SIMCom has officially announced its collaboration with Skylo, a pioneer in non-terrestrial network (NTN) communications, to commence the NTN certification process for its SIM7070G-HP-S module.
The SIMCOM SIM7070G-HP-S module, which is now undergoing certification, is an NTN module independently developed by SIMCom specifically for satellite IoT scenarios. It supports the 3GPP Release 17 5G IoT-NTN standard and is compatible with global satellite networks. Featuring an LCC+LGA package, the SIMCOM 5G module offers extensive interfaces and strong scalability. Its compact dimensions of 24×24×2.3mm allow for flexible integration into the design of various miniaturized IoT devices.
Leveraging SIMCom’s mature low-power technology, the SIM7070G-HP-S can extend device battery life to up to 10 years through Power Saving Mode (PSM) and extended Discontinuous Reception (eDRX) technologies. It offers coverage superior to GSM and is well-suited for satellite IoT communication scenarios that require low latency and low throughput.
The initiation of the NTN certification for the SIM7070G-HP-S module marks a deepening of the existing partnership between SIMCom and Skylo and represents a significant step in SIMCom’s strategic expansion into the satellite IoT sector. By combining its strengths in module R&D, manufacturing, and global presence with Skylo’s satellite network resources, SIMCom aims to transcend the limitations of traditional terrestrial networks and provide seamless, reliable connectivity for customers worldwide.
The SIM7070G-HP-S is suitable for a wide range of applications, including asset tracking, smart metering, and remote monitoring. It effectively fills connectivity gaps in remote areas, further expanding the application scope of SIMCom’s product portfolio. Moving forward, SIMCom will work with Skylo to accelerate the certification process, promote the global deployment of their solutions, achieve ubiquitous IoT coverage, and foster the high-quality development of the satellite IoT industry.
On March 31, Fibocom announced that its 5G module Fx550, developed based on Samsung’s Exynos Modem platform (including the LGA-packaged FG550 and M.2-packaged FM550), has officially entered mass production. The launch and mass production of this product not only mark the in-depth implementation of the strategic cooperation between Fibocom and Samsung but will also provide connection solutions with ultimate performance and excellent reliability for global 5G FWA (Fixed Wireless Access) and the broader IoT fields, such as wireless landlines, MiFi, and industry gateways.
A Powerful Alliance: Building New Heights in 5G Connectivity
This mass production is a core achievement of the deep strategic cooperation between Fibocom and Samsung. Samsung’s 5G chip solutions have been verified by massive shipments in the global market and are known for their high stability, excellent RF performance, and extensive global compatibility. Through technical integration, both parties aim to leverage their respective advantages in underlying chip architecture and industry application accumulation to jointly promote the deep penetration and popularization of 5G technology in vertical industries worldwide.
Jungwon Lee, Executive Vice President of Samsung Electronics and Head of the System LSI Modem R&D Team, stated, “Samsung is pleased to deepen its strategic cooperation with Fibocom to jointly advance next-generation 5G connectivity solutions for the global market. The successful mass production of the Fibocom 5G module confirms our shared commitment to innovation, performance, and reliability in providing cutting-edge connectivity for Fixed Wireless Access (FWA) and broadband IoT applications. In the AI era, we are jointly building the cornerstone of a smarter, more interconnected industry.”
Tao Xi, Vice President of Fibocom’s Wireless Solutions Business Group and General Manager of the MBB Business Unit, said, “We are very honored to have reached an exclusive cooperation agreement with Samsung Electronics, to be the first to achieve large-scale mass production, and to have our product validated by the market in the broader IoT sector. With the simultaneous advancement of multiple regional versions of the Fx550, including EAU, JP, and MEA, Fibocom will help global enterprises achieve ‘acceleration’ in the high-speed connectivity race.”
Core Advantages: Fx550 Empowering Digital Transformation
The Fx550 module leverages the Samsung Exynos Modem platform to set a new industry benchmark in advanced processing, transmission standards, and networking flexibility.
