changes to industrial IoT by introducing 5G technology into industrial TSN networks. It supports indoor high-precision positioning, ideal for scenarios requiring precise tracking of personnel, materials, AGVs, and other targets. With an average RTT (Round-Trip Time) of up to 8ms, it is suitable for industrial applications requiring strict latency, such as industrial robot control and remote PLCs. The module also supports R16 low-power features such as WUS (Wake-Up Signal) and UAI (Uplink Assistance Information), further reducing the power consumption of terminal devices, extending device lifespan, and providing reliable assurance for large-scale deployment of industrial IoT.

AI Empowerment, Achieving Diverse Application Scenarios

As AI technology becomes more widespread, large models like DeepSeek are gradually entering the public’s view, bringing efficiency improvements to work and life. Notably, the RG620UA-EU has the capability to access the DeepSeek-R1 model. Additionally, the module supports integration with Quectel’s AI solutions developed for various application scenarios, enabling intelligent voice interaction and other functions, opening up more possibilities for AI-based applications.

Furthermore, the RG620UA-EU supports high-config LPDDR4x and FLASH storage, fully meeting third-party storage requirements.

The RG620UA-EU adopts an LGA package with dimensions of 44×53×2.95mm. It is equipped with a rich set of functional interfaces, including USXGMII, PCIe3.0, USB3.1, SDIO3.0, UART, SPI, I2S, I2C, GPIO, and more, greatly expanding its application range. It can be widely used in 5G FWA, 5G handheld terminals, laptops, gateways, and other fields. The module also supports dual-SIM functionality, catering to scenarios that require eSIM or soft SIM, providing users with great flexibility and convenience.

With the continuous development and popularization of 5G and AI technologies, the IoT sector will usher in even greater development prospects. Moving forward, Quectel will continue to collaborate with UNISOC to drive technological innovation and inclusive development, delivering higher-quality and more efficient products and solutions to clients, supporting the digital transformation of various industries.