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* Quectel 5G Sub6 Module

* 5G/4G/3G multi-mode module with LGA form factor, optimized for IoT and eMBB applications

* Worldwide 5G and LTE-A coverage

* 5G NSA and SA modes

* SA data rates: 2.4Gbps (DL) / 900Mbps (UL)

* NSA data rates: 3.4Gbps (DL) / 550Mbps (UL)

* Fibocom 5G wireless module

* Form factor: LGA

* Compliant with 3GPP R17 Standard

* Platform/chipset: Qualcomm Snapdragon X75

* Support OpenWRT and RDK-B

* Support WiFi 7, Open CPU and 4K QAM

* Up to 400MHz bandwidth of NR 4CA under mmWave Bands

* Up to 200MHz bandwidth of NR 3CA under Sub-6Ghz

* Quectel Wi-Fi & Bluetooth smart module

* Android OS

* Form factor: LGA package

* Adreno™ 740 GPU

* IEEE 802.11be, 2 × 2 Wi-Fi MIMO

* 12GB LPDDR5X + 256GB UFS

* SIMCOM 5G NR/LTE Module

* Form factor: M.2

* 5G DL 220Mbps, UL 120Mbps

* Firmware Upgrade via USB

* GNSS Support

* SIMCOM 5G NR/LTE Module

* Form factor: PCIE

* 5G DL 220Mbps, UL 120Mbps

* Firmware Upgrade via USB

* SIMCOM 5G NR/LTE Module

* Form factor: M.2

* 5G DL 220Mbps, UL 120Mbps

* Firmware Upgrade via USB

* SIMCOM 5G NR/LTE Module

* Form factor: PCIE

* 5G DL 220Mbps, UL 120Mbps

* Firmware Upgrade via USB

* SIMCOM 5G NR/LTE Module

* Form factor: LGA

* 5G NSA DL 2.15Gbps, UL 550Mbps

* 5G SA DL 4Gbps, UL 1Gbps

* SIM Card interface x 2

* SIMCOM 5G NR/LTE Module

* Form factor: LGA + LCC

* 5G SA Speeds DL 220Mbps, UL 100Mbps

* SIM Card interface

* Firmware Upgrade: USB

* SIMCOM 5G NR Module

* Chipset: Qualcomm Snapdragon SDX35

* Form Factor：M.2

* GNSS: support

* 5G Sub-6G SA: Up to 220Mbps(DL)/100Mbps(UL)

* SIMCOM 5G NR Module

* Chipset: Qualcomm Snapdragon SDX35

* Form Factor：PCIE

* GNSS: support

* 5G Sub-6G SA: Up to 220Mbps(DL)/100Mbps(UL)

* SIMCOM 5G NR/LTE Module

* Form factor: LGA

* 5G NSA DL 2.15Gbps, UL 550Mbps

* 5G SA DL 4Gbps, UL 1Gbps

* SIM Card interface x 2

* SIMCOM 5G NR/LTE Module

* Form factor: LGA

* 5G NSA DL 2.15Gbps, UL 550Mbps

* 5G SA DL 4Gbps, UL 1Gbps

* SIM Card interface x 2

* 10 TOPS computing power

* Octa-core Cortex A55 CPU @ 1.5Ghz

* ISP 16M @ 30fps

* 4K @ 60fps video encoder and decoder

* HiFi 5

* Excellent power efficiency

* 3D OpenGL ES and 2D GPU

* Various mainstream robot perception algorithms

* USB 3.0 & 2.0/SD 3.0

* Oryon CPU

* Adreno™ 830 GPU

* Hexagon™ DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)

* Spectra™ ISP

* Adreno 8550 VPU

* Adreno DPU

* Neural processing unit

* Security processing

* Video encoder: 4K @ 120fps; 8K @ 30fps

* Video decoder: 4K @ 240fps; 8K @ 60fps

* Computing power of up to 80 TOPS

* Connectivity: 5G-Advanced (3GPP Release 18), backward compatible with 4G/3G networks, Dual SIM Dual Standby (DSDS).

* Automotive Focus: AEC-Q100 Grade 2 qualified for reliability, supports emergency call systems (eCall), and designed for durability.

* GNSS: Integrated dual-band GNSS (L1 & L5) for precise positioning, up to 30 Hz output.

* Antenna: Proprietary solutions with six-port antenna design for strong performance.

* Compatibility: Offers "drop-in" compatibility with other Quectel modules like AG581A, AG56xN, shortening development.

* Form Factor: LGA package, dimensions 42.0 × 38.0 × 3.05 mm (typical for AG519M).

* Fibocom 5G Smart Module

* Operating System：Android R

* Package: 433 LGA pin

* Support 5G Sub-6/4G LTE/WCDMA networks

* DL 1.9Gbps, UL 750Mbps

* Wi-Fi: 802.11 a/b/g/n/ac, 2.4G/5G,11 ax ready, 2X2 MIMO

* Target market: China

* Sierra Wireless 5G Module

* 5G Dual-mode: SA/NSA

* Target region: Global

* 5G Speeds: DL to 4.9Gbps, UL to 660Mbps

* GNSS: Galileo, Glonass, GPS, Beidou

* Fibocom 5G Smart Module

* Based on Qualcomm QCM6490 platform

* Support 5 camara working at same time

* Support 12TOPS computing and multiple computing methods

* Support 5G/WiFi 6 wireless comunication