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* Sierra Wireless LTE-M and NB-IoT Module

* CF3 Form Factor: LGA

* LTE Cat-M1 Speeds: DL 590Kbps, UL 1100Kbps

* LTE Cat-NB2 Speeds: DL 127Kbps, UL 158Kbps

* Satellite Systems: GPS+Glonass

* Firmware: Secure boot, Pre-certified firmware

* Sierra wireless 4G LTE Module

* Target Market: Japan and Korea

* LTE Category 1

* Package type: LGA (Snap-in socket option)

* GNSS: BeiDou, Galileo, GLONASS, GPS, QZSS

* LTE DL 10Mbps, UL 5Mbps

* Sierra Wireless 4G LTE module

* LTE Category 20

* LTE DL 2Gbps, UL 211Mbps

* Satellite Systems: Galileo, Glonass, GPS, Beidou (Bands: L1 and L5)

* Firmware: Secure boot, Pre-certified firmware

* Industrial-Grade for harsh environments and extreme temperatures

* Dual SIM single standby (DSSS) switches

* Sierra Wireless WiFi & Bluetooth Module

* Mounting: SMD

* Bluetooth Specification: Bluetooth 4.2

* Frequency (GHz): 2.4

* WiFi 802.11 b/g/n/e/i

* Sierra Wireless WiFi & Bluetooth Module

* Mounting: SMD

* Bluetooth Specification: Bluetooth 4.2

* Frequency (GHz): 2.4

* WiFi 802.11 b/g/n/e/i

* 3G HSPA+/EDGE/GPRS/GSM Module

* CF3(common flexible form factor)

* Solder down or use snap-in-socket

* TCP+UDP+FTP+HTTP+HTTPS internet services

* ARM Cortex- A5 (550MHz) application core and dual QDSP6 (600MHz) telecom core

* Category: LTE Cat.4 embedded module

* CF3 Form Factor: LGA

* Snap-in socket option: Yes

* Chipset: Qualcomm

* Target Region: EMEA

* Support LTE frequency bands: B1, B3, B5, B8, B40, B41*

* Data Speed: DL 150mbps, UL 50mbps

* Location Service: GPS, Galileo, Glonass, Beidou

* Category: LTE Cat.4 embedded module

* CF3 Form Factor: LGA

* Snap-in socket option: Yes

* Chipset: Qualcomm

* Target Region: EMEA

* Support LTE frequency bands: B1, B3, B7, B8, B20, B28

* Data Speed: DL 150mbps, UL 50mbps

* Location Service: GPS, Galileo, Glonass, Beidou

* LTE Cat.6 M.2 Module

* Intel XMM7262 chipset

* Low power consumption

* DL 300Mbps and UL 50Mbps

* APIs or AT Commands control

* Only support for Lenovo Thinkpad P50 P70 Series laptops

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and solder down or snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* B2, B4, B5, B17 4G LTE Cat 4 frequency bands

* LTE Cat.6 Embedded Module

* Qualcomm Chipset 

* Technologies: UMTS,HSDPA,HSPA+,LTE

* Max Download Speed: 300 Mbps

* Max Upload Speed: 50 Mbps

* Control Options: APIs, AT Commands

* Model No: MC7354

* Category: 4G LTE Category 3 Module

* Manufacturer: Sierra Wireless

* Chipset: Qualcomm MDM 9615

* Form Factor: PCIe M.2

* Pins: 52-pin

* Model No: MC7355

* Category: 4G LTE Category 3 Module

* Manufacturer: Sierra Wireless

* Chipset: Qualcomm MDM 9615

* Form Factor: PCIe M.2

* Pins: 52-pin

* LTE Category 3 Embedded Module

* Support 4G LTE FDD Band B1, B3, B8, B9, B18, B19, B21, B26

* Technologies: LTE/HSPA+

* LTE DL 100Mbps, UL 50Mbps

* Carriers Approved: KDDI, Docomo

* Model No: EM7355

* Category: 4G LTE Cat. 3 Module

* Manufacturer: Sierra Wireless

* Chipset: Qualcomm MDM9615

* Form Factor: PCIe M.2

* DL 100mbps, UL 50mbps