Supports Rel.16 Standard, Empowering High-Reliability Communication The Fx550 is fully compatible with the 3GPP Rel.16 standard. With its low latency and high bandwidth characteristics, it precisely meets the demands of the FWA and broader IoT fields for real-time data interaction and large-capacity transmission.
Multi-Carrier Aggregation Technology, Breaking Through Speed Limits In SA mode, the Fx550 supports up to NR 5CC carrier aggregation (200MHz bandwidth), with a peak downlink speed of 4.67Gbps. Its differential capability to flexibly and efficiently aggregate discrete spectrum within a narrow RF bandwidth provides unique commercial value for global operators to enhance user experience, ultimately empowering industry and home customers. In NSA mode, the Fx550 supports up to NR 2CC + LTE 5CC aggregation, with downlink speeds reaching as high as 6.47Gbps. In LTE networks, the Fx550 supports up to Cat.20, perfectly covering global 4G network capabilities. Breakthroughs in multi-carrier aggregation technology can effectively help operators improve spectrum utilization and ensure ultra-fast connections in complex network environments.
Open Architecture, Optimizing System Costs The Fx550 adopts a high-performance Modem architecture and has completed in-depth adaptation with mainstream industry AP (Application Processor) solutions, such as Broadcom and Realtek. This deep compatibility gives developers more flexible design choices, allowing for optimal control of development costs while ensuring overall device performance. It also provides global ODMs with diversified product choices, helping end customers create product differentiation. In addition, the Fx550 is compatible with operating systems such as Linux, OpenWRT, RDK-B, and PrpIOS, which facilitates the rapid development of FWA devices, reuse of software assets, and quick upgrades to the latest Wi-Fi Mesh versions, improving the Wi-Fi compatibility of CPE devices.
Global Layout: Multiple Versions Covering Mainstream Markets
To meet the network access standards of different regions, the Fx550 has simultaneously launched multiple regional versions, including FG550-EAU(Europe/Asia/Australia), FM550-EAU (Europe/Asia/Australia), FG550-JP (Japan), FG550-NA (North America), and FG550-MEA (Middle East/Africa). Currently, the Fx550 can provide product services and technical support for multiple regions around the world.
The mass production of the Fx550 is a key step for Fibocom in building a global 5G ecosystem. In the future, Fibocom will continue to work with global industry partners like Samsung to delve deeper into 5G technology innovation. Through continuously iterated connectivity solutions, it will accelerate the prosperity and popularization of 5G FWA and IoT applications worldwide.
As pet owners’ demand for “scientific pet care” continues to evolve, pet collars are no longer just identification tags but have become intelligent terminals integrating positioning, health monitoring, and behavior analysis. With several core advantages, the Fibocom MQ771-GL perfectly meets the stringent requirements of this vertical market.
Ultra-Low Power Consumption in a Compact Size: Say Goodbye to “Battery Anxiety”
For pet owners, size and power consumption are the biggest pain points for smart collars. The MQ771-GL has been deeply optimized in both aspects.
MQ771-GL features an ultra-compact package (17.7mm × 15.8mm), helping customers optimize terminal space.
PSM mode as low as 1uA: Reduces power consumption in deep sleep mode, achieving a 70%-90% improvement compared to the previous generation.
eDRX technology: Significantly reduces standby current, ensuring the collar maintains ultra-low energy consumption when not in motion. Tests show that the battery life of pet devices can be extended from days to months, making long-term companionship possible.
Global Connectivity: Your Pet, Wherever You Are
Fibocom MQ771-GL supports mainstream global frequency bands for Cat.M / NB-IoT networks.
Multi-mode switching: Whether your pet is in a bustling city, a remote suburb, or even traveling abroad, the module automatically selects the optimal network.
