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* Form Type: CF3 SMD LGA package

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor and snap-in socket option

* Carrier Approval: Telstra

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency bands: B3, B7, B28

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency band B1/B19/B21

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency band B1/B11/B18

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency band B1/B3/B5/B7

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency band B4 and B13

* Form factor: CF3 SMD LGA package

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor and snap-in socket option

* Support 4G LTE Cat.1 frequency bands(B3/B8/B20)

* Usable in Europe region

* Very low power consumption

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor and snap-in socket option

* Support 4G LTE Cat.1 frequency bands(B3/B8/B20)

* Usable in Europe region

* Very low power consumption

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor and snap-in socket option

* Support 4G LTE Cat.1 frequency bands(B2/B4/B5/B8/B17)

* Region: Americas

* Very low power consumption

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and solder down or snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* B2, B4, B5, B17 4G LTE Cat 4 frequency bands

* LTE Advanced Pro Module

* Form factor: PCI Express M.2

* Category: LTE Cat.12

* Chipset/Processor: Qualcomm MDM9250

* DL to 600Mbps/UL to 150Mbps

* Supporting 24 worldwide LTE bands, including LTE-LAA and CBRS

* Control Options: APIs, AT Commands 

* firmware over-the-air (FOTA)

* Category: 4G-LTE cat 1

* 4G Bands: B2 (1900), B4 (1700), B12 (700)

* Carrier: AT&T, T-Mobile, Canada

* Peak data rate: DL 10 Mbps, UL 5 Mbps

* Form factor: CF3 SMD LGA package

* Control options: AT Commands

* Compact CF3 form factor for easy integration

* Low cost, very low power consumption

* Region: North America

* Reliable proven IoT and M2M connectivity

* Compatible footprint size with the rest of the HL series

* Secure boot and value-add firmware with free unlimited firmware over-the-air upgrades

* Chipset: Qualcomm MSM7200A

* 3G HSDPA/UMTS 850/1900/2100MHz

* 2G GSM/GPRS/EDGE 850/900/1800/1900MHz

* HSDPA Download speed to 7.2Mbps

* HSUPA upload speed to 5.76Mbps

* Connectore: 52-Pin Edge Connector

* Quad Band GSM 850/900/1800/1900 MHz

* Peak downlink speeds up to 7.2 Mbps

* Peak uplink speeds up to 5.8 Mbps

* Qualcomm chipset MSM6290

* 52 position Mini PCIe

* LTE Category 6 module

* Control options: AT Commands, QMI SDK, MBIM

* Qualcomm MDM9230 chipset

* LTE Peak Data rate: DL 300 Mbps, UL 50 Mbps

* Form factor: PCIe Mini Card

* Chipset: Qualcomm MDM9230

* 4G-LTE category 6

* DL 300 Mbps, UL 50 Mbps

* Supported Carriers: AT&T, Verizon, Sprint, Vodafone

* Model No: MC8780

* Manufacturer: Sierra Wireless

* Chipset: Qualcomm MDM7200

* Form Factor: PC/SC interface

* 52-Pin Edge Connector

* Model No: MC8775

* Category: 3G Module

* Manufacturer: Sierra Wireless

* Chipset: Qualcomm MSM6280

* Form Factor: Mini PCIe

* Form type: PCI Express Mini Card

* Chipset: Qualcomm MSM6500

* Netword mode: CDMA 1x EV-DO

* Download speed: peak to 2.4Mbps