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* Sierra Wireless 5G Module

* 5G Dual-mode: SA/NSA

* Target region: Global

* 5G Speeds: DL to 4.9Gbps, UL to 660Mbps

* GNSS: Galileo, Glonass, GPS, Beidou

* LongSung 5G NR Module

* Form factor: M.2 package

* 5G Dual-mode: SA/NSA

* Peak speeds: DL 2.8Gbps(DL)/900Mbps(UL)

* GNSS: GPS, GLONASS, BeiDou, Galileo and QZSS

* Fibocom 5G Wireless Module

* Form factor: LGA

* Chipset: Qualcomm Snapdragon® X62

* Support 5G Dual mode: SA/NSA

* 5G NR SA Speeds: Max. 2470Mbps DL / Max. 900Mbps UL

* 5G NR NSA Speeds: Max. 3470Mbps DL / Max. 555Mbps UL

* GNSS: GPS, GLONASS, BeiDou, Galileo, QZSS

* Fibocom 5G Wireless Module

* Form factor: M.2

* Chipset: Qualcomm Snapdragon® X62

* Support 5G Dual mode: SA/NSA

* 5G NR SA Speeds: Max. 2500Mbps DL / Max. 900Mbps UL

* 5G NR NSA Speeds: Max. 3500Mbps DL / Max. 555Mbps UL

* GNSS: GPS, GLONASS, BeiDou, Galileo, QZSS

* Quectel 5G NR Module

* Form factor: M.2 package

* Target market: China

* 5G SA Sub-6 speeds: DL 2Gbps, UL 1Gbps

* 5G NSA Sub-6 speeds: DL 2.2Gbps, UL 575Mbps

* Control via AT Commands

* Specially designed for IoT/eMBB applications

* Quectel 5G NR Module

* Form factor: LGA package

* Target market: China

* 5G SA Sub-6 speeds: DL 2Gbps, UL 1Gbps

* 5G NSA Sub-6 speeds: DL 2.2Gbps, UL 575Mbps

* Control via AT Commands

* Specially designed for IoT/eMBB applications

* Quectel 5G NR Module

* Form factor: Mini PCIe package

* Target market: China

* 5G SA Sub-6 speeds: DL 2Gbps, UL 1Gbps

* 5G NSA Sub-6 speeds: DL 2.2Gbps, UL 575Mbps

* Control via AT Commands

* Specially designed for IoT/eMBB applications

* Fibocom 5G Wireless Module

* Form factor: M.2

* Chipset: Qualcomm Snapdragon® X62

* Support 5G Dual mode: SA/NSA

* 5G NR SA Speeds: Max. 2500Mbps DL / Max. 900Mbps UL

* 5G NR NSA Speeds: Max. 3500Mbps DL / Max. 555Mbps UL

* GNSS: GPS, GLONASS, BeiDou, Galileo, QZSS

* Fibocom 5G NR Module

* Chipset: Mediatek T700

* 5G DL 4.67Gbps, UL 1.25Gbps

* Support SA/NSA

* GNSS: GPS, GLONASS, BeiDou, Galileo, QZSS

* Target Region: Europe, North America, Australia, South America, Japan, APAC

* Quectel 5G NR Module

* Form factor: M.2 package

* Target market: China

* 5G SA Sub-6 speeds: DL 2Gbps, UL 1Gbps

* 5G NSA Sub-6 speeds: DL 2.2Gbps, UL 575Mbps

* Specially designed for IoT/eMBB applications

* GNSS: GPS/GLONASS/BeiDou (Compass)/Galileo

* Quectel 5G NR Module

* Form factor: M.2 package

* Target market: China

* 5G SA Sub-6 speeds: DL 2Gbps, UL 1Gbps

* 5G NSA Sub-6 speeds: DL 2.2Gbps, UL 575Mbps

* Specially designed for IoT/eMBB applications

* Quectel 5G NR Module

* Form factor: LGA package

* Target market: China

* 5G SA Sub-6 speeds: DL 2Gbps, UL 1Gbps

* 5G NSA Sub-6 speeds: DL 2.2Gbps, UL 575Mbps

* Specially designed for IoT/eMBB applications

* Cinterion 5G IoT Module

* Global 5G coverage on one single SKU

* LTE Cat. 20 fallback

* LTE Advanced-Pro (3GPP Release 15)

* Dual SIM support with Dual Standby Single Active support

* GNSS: GPS, GLONASS, Galileo and Beidou

* Telit 5G NR Module

* Chipset: Qualcomm/SDX55

* Form factor: M.2

* Interfaces:USB 3.1 Gen 2 / Serial

* 4G Cat 20 up to 7 CA

* SIMCOM 5G Wireless Module

* Form factor: M.2

* Support 5G NR/LTE-FDD/LTE-TDD/HSPA+ networks

* 5G Sub-6G data rates: 10Gbps(DL)/500Mbps(UL)

* Chipset: Qualcomm Snapdragon X62

* Firmware Upgrade via USB

* SIMCOM 5G Wireless Module

* Form factor: M.2

* Support 5G NR/LTE-FDD/LTE-TDD/HSPA+ networks

* 5G Sub-6G data rates: 2.8Gbps(DL)/600Mbps(UL)

* Chipset: Qualcomm Snapdragon X62

* Firmware Upgrade via USB

* Quectel 5G Wireless Module

* Chipset: Qualcomm Snapdragon X55 5G modem

* Cover global 5G frequency bands

* Multi-gigabit data rates, up to 5.0Gbps

* DL 4 × 4 MIMO for 5G NR and LTE-A bands

* Multi-constellation GNSS capabilities

* Abundant interfaces: USB 3.0/3.1, PCIe 3.0 and eSIM

* Quectel 5G Wireless Module

* Chipset: Qualcomm Snapdragon X55 5G modem

* Cover global 5G frequency bands

* Multi-gigabit data rates, up to 5.0Gbps

* DL 4 × 4 MIMO for 5G NR and LTE-A bands

* Multi-constellation GNSS capabilities

* Abundant interfaces: USB 3.0/3.1, PCIe 3.0 and eSIM

* Target region: North America/Europe

* Huawei 5G C-V2X Module

* Form factor: 643-pin LGA, Mini PCIe, M.2

* Support 5G NR Band n78, n79, n41

* 5G DL 2Gbps, UL 230Mbps

* Chipset: HiSilicon Balong5000 platform

* Approval: NAL, SRRC