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* Quectel 5G Sub-6GHz IoT module

* 5G/4G/3G multi-mode module with LGA form factor, optimized for IoT and eMBB applications

* Both NSA and SA modes supported

* Worldwide 5G, LTE-A and 3G coverage

* Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment

* Feature refinements: DFOTA and VoNR / VoLTE (optional)

* LGA form factor

* Max. data rates of 4.0Gbps (DL) / 900Mbps (UL)

* Fibocom 5G wireless module

* Form factor: M.2

* Compliant with 3GPP R17 Standard

* Platform/chipset: Qualcomm Snapdragon X75

* Support 5G mmWave and Sub-6GHz

* Peak download speeds up to 10Gbps

* Fibocom 5G wireless module

* Form factor: M.2

* Compliant with 3GPP R17 Standard

* Platform/chipset: Qualcomm Snapdragon X72

* Support 5G mmWave and Sub-6GHz

* Peak download speeds up to 4.4Gbps

* Fibocom 5G wireless module

* Form factor: M.2

* Compliant with 3GPP R17 Standard

* Platform/chipset: Qualcomm Snapdragon X75

* Support 5G mmWave and Sub-6GHz

* Peak download speeds up to 10Gbps

* Fibocom 5G wireless module

* Form factor: LGA

* Compliant with 3GPP R17 Standard

* Platform/chipset: Qualcomm Snapdragon X75

* Support 5G mmWave and Sub-6GHz

* Peak download speeds up to 10Gbps

* Fibocom 5G wireless module

* Form factor: M.2

* Compliant with 3GPP R17 Standard

* Platform/chipset: Qualcomm Snapdragon X72

* Support 5G mmWave and Sub-6GHz

* Peak download speeds up to 4.4Gbps

* Fibocom 5G Smart Module

* Based on Qualcomm QCM6490 platform

* Support 5 camara working at same time

* Support 12TOPS computing and multiple computing methods

* Support 5G/WiFi 6 wireless comunication

* Quectel 5G Sub-6GHz Module

* Compliant with 3GPP Rel-16 standard

* GNSS: GPS/BDS/GLONASS/Galileo

* 5G dual-mode: SA/NSA

* Used for 5G wireless router, CPE, MiFi, Industrial router, Home gateway etc...

* Telit 5G NR Sub6 Module

* 5G sub-6 FDD and TDD, 5G SA and NSA dual-mode operations

* 5G core network Opt. 3a/3x and Opt. 2

* Target Market: North America, EMEA, APAC

* Chipset: Snapdragon X65 5G modem

* 5G data rates: DL up to 4.9 Gbps/UL to 0.55 Gbps

* Telit 5G NR Sub6 Module

* 5G sub-6 FDD and TDD, 5G SA and NSA dual-mode operations

* 5G core network Opt. 3a/3x and Opt. 2

* Target Market: North America, EMEA, APAC

* Chipset: Snapdragon X62 5G modem

* 5G data rates: DL up to 3.4 Gbps/UL to 0.55 Gbps

* Sierra Wireless 5G Module

* 5G Dual-mode: SA/NSA

* Target region: Global

* 5G Speeds: DL to 4.9Gbps, UL to 660Mbps

* GNSS: Galileo, Glonass, GPS, Beidou

* Quectel 5G Wireless Module

* Chipset: Qualcomm Snapdragon X55 5G modem

* 5G sub-6GHz LGA module

* 5G SA Sub-6 DL 2.1Gbps/UL 450Mbps

* 5G NSA Sub-6 DL 2.5Gbps/UL 650Mbps

* Quectel 5G sub-6GHz module

* Form factor: LGA

* Supports both NSA and SA modes

* Supports Option 3x, 3a and Option 2 network architecture

* USB 3.1 / PCIe 3.0 high speed interface

* Multi-constellation GNSS receiver available

* Speeds: DL 5Gbps, UL 900Mbps

* Fibocom 5G Module

* Chipset: Qualcomm SA515M

* Form Factor: LGA

* Support 5G Sub-6/4G LTE/WCDMA/TD-SCDMA/GSM networks

* Antenna: 6 Antennas + 1GPS

* GNSS: GPS/GLONASS/GALILEO/BEIDOU

* 5G: Max 1.6Gbps(DL)/NSA 600Mbps & SA 450Mbps (UL)

* Target region: Asia, Australia

* Quectel 5G Wireless Module

* Chipset: Qualcomm Snapdragon X55 5G modem

* Cover global 5G frequency bands

* Multi-gigabit data rates, up to 5.0Gbps

* DL 4 × 4 MIMO for 5G NR and LTE-A bands

* Multi-constellation GNSS capabilities

* Abundant interfaces: USB 3.0/3.1, PCIe 3.0 and eSIM

* Quectel 5G Wireless Module

* Chipset: Qualcomm Snapdragon X55 5G modem

* Cover global 5G frequency bands

* Multi-gigabit data rates, up to 5.0Gbps

* DL 4 × 4 MIMO for 5G NR and LTE-A bands

* Multi-constellation GNSS capabilities

* Abundant interfaces: USB 3.0/3.1, PCIe 3.0 and eSIM

* Quectel 5G Wireless Module

* Chipset: Qualcomm Snapdragon X55 5G modem

* Cover global 5G frequency bands

* Multi-gigabit data rates, up to 5.0Gbps

* DL 4 × 4 MIMO for 5G NR and LTE-A bands

* Multi-constellation GNSS capabilities

* Abundant interfaces: USB 3.0/3.1, PCIe 3.0 and eSIM

* Target region: North America/Europe

* Huawei 5G C-V2X Module

* Form factor: 643-pin LGA, Mini PCIe, M.2

* Support 5G NR Band n78, n79, n41

* 5G DL 2Gbps, UL 230Mbps

* Chipset: HiSilicon Balong5000 platform

* Approval: NAL, SRRC