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* Quectel 5G Smart Board

* Based on Quectel SG560D 5G smart module

* Octa-core 1.9~2.7GHz CPU

* Adreno 643 GPU

* 12 TOPS NPU

* Support 5G/WiFi/Bluetooth/GNSS

* USB/Ethernet/RS232/RS485/CAN

* Support HDMI/eDP/MIPI CSI/SIM/SD

* Support Ubuntu/Android/Windows OS

* Telit 5G NR Module

* Compatible with Release 17

* Chipset: Qualcomm Snapdragon® X72 5G Modem

* 5G DL 3.4Gbps, UL 0.9Gbps

* Form factor: LGA

* 4G: 5xCA up to 20 layers DL, 2xCA UL; 256-QAM DL/UL

* Fibocom 5G Smart Module

* Chipset: Qualcomm's QCM4490 2*A78@2.0GHz + 6*A55@2.0GHz

* WLAN: WIFI 2.4G/5G：Wi-Fi 6E, 802.11 a/b/g/n/ac/ax,（2X2 MIMO）

* GNSS: GPS(L1+L5)/GLONASS/Beidou

* 5G Speeds: Max. 2.3Gbps(DL)/Max. 900Mbps(UL)

* OS: Android T

* Fibocom 5G Smart Module

* Based on Qualcomm QCM6490 platform

* Support 5 camara working at same time

* Support 12TOPS computing and multiple computing methods

* Support 5G/WiFi 6 wireless comunication

* Sierra Wireless 5G Module

* 5G Dual-mode: SA/NSA

* Target region: Global

* 5G Speeds: DL to 4.9Gbps, UL to 660Mbps

* GNSS: Galileo, Glonass, GPS, Beidou

* Fibocom 5G Smart Module

* Operating System：Android R

* Package: 433 LGA pin

* Support 5G Sub-6/4G LTE/WCDMA networks

* DL 1.9Gbps, UL 750Mbps

* Wi-Fi: 802.11 a/b/g/n/ac, 2.4G/5G,11 ax ready, 2X2 MIMO

* Target market: China

* Connectivity: 5G-Advanced (3GPP Release 18), backward compatible with 4G/3G networks, Dual SIM Dual Standby (DSDS).

* Automotive Focus: AEC-Q100 Grade 2 qualified for reliability, supports emergency call systems (eCall), and designed for durability.

* GNSS: Integrated dual-band GNSS (L1 & L5) for precise positioning, up to 30 Hz output.

* Antenna: Proprietary solutions with six-port antenna design for strong performance.

* Compatibility: Offers "drop-in" compatibility with other Quectel modules like AG581A, AG56xN, shortening development.

* Form Factor: LGA package, dimensions 42.0 × 38.0 × 3.05 mm (typical for AG519M).

* Oryon CPU

* Adreno™ 830 GPU

* Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)

* Spectra™ ISP

* Adreno 8550 VPU

* Adreno DPU

* Neural processing unit

* Security processing

* Video encoder: 4K @ 120fps; 8K @ 30fps

* Video decoder: 4K @ 240fps; 8K @ 60fps

* Computing power of up to 80 TOPS

* 10 TOPS computing power

* Octa-core Cortex A55 CPU @ 1.5Ghz

* ISP 16M @ 30fps

* 4K @ 60fps video encoder and decoder

* HiFi 5

* Excellent power efficiency

* 3D OpenGL ES and 2D GPU

* Various mainstream robot perception algorithms

* USB 3.0 & 2.0/SD 3.0

* SIMCOM 5G NR/LTE Module

* Form factor: LGA

* 5G NSA DL 2.15Gbps, UL 550Mbps

* 5G SA DL 4Gbps, UL 1Gbps

* SIM Card interface x 2

* SIMCOM 5G NR/LTE Module

* Form factor: LGA

* 5G NSA DL 2.15Gbps, UL 550Mbps

* 5G SA DL 4Gbps, UL 1Gbps

* SIM Card interface x 2

* SIMCOM 5G NR Module

* Chipset: Qualcomm Snapdragon SDX35

* Form Factor：PCIE

* GNSS: support

* 5G Sub-6G SA: Up to 220Mbps(DL)/100Mbps(UL)

* SIMCOM 5G NR Module

* Chipset: Qualcomm Snapdragon SDX35

* Form Factor：M.2

* GNSS: support

* 5G Sub-6G SA: Up to 220Mbps(DL)/100Mbps(UL)

* SIMCOM 5G NR/LTE Module

* Form factor: LGA + LCC

* 5G SA Speeds DL 220Mbps, UL 100Mbps

* SIM Card interface

* Firmware Upgrade: USB

* SIMCOM 5G NR/LTE Module

* Form factor: LGA

* 5G NSA DL 2.15Gbps, UL 550Mbps

* 5G SA DL 4Gbps, UL 1Gbps

* SIM Card interface x 2

* SIMCOM 5G NR/LTE Module

* Form factor: PCIE

* 5G DL 220Mbps, UL 120Mbps

* Firmware Upgrade via USB

* SIMCOM 5G NR/LTE Module

* Form factor: M.2

* 5G DL 220Mbps, UL 120Mbps

* Firmware Upgrade via USB

* SIMCOM 5G NR/LTE Module

* Form factor: PCIE

* 5G DL 220Mbps, UL 120Mbps

* Firmware Upgrade via USB

* SIMCOM 5G NR/LTE Module

* Form factor: M.2

* 5G DL 220Mbps, UL 120Mbps

* Firmware Upgrade via USB

* GNSS Support