Comprehensive Health Monitoring and Behavior Sensing
Fibocom MQ771-GL’s powerful processing capabilities support the integration of multi-sensor data, enabling developers to implement complex monitoring functions.
Behavior sensing: Precisely captures barking detection and activity frequency.
Physiological indicators: Supports efficient transmission of heart rate and respiratory rate monitoring data, enabling sleep quality analysis through data models and providing early warnings for potential health issues.
Sunzhi Liu, the general manager of Fibocom MTC business unit, said:
“The MQ771-GL is a milestone product in our deep commitment to the LPWA market. It combines Qualcomm’s advanced chip capabilities with Fibocom’s extensive communication expertise, aiming to provide the pet technology market with a highly integrated, cost-effective, and performance-advantaged platform. We look forward to collaborating with more customers to jointly expand the pet technology market.”
On March 11, during embedded world 2026, Quectel announced the official launch of its new-generation SH603FC series, an AI computing smart module based on MediaTek’s G520 chip platform.
As Quectel’s first high-performance module to feature this platform, the SH603FC series offers three variants: Wi-Fi 6, Wi-Fi 6E, and AP. It is designed to create an integrated intelligent hardware foundation for diverse scenarios such as industrial applications, robotics, smart retail, in-vehicle aftermarket entertainment devices, and edge computing, empowering various industries to achieve digital transformation and intelligent upgrades.
Robust Performance: Building the Cornerstone of Universal Intelligence
Quectel SH603FC series incorporates a CPU architecture featuring A78 + A55 cores, manufactured using TSMC’s 6nm process. It integrates a high-performance AI processing unit, enabling efficient on-device execution of complex AI model operations like facial recognition, product detection, and behavior analysis. This essentially equips terminal devices with a “smart brain,” facilitating a leap from passive response to proactive thinking.
This capability for “proactive thinking” is reshaping operational processes across industries:
On industrial production lines, real-time defect detection can immediately identify faulty products, significantly improving yield rates and efficiency.
For delivery robots, intelligent environmental perception allows for rapid identification of obstacles and path changes, enabling smoother and safer autonomous operation.
In smart stores, local analysis of foot traffic and customer behavior not only reduces reliance on cloud bandwidth but also ensures the privacy and security of commercial data from the source.
The Quectel AI module is not only equipped with a “smart brain” capable of handling complex AI computations but also possesses “sharp eyes” for capturing high-definition visuals. Its multimedia processing capabilities are particularly impressive, with the dual-screen display function precisely addressing the “one-device, multiple-screens” demands in sectors like commercial displays, in-vehicle aftermarket entertainment, and self-service kiosks. Through interface multiplexing solutions such as MIPI, eDP, and DP, the series supports dual-screen display at resolutions up to 2560×1600 at 60fps. This not only reduces hardware BOM costs but also expands the dimensions of interaction.
The flexible “one-chip, dual-screen” architecture elevates device interaction experiences to a new level.
On a vending machine, the main screen can loop 4K product advertisements, while the secondary screen displays real-time transaction QR codes and inventory information, achieving efficient synergy between advertising and transactions.
For smart payment terminals, the staff screen handles checkout operations, while the customer screen clearly shows the purchase details and promotional offers, enhancing transaction transparency and the consumer experience.
In in-vehicle aftermarket systems, the central control screen provides the driver with real-time information like navigation and vehicle status, while a screen for the passenger or a roof-mounted display can be used freely for entertainment, balancing driving safety with passenger experience.
Versatile Adaptability: Excelling in Diverse Application Environments
Leveraging its robust comprehensive performance and rich interface resources (such as PCIe, USB, RGMII, etc.), the SH603FC series has become a core driver for intelligent upgrades across multiple fields, injecting powerful momentum into the digital transformation of various industries.
In the industrial sector, it supports a wide operating temperature range from -35°C to +75°C, providing robust AI computing power and stable operation for industrial tablets and control equipment, facilitating real-time production data collection and analysis, and advancing the implementation of Industry 4.0.
