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* Oryon CPU

* Adreno™ 830 GPU

* Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)

* Spectra™ ISP

* Adreno 8550 VPU

* Adreno DPU

* Neural processing unit

* Security processing

* Video encoder: 4K @ 120fps; 8K @ 30fps

* Video decoder: 4K @ 240fps; 8K @ 60fps

* Computing power of up to 80 TOPS

* Quectel Wi-Fi & Bluetooth smart module

* Android OS

* Form factor: LGA package

* Adreno™ 740 GPU

* IEEE 802.11be, 2 × 2 Wi-Fi MIMO

* 12GB LPDDR5X + 256GB UFS

* Quectel 5G Smart Board

* Based on Quectel SG560D 5G smart module

* Octa-core 1.9~2.7GHz CPU

* Adreno 643 GPU

* 12 TOPS NPU

* Support 5G/WiFi/Bluetooth/GNSS

* USB/Ethernet/RS232/RS485/CAN

* Support HDMI/eDP/MIPI CSI/SIM/SD

* Support Ubuntu/Android/Windows OS

* Quectel 5G Sub6 Module

* 5G/4G/3G multi-mode module with LGA form factor, optimized for IoT and eMBB applications

* Worldwide 5G and LTE-A coverage

* 5G NSA and SA modes

* SA data rates: 2.4Gbps (DL) / 900Mbps (UL)

* NSA data rates: 3.4Gbps (DL) / 550Mbps (UL)

* Quectel 5G Sub-6 GHz LGA Module

* 5G/4G/3G multi-mode module with LGA form factor, optimized for IoT and eMBB applications

* Worldwide 5G and LTE-A coverage

* 5G NSA and SA modes

* Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

* Feature refinements: DFOTA and VoLTE (optional)

* Quectel 5G Sub-6 GHz & mmWave IoT module

* 5G/4G/3G multi-mode module with LGA form factor, optimized for IoT and eMBB applications

* 5G NSA and SA modes

* Worldwide 5G, LTE-A and 3G coverage

* Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

* Feature refinements: DFOTA and VoNR / VoLTE (optional)

* Quectel 5G RedCap Module

* 5G: 5G RedCap, comply with the 3GPP Release 17 standards

* Worldwide 5G/ 4G coverage

* 5G SA mode, 5G LAN/ URLLC/ slicing supported

* 5G: Max. 220Mbps (DL)/ Max. 100Mbps (UL)

* LTE Max. 150Mbps (DL)/ Max. 50Mbps (UL)

* Quectel 5G Sub-6GHz IoT module

* 5G/4G/3G multi-mode module with LGA form factor, optimized for IoT and eMBB applications

* Both NSA and SA modes supported

* Worldwide 5G, LTE-A and 3G coverage

* Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

* Feature refinements: DFOTA and VoNR / VoLTE (optional)

* LGA form factor

* Max. data rates of 6.0Gbps (DL) / 900Mbps (UL)

* Quectel 5G Sub-6GHz IoT module

* 5G/4G/3G multi-mode module with LGA form factor, optimized for IoT and eMBB applications

* Both NSA and SA modes supported

* Worldwide 5G, LTE-A and 3G coverage

* Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

* Feature refinements: DFOTA and VoNR / VoLTE (optional)

* LGA form factor

* Max. data rates of 4.0Gbps (DL) / 900Mbps (UL)

* Quectel 5G Sub-6GHz Module

* Compliant with 3GPP Rel-16 standard

* GNSS: GPS/BDS/GLONASS/Galileo

* 5G dual-mode: SA/NSA

* Used for 5G wireless router, CPE, MiFi, Industrial router, Home gateway etc...

* Quectel 5G Wireless Module

* Chipset: Qualcomm Snapdragon X55 5G modem

* 5G sub-6GHz LGA module

* 5G SA Sub-6 DL 2.1Gbps/UL 450Mbps

* 5G NSA Sub-6 DL 2.5Gbps/UL 650Mbps

* Quectel 5G sub-6GHz module

* Form factor: LGA

* Supports both NSA and SA modes

* Supports Option 3x, 3a and Option 2 network architecture

* USB 3.1 / PCIe 3.0 high speed interface

* Multi-constellation GNSS receiver available

* Speeds: DL 5Gbps, UL 900Mbps

* Quectel 5G Wireless Module

* Chipset: Qualcomm Snapdragon X55 5G modem

* Cover global 5G frequency bands

* Multi-gigabit data rates, up to 5.0Gbps

* DL 4 × 4 MIMO for 5G NR and LTE-A bands

* Multi-constellation GNSS capabilities

* Abundant interfaces: USB 3.0/3.1, PCIe 3.0 and eSIM

* Quectel 5G Wireless Module

* Chipset: Qualcomm Snapdragon X55 5G modem

* Cover global 5G frequency bands

* Multi-gigabit data rates, up to 5.0Gbps

* DL 4 × 4 MIMO for 5G NR and LTE-A bands

* Multi-constellation GNSS capabilities

* Abundant interfaces: USB 3.0/3.1, PCIe 3.0 and eSIM