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* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor and snap-in socket option

* Support 4G LTE Cat.1 frequency bands(B2/B4/B5/B8/B17)

* Region: Americas

* Very low power consumption

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and solder down or snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* B2, B4, B5, B17 4G LTE Cat 4 frequency bands

* LTE Advanced Pro Module

* Form factor: PCI Express M.2

* Category: LTE Cat.12

* Chipset/Processor: Qualcomm MDM9250

* DL to 600Mbps/UL to 150Mbps

* Supporting 24 worldwide LTE bands, including LTE-LAA and CBRS

* Control Options: APIs, AT Commands 

* firmware over-the-air (FOTA)

* Form Factor: Mini PCIe

* Pins: 52-pin

* Technologies:HSPA+,GPRS(Class 12),GSM,EDGE,HSDPA

* Frequency bands

- UMTS/HSPA+: B1/ B2 /B5 /B8

- GPRS/EDGE: 850/900/1800/1900 MHz