In the smart retail sector, it empowers smart vending machines and self-checkout systems with intelligent payment processing and real-time inventory monitoring, making store operations more efficient and services more attentive.
In the commercial display sector, its high-definition display capabilities make content dissemination on advertising players and large-screen terminals more engaging, effectively enhancing brand presentation and communication efficiency.
Furthermore, the module features a compact LGA+LCC form factor and fully supports multiple operating systems, including Android 15, Yocto, and Ubuntu. It can be flexibly adapted to various devices such as robots, in-vehicle aftermarket entertainment systems, smart intercom recorders, and smart home appliances. It provides a one-stop hardware solution to meet the intelligent upgrade needs of different industries and scenarios.
Currently, samples for the SH603FC series are available for testing. Customers are welcome to inquire and collaborate to unlock the boundless possibilities of edge intelligence together.
On March 5th, Fibocom officially launched the FG205 module and a 5G MiFi solution based on the Qualcomm QMB415 platform. The QMB415 platform has been adapted for the Linux operating system. Leveraging a deeply customized hardware architecture and reduced storage requirements, it provides an optimized solution and more reliable supply stability for wireless broadband applications.
Deep Hardware Customization: Streamlined Design Directly Targeting Core MiFi Needs
Built upon the Qualcomm SM4450, the QMB415 platform has been highly customized for wireless broadband application scenarios. Unlike the redundant design of traditional smartphone chip platforms, this solution achieves “precision tailoring” in its architecture: it reduces redundant CPU processing power and eliminates the GPU, focusing specifically on network connection efficiency.
Software System: Linux OS Ends “Memory Anxiety”
The most significant highlight of the MiFi solution released by Fibocom is its support for the Linux operating system. Previously, most 5G SoC platforms utilized the Android operating system, which requires substantial memory capacity, typically ≥3GB. After adapting this solution to the Linux OS, the maximum memory requirement is only 1GB. This solution lowers the storage configuration, achieving cost-effectiveness while also significantly mitigating the supply and price risks associated with storage, an often “uncontrollable” factor.
Platform Evolution: Pin-Pin Compatibility for Rapid Iteration
To help customers shorten product time-to-market, this solution fully considers the continuity of hardware design. The Fibocom 5G module, based on the QMB415 platform, maintains the same dimensional layout as Fibocom’s FG180/190 series modules based on the Snapdragon X72/X75. Through pin-pin compatible design, device manufacturers can quickly switch between and iterate products with different performance levels on the same hardware platform without the need for redesigning the circuit board.
Regarding Wi-Fi adaptation for the Fibocom FG205, Fibocom will launch a series of solutions supporting Wi-Fi 5/6/6E/7. This will further enrich Fibocom’s MBB product portfolio, comprehensively meet the full range of customer requirements across different tiers, and provide the wireless broadband industry with solutions offering better cost optimization and more reliable supply.
On March 5th, during the Mobile World Congress (MWC) 2026 in Barcelona, Quectel, a global supplier of IoT total solutions, in collaboration with UNISOC, unveiled a new series of 5G modules based on UNISOC’s three major platforms: the 5G eMBB V620, V610, and the 5G RedCap V527. This new product matrix, characterized by high-end performance, compact design, and lightweight features, marks a new journey towards the large-scale application of the 5G Internet of Things.
Flagship Performance, Redefining the 5G Experience
The RG620UA/RM520UA series 5G modules, built on the UNISOC V620 platform, deliver robust 5G data rates, a quad-core A55 processor, rich Ethernet configurations, and Wi-Fi 7/Wi-Fi 6 connectivity. Simultaneously, they continue to optimize and innovate in areas such as ENDC combinations, RAM+ROM solutions, and adaptation for QuecOpen and OpenWRT/PrplOS. This precisely meets the urgent market demand for high-performance, highly flexible terminals in the 5G FWA sector.
