Skywork SKY68001-21 LTE Cat0/CatM1/CATNB1 Module
* LTE Cat0/CatM1/CATNB1 Module
* LTE universal modem
* Small, low profile package
* Cellular IoT modem devices targeting low-power wide area network
* MIPI RFFE control interface, 2.0 compliant
Availability: Out of stock
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Skywork SKY68001-21 is a hybrid, multi-band multi-chip RF front-end (RFFE) module supporting cellular LTE Cat0/CatM1/CATNB1 (half-duplex system) transceiver platforms. The module integrates the entire RF front end necessary for an LTE multi-band radio operating in low-band(B5/B8/B12/B13/B17/B18/B19/B20/B28) and mid-band (B1/B2/B3/B4/B25/B66 [AWS]) frequencies, including Rx low-pass filters, broadband PA with bias controller, Tx low-pass harmonic filter, antenna switch, and MIPI RFFE controller.
Skywork SKY68001-21 Applications:
* Cellular IoT modem devices targeting low-power wide area network (LPWAN):
- 4G LTE technology capability
- Dedicated LTE half-duplex operation (HD-FDD) for Cat0/CatM1/CATNB1
- Designed to meet 3GPP Rel-12 and Rel-13 specifications (with compatible cellular transceiver)
* LTE universal modem products (low-band and mid-band):
- Low-band B5/B8/B12/B13/B17/B18/B19/B20/B28
- Mid-band B1/B2/B3/B4/B25/B66 (AWS)
* PAE optimized for Class 3 LTE output power (+23 dBm)
Skywork SKY68001-21 Features:
* Cost-optimized front end for low-data-rate applications
* Low-loss post-PA transmit front end for enhanced transmitter efficiency (compared to LTE-FDD radio front ends)
* Broadband PA supporting APT mode of operation or Vcc fixed supply (≥ 2.85 V)
* Integrated low-pass filters for harmonic rejection to comply with spurious emission requirements
* Integrated SP6T antenna Tx/Rx switch
* Integrated Rx low-pass filters for out-of-band rejection
* Optimized to support LTE for 1 to 36 RB
* MIPI RFFE control interface, 2.0 compliant
* Lead (Pb)-free and RoHS-compliant
* Pin-to-pin compatible with the SKY68000-21 and the SKY68011-21
* Two additional Aux ports offer greater flexibility for more bands on the Tx or Rx path
* Adaptive biasing scheme for maximum PA efficiencies
* Small, low profile package (4 mm x 5 mm x 0.9 mm) (MSL3 @ 260 °C per JEDEC J-STD-020)