Fibocom FG180-NA 5G R17 Sub-6 Module

* Fibocom 5G Sub-6 Module


* Chipset: Qualcomm snapdragon SDX72


* Target Region: North America


* Package : LGA


* Antenna: 4


* GNSS: GPS/GLONASS/Galileo/BeiDou/QZSS/NavIC


* 5G Speeds: 4.12Gbps(DL) / 900Mbps(UL)

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$699.00

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Details
Details

Fibocom FG180-NA is a 5G wireless Module designed for the North American market, compliant with the 3GPP Release 17 standard. Powered by the Qualcomm snapdragon SDX72, it provides a superior 5G experience and optimized power consumption, especially for the FWA market and application. The module features a new LGA packaging design with dimensions of 45*48*2.75mm. The NR Sub-6GHz offers up to 300MHz bandwidth and downlinks NR 5CA, FDD+FDD uplink carrier aggregation, and FDD uplink MIMO, which offers an excellent 5G high-speed experience. The FG180-NA features rich network protocols and integrates multiple interfaces, including USB 3.1/3.0/2.0, PCIe 4.0/3.0, I2S, and more. It can be applied in IoT applications such as CPE, mobile hotspots, gateways, video surveillance, drones, VR/AR, and more.


Fibocom FG180-NA 5G module Specifications:

* Product type: 5G cellular module

* Form factor: LGA

* Platform/chipset: Qualcomm Snapdragon X72

* Operation mode: NSA&SA

* Dimension (mm): 45x48x2.75

* Frequency Bands
- Sub-6: n2/5/7/12/14/25/26/29/30/38/41/48/66/70/71/77/78
- 8RX: n25/66/41/77
- UMTS: B1/2/3/4/5/6/8/9/19
- LTE FDD: B2/4/5/7/12/13/14/17/25/26/29/30/66/71
- LTE TDD: B38/41/42/43/48

* MIMO
- 5G NR: DL 4x4 MIMO:n2/5/7/12/14/25/26/30/38/41/48/66/70/71/77/78
- UL 2x2 MIMO:n25/41/48/66/71/77/78
- LTE: DL 4x4 MIMO: B2/4/5/7/12/13/14/17/25/26/30/38/41/42/43/48/66/71


* Speeds:
- FR1+FR2: N/A
- NR SA(Mbps): 4.12Gbps(DL) / 900Mbps(UL)
- NR NSA(Mbps): 4.096Gbps(DL) / 555Mbps(UL)
- LTE(Mbps): 2.0Gbps(DL) / 211Mbps(UL)


* Antenna: 4

* Operating Voltage: 3.135V~4.4V, Typical 3.8V

* Operating Temp.: -40°C - +85°C

* Voice: VoLTE*/VONR*

* SMS: SMS over IP(IMS)

* GNSS: GPS/GLONASS/Galileo/BeiDou/QZSS/NavIC

* Interfaces:
- USB: USB3.1/3.0 & USB2.0
- PCle: PCIe4.0/3.0x 1+PCIe3.0 x 2
- MIPI: x2
- USXGMII: USXGMII x 2

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