Extreme Compactness, Unlocking New Possibilities for Portability
Targeting space-constrained scenarios like global portable terminals and power IoT applications, Quectel has launched the compact 5G modules RG258UB-GL/RG258UB-CN based on the UNISOC V610 platform. This series employs a highly integrated packaging process, reducing the volume by approximately one-third compared to traditional 5G LGA modules. This frees up more design flexibility for devices like portable mobile hotspots (MHS) and compact power terminals. They also deliver robust performance, fully supporting 5G SA/NSA dual modes and global full network compatibility, with an optimized RF solution to ensure signal stability. By selecting core domestic components, they effectively mitigate supply chain risks while achieving a better balance between performance and cost, helping customers quickly respond to the growing demand for consumer electronics and IoT portable devices in global markets.
Lightweight and Slim, Accelerating the Popularization of 5G
Based on UNISOC’s new generation high-performance 5G RedCap IoT communication chip, the V527, Quectel has introduced the RG155UC-CN lightweight module targeting the IoT market where cost and performance are both critical. This module features an ultra-small, ultra-thin design, reducing volume by 46% and thickness by 17% compared to traditional packaging. It supports a rich software ecosystem, significantly lowering the barrier to upgrading lightweight 5G terminals, and is widely adaptable to consumer and industrial terminals such as smart wearables, tablets, and industrial sensors.
Furthermore, the UniHALO solution, developed by Quectel based on UNISOC’s full range of 5G IoT platforms, has now been successfully adapted to the OpenWRT 24.10 version. This solution aims to provide developers with a more stable and efficient software development environment by simplifying the design process, improving system performance, and effectively reducing DDR and Flash resource overhead. It fully leverages hardware potential, further lowering the development threshold for 5G terminals.
Anchored by Customer Value, Building a Global Digital Future Together
Currently, Quectel 5G modules based on the three UNISOC platforms are widely deployed across various fields including smart industry, smart grid, smart logistics, and consumer electronics. The entire product series adopts low-power design, helping to improve terminal battery life by over 20%, deeply aligning with the “Dual Carbon” goals. The V527 and V610 platforms, with their high cost-performance ratio, lower the barrier to 5G access, injecting momentum into the digital development of emerging markets. The V620 platform, with its outstanding performance, provides a high-speed, low-latency network experience that is truly both “affordable and high-quality.”
MWC 2026 is in full swing, and the deep integration of AI and mobile communications has become one of the most-watched core trends on the exhibition floor!
Seizing the moment with a dual-product launch, SIMCom unveiled its second new 5G AI module, the SIM9780, following the debut of the AI computing module SIM9650W. Precisely targeting the intelligent automotive industry, this SIMCOM 5G AI module centers on a combination of 5G and 8 TOPS of practical computing power. It is tailored for core scenarios such as in-car navigation, integrated cockpit and parking systems, and intelligent in-car robots, delivering a “essential needs” solution for the transformation towards smarter vehicles.
Partners familiar with SIMCom know that we consistently adhere to the principle of “practical technology, implementation is paramount.” The SIMCOM SIM9780 precisely addresses the pain points of the automotive industry with three core highlights that clearly demonstrate its capabilities:
The Golden Combination of 5G + 8 TOPS: More Practical
The 8 TOPS computing power of the SIM9780 is perfectly suited for core requirements like in-car voice interaction, local data inference, and image recognition – avoiding wasted calculating while effectively controlling hardware costs. Paired with optional 5G NSA/SA dual-mode support, it is compatible with all major network standards and covers the frequency bands of over 200 global operators. With a downlink speed of up to 2.4Gbps, tasks like HD map updates, remote data interaction, and online video streaming are smooth and lag-free, achieving both sufficient computing power and guaranteed transmission speed.
