Fibocom H330S 3G HSPA+ Module
* 3G HSPA+ module
* WCDMA: Band 1,2,5,8
* Form factor: LGA 120pin
* DL 21Mbps, UL 5.76Mbps
* Target: Global market
Availability: In stock
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Fibocom H330S LGA module adopts one of the most advanced Intel platforms in the industry and supports the main 3G frequencies of global 3G. It provides multiple interfaces for customers, such as USB2.0, UART, I2C, I2S. It has a built-in TCP/IP&UDP/IP protocol stack.
Fibocom H330S not only can it be applied to industrial fields such as vehicle navigation, security monitoring, wireless POS, and remote medical services, but also can be applied to consumer electronics such as tablet PC, and e-books, fully satisfying the demand of mobile broadband applications for all kinds of users.
Fibocom H330S Module Specifications:
* 3G HSPA+ module
* WCDMA: Band 1,2,5,8 or Band 1,8
* GSM/GPRS/EDGE: 850/900/1800/1900MHz or 900/1800MHz
* Form factor: LGA 120pin
* Operating Temperature: -30 ~ +75℃
* Storage Temperature: -40 ~ +85℃
* Operating Voltage: DC 3.3V~4.2V, Typical 3.8V
* TX Power
- UMTS/HSPA+ Class 3 (0.25W)
- GSM 850/900 MHz Class 4 (2W)
- GSM 1800/1900 MHz Class 1 (1W)
- EDGE 850/900 MHz Class E2 ( 0.5W)
- EDGE 1800/1900 MHz Class E2 ( 0.4W)
* AT Command Set: FIBOCOM proprietary AT commands/GSM 07.05/GSM 07.07
* Data
- UMTS/HSDPA/HSUPA 3GPP release 7
- HSUPA 5.76Mbps (Cat 6)
- HSDPA 21Mbps (Cat 14)/7.2Mbps (Cat 8)
- GSM 3GPP release 7
- EDGE (E-GPRS) Multi-slot class 33(296kbps DL,236.8kbps UL)
- GPRS Multi-slot class 33(107kbps DL,85.6kbps UL)
* MUX: Basic Mode
* SMS: MO/MT Text and PDU modes
* Cell broadcast
* Embedded TCP/IP and UDP/IP protocol stack
* Interfaces:
- SIM Card:1.8V/3.0V
- Multiple Profiles over USB
- 1 x USB 2.0 Multi-endpoints
- 2 x UART
- MUX Over UART1
- PCM
- I2C
- I2S
- GPIO
- RTC
- HSIC
- A/D
* Drivers
- Win CE
- Linux 2.6.18 above
- Android 4.2 above
* Approvals: CCC/RoHS/CE /GCF/FCC/PTCRB/TELEC/RCM/ANATEL
* Dimensions: 33.8 x 27.8 x 2.45mm