Automotive Quality: Stability is Paramount
For automotive products, stability is always the top priority! The SIM9780 meets the demands of complex in-vehicle environments, supporting an ultra-wide operating temperature range from -40°C to +85°C. Whether in the cold north or the hot south, it operates stably. The LGA package design and multiple storage configuration options cater to the hardware requirements of different in-vehicle devices. Running on the Android 13 operating system and supporting multiple firmware upgrade methods, it simplifies development and maintenance, allowing partners to avoid unnecessary complications.
More Than Just Automotive: “Cross-Border” Versatility
Featuring a built-in Mali-G57 quad-core GPU supporting 4K@60fps video encoding/decoding and asynchronous multi-screen display, it can easily handle tasks like environmental perception and data computation for integrated cockpit/parking systems, and voice interaction and intelligent response for in-car robots. Rich interfaces including USB3.0 and MIPI allow flexible connection to external sensors, cameras, and central control screens for expanded smart functions. It is also adaptable to scenarios like in-car navigation, remote vehicle security monitoring, and in-vehicle infotainment systems.
Beyond its core automotive applications, the SIM9780 truly “shines across borders”! In addition to covering application scenarios such as integrated cockpit/parking, intelligent in-car robots, in-car navigation, remote vehicle security, and in-car audio/video, it can also easily empower devices like industrial PDAs and smart POS terminals – one module addressing diverse needs across multiple fields.
The debut of the SIM9780 marks another precise strategic move by SIMCom in the intelligent automotive arena. On the future path of smart mobility, SIMCom will continue to advance with global partners, leveraging more practical technology combinations to make the implementation of in-car intelligence simpler and more efficient, ensuring that every technological innovation genuinely empowers thousands of industries.
With the core theme of “The IQ Era,” MWC 2026 focuses on the deep integration of AI and mobile communications, serving as a vital platform for global technology companies to showcase core technologies and strategize for future. On the first day of the exhibition, SIMCom officially launched its new AI computing module, the SIM9650W. Eschewing the hype of extreme computing power, this 5G AI module centers on practical 12 TOPS computing power combined with full-scenario adaptability. Echoing the conference’s theme of AI implementation, it provides a cost-effective, implementable core solution for the intelligent transformation of diverse industries.
The SIMCOM SIM9650W breaks away from the misconception that “higher computing power is always better.” It focuses on actual industry needs, balancing performance and cost to precisely address the challenge of computing power during AI implementation across various sectors, truly enabling AI technology to enter practical application scenarios.
Key Specification Highlights
12 TOPS Practical Computing Power Core
Stable AI computing power reaching 12 TOPS. This can easily handle real-time analysis of multiple high-definition video streams and abnormal behavior recognition in security scenarios, as well as local data inference and device linkage control in industrial edge computing. It is also suitable for small to medium-scale AI applications in retail, government affairs, etc., covering diverse needs from basic intelligence to mid-to-high-end computing power, avoiding waste and maximizing cost-effectiveness.
Powerful Multimedia and Interaction Capabilities
Integrates an Adreno™ 643 GPU, supports 4K video encoding/decoding and dual-screen display with different content. It can smoothly support immersive graphics rendering for VR/AR devices and high-definition display with multitasking in smart cockpits, making multimedia interaction experiences smoother and more stable.
High-Speed, Stable Full-Scenario Connectivity
The SIMCOM 5G AI Module integrates 2×2 MIMO Wi-Fi 6E, supporting the 2.4GHz, 5GHz, and 6GHz bands with throughput up to 3.6Gbps. It also integrates Bluetooth 5.2, ensuring stable, high-speed data transmission for devices in dense wireless environments. Whether it’s real-time data synchronization between devices and the cloud in a smart factory or the immediate upload of customer traffic analysis data in a mall, reliable connectivity is guaranteed.
Industrial-Grade Reliability and Expandability
Features a wide operating temperature range from -35°C to +75°C, confidently handling challenges in complex environments like outdoor vehicles, unattended retail kiosks, and industrial sites. It offers rich hardware interfaces including multiple MIPI-CSI camera interfaces and PCIe Gen3, allowing flexible connection to various peripherals and adapting to complex environments like automotive, industrial, and outdoor retail.
What Can 12 TOPS Do?
12 TOPS of AI computing power means terminal devices can handle more complex, real-time AI tasks, moving from simple “seeing” to “understanding” and reacting quickly.
More Accurate Real-Time Visual Recognition
In smart retail scenarios, an intelligent weighing scale or self-checkout terminal equipped with the SIM9650W can process multiple camera streams simultaneously, instantly and accurately identifying hundreds of types of vegetables, fruits, or bakery items with similar shapes and colors, multiplying checkout efficiency.
More Complex Multimodal Analysis
In industrial quality inspection, devices can run multiple AI models concurrently, such as appearance detection, OCR reading, and abnormal sound analysis, performing comprehensive automated product inspection to enhance production quality and efficiency.
Smoother Immersive Interaction
For devices like helmets or service robots, 12 TOPS of computing power is sufficient to support real-time SLAM (Simultaneous Localization and Mapping), gesture recognition, and object interaction, providing users with a smooth and natural immersive experience.
Rich Scenarios: Empowering Intelligent Upgrades Across Industries
The SIM9650W can be widely applied in cutting-edge fields such as smart retail, smart industry, intelligent automotive, public safety, and emerging consumer electronics, delivering core value to customers:
Cost Reduction, Faster Time-to-Market
The practical computing power configuration avoids redundant investment. Combined with mature technical support, it effectively shortens customer product R&D cycles and reduces overall costs.
Enhanced Product Competitiveness
Balances performance, cost, and reliability, enabling customers to create more differentiated, competitive, and cost-effective terminal products.
Ensuring Stability and Ease of Implementation
Industrial-grade design ensures stable operation in complex environments. The validated computing platform significantly lowers the threshold and risk of AI project implementation.
Leading a New Direction for On-Device AI Implementation
Looking ahead, SIMCom will continue to iterate its AI module products guided by real-world industry demands, collaborating with global partners to drive deep integration of AI technology across thousands of industries. The goal is to make practical computing power a reliable support for enterprise intelligent upgrades and empower more partners to achieve efficient AI implementation.
On March 2nd, at Mobile World Congress (MWC) 2026, Fibocom, in collaboration with MediaTek, unveiled a flagship CPE solution based on the next-generation FG390 5G module and the Filogic 8800 Wi-Fi 8 chipset. This solution deeply integrates high-performance 5G-Advanced cellular capabilities with the ultimate wireless experience of Wi-Fi 8, delivering a more efficient, stable, and intelligent network access experience for global operators, enterprises, and home users. Representatives from MediaTek and Fibocom held a product launch ceremony at the event.
Powerful 5G and Wi-Fi 8 Convergence: The solution integrates the Filogic 8800 Wi-Fi 8 chipset and the Fibocom FG390 5G module based on MediaTek’s T930 platform, combining the technological advantages of 5G-A and Wi-Fi 8 to create a seamless, high-performance network connectivity experience for homes and small to medium-sized enterprises.
Intelligent Multi-AP Coordination: Intelligent collaboration among multiple APs reduces interference by over 40%, significantly improves spectrum efficiency, and enhances the smoothness of network connections during concurrent multi-device usage.
Coverage and Stability Optimization: Leveraging Enhanced Long Range (ELR) technology, the solution improves wall penetration capability and coverage range by 40% compared to Wi-Fi 7, ensuring stable connections even at the edge of the network area.
Low Latency and Throughput Breakthrough: Latency is reduced to sub-millisecond levels, and throughput is doubled, ensuring smooth operation even when 200+ devices are connected simultaneously.
Designed for the AI Era: Supports tri-band concurrency on 2.4/5/6GHz, ensuring reliable connectivity for AI terminals, AR/VR applications, and smart home networks.
On March 2nd, during the Mobile World Congress Barcelona 2026 (MWC Barcelona 2026), Quectel, in partnership with MediaTek, proudly launched a next-generation smart CPE solution. This innovative solution combines 5G-Advanced and Wi-Fi 8 technologies, powered by the MediaTek T930 platform.
The solution deeply integrates the high-performance 5G-A connectivity of the MediaTek T930 platform, the intelligent reliability of the Wi-Fi 8 solution, AI-enhanced capabilities, and Quectel’s profound expertise in the global Fixed Wireless Access (FWA) market. Transcending the mere concept of “high speed,” this solution aims to provide a holistic CPE solution for both home and enterprise users, delivering super performance, exceptional stability, and AI-driven intelligent management. It is designed to catalyze transformative leaps in scenarios such as broadband access, mobile office, enterprise networking, and industrial internet. During the exhibition, the prototype based on this solution made its public debut at the Quectel booth (5A19), becoming a focal point of the show.
Technical Core: Deep Collaboration of 5G-A, Wi-Fi 8, and AI – More Than Just Speed
The solution is built upon Quectel RG660MK series module, leveraging MediaTek’s advanced 4nm process T930 5G platform. It integrates a 3GPP R18-compliant 5G-A modem, a quad-core CPU, a dedicated network processing unit, and achieves chip-level deep collaboration with Wi-Fi 8 technology, delivering a revolutionary intelligent connectivity experience for users.
Wide Area Coverage, Stable Signal Support for 8Rx reception technology increases spectral efficiency at the cell edge by 40%, thereby extending 5G signal coverage by 40% and significantly improving the number of users that can access the cell. Whether in home corners, large enterprise buildings, or areas with weak signals, stable and high-speed 5G connectivity is ensured.
Tri-Band Uplink, More Efficient Connection Support for 3Tx (5L) uplink technology adds a third transmitting antenna, boosting signal strength and uplink transmission efficiency. This not only effectively enhances network coverage and stability for multiple users online simultaneously but is also particularly suitable for high-bandwidth, low-latency application scenarios, empowering smart homes and enterprise innovation.
Ultra-Low Latency, Smoother Interaction The solution incorporates MediaTek’s L4S (Low Latency, Low Loss, Scalable Throughput) software feature. While ensuring high throughput, it can reduce critical network latency to 1/20th of traditional solutions. This provides a foundational network capability for latency-sensitive applications like cloud gaming, remote real-time control, and high-definition video conferencing, enabling online interactions to feel as smooth as face-to-face communication.
Local Networking, Intelligent Interference Immunity Through Wi-Fi 8’s Coordinated Spatial Reuse (Co-SR) and Coordinated Beamforming (Co-BF) technologies, the solution enables intelligent coordination and scheduling among multiple access points. In device-dense environments like smart homes, shopping malls, hotels, and offices, it significantly reduces co-channel interference, boosting overall transmission efficiency by over 25%. Even with hundreds of devices connected simultaneously, each terminal operates smoothly, easily resolving issues like lag and disconnections in multi-device networking.
Dynamic Optimization, Handling Congestion with Ease Leveraging Wi-Fi 8’s Dynamic Spectrum Management technology, the solution can intelligently allocate channel resources during network congestion, significantly alleviating traffic jams in high-load scenarios. This boosts device throughput in complex environments by up to 80%, ensuring the network remains robust even when multiple users are simultaneously engaged in 4K streaming, large file downloads, and video calls.
More Open AI Scalability By flexibly integrating a dedicated NPU processor, the solution equips the 5G CPE device with powerful edge AI computing and intelligent interaction capabilities. This enables autonomous scheduling and optimization of network resources, localized intelligent voice interaction, and dynamic distribution of tasks across the end, edge, and cloud, evolving the network from “passive connection” to “active service.”
