Quectel Launches New 5G Modules at MWC2026

On March 5th, during the Mobile World Congress (MWC) 2026 in Barcelona, Quectel, a global supplier of IoT total solutions, in collaboration with UNISOC, unveiled a new series of 5G modules based on UNISOC’s three major platforms: the 5G eMBB V620, V610, and the 5G RedCap V527. This new product matrix, characterized by high-end performance, compact design, and lightweight features, marks a new journey towards the large-scale application of the 5G Internet of Things.

Flagship Performance, Redefining the 5G Experience

The RG620UA/RM520UA series 5G modules, built on the UNISOC V620 platform, deliver robust 5G data rates, a quad-core A55 processor, rich Ethernet configurations, and Wi-Fi 7/Wi-Fi 6 connectivity. Simultaneously, they continue to optimize and innovate in areas such as ENDC combinations, RAM+ROM solutions, and adaptation for QuecOpen and OpenWRT/PrplOS. This precisely meets the urgent market demand for high-performance, highly flexible terminals in the 5G FWA sector.

Extreme Compactness, Unlocking New Possibilities for Portability

Targeting space-constrained scenarios like global portable terminals and power IoT applications, Quectel has launched the compact 5G modules RG258UB-GL/RG258UB-CN based on the UNISOC V610 platform. This series employs a highly integrated packaging process, reducing the volume by approximately one-third compared to traditional 5G LGA modules. This frees up more design flexibility for devices like portable mobile hotspots (MHS) and compact power terminals. They also deliver robust performance, fully supporting 5G SA/NSA dual modes and global full network compatibility, with an optimized RF solution to ensure signal stability. By selecting core domestic components, they effectively mitigate supply chain risks while achieving a better balance between performance and cost, helping customers quickly respond to the growing demand for consumer electronics and IoT portable devices in global markets.

Lightweight and Slim, Accelerating the Popularization of 5G

Based on UNISOC’s new generation high-performance 5G RedCap IoT communication chip, the V527, Quectel has introduced the RG155UC-CN lightweight module targeting the IoT market where cost and performance are both critical. This module features an ultra-small, ultra-thin design, reducing volume by 46% and thickness by 17% compared to traditional packaging. It supports a rich software ecosystem, significantly lowering the barrier to upgrading lightweight 5G terminals, and is widely adaptable to consumer and industrial terminals such as smart wearables, tablets, and industrial sensors.

Furthermore, the UniHALO solution, developed by Quectel based on UNISOC’s full range of 5G IoT platforms, has now been successfully adapted to the OpenWRT 24.10 version. This solution aims to provide developers with a more stable and efficient software development environment by simplifying the design process, improving system performance, and effectively reducing DDR and Flash resource overhead. It fully leverages hardware potential, further lowering the development threshold for 5G terminals.

Anchored by Customer Value, Building a Global Digital Future Together

Currently, Quectel 5G modules based on the three UNISOC platforms are widely deployed across various fields including smart industry, smart grid, smart logistics, and consumer electronics. The entire product series adopts low-power design, helping to improve terminal battery life by over 20%, deeply aligning with the “Dual Carbon” goals. The V527 and V610 platforms, with their high cost-performance ratio, lower the barrier to 5G access, injecting momentum into the digital development of emerging markets. The V620 platform, with its outstanding performance, provides a high-speed, low-latency network experience that is truly both “affordable and high-quality.”

Quectel Launches 5G Module RG620UA-EU with Support for 3GPP R16

On February 28, Quectel, in collaboration with UNISOC, officially launched the RG620UA-EU module, which fully supports 5G R16 features. The Quectel 5G module is developed based on the UNISOC V620 platform, equipped with a 4-core Arm® Cortex®-A55 CPU, and complies with the 3GPP R16 standard. It excels in transmission rates, computing power, and key R16 features, offering excellent 5G connectivity performance for various sectors such as Fixed Wireless Access (FWA) and industrial manufacturing.

Quectel COO Zhang Dong stated, “The launch of RG620UA-EU is another significant achievement in the deep cooperation between Quectel and UNISOC. This 5G AI module not only meets the demand for high-speed and stable connections in the FWA market but also demonstrates great potential in the industrial intelligence and AI application sectors. It injects new vitality into the thriving 5G market and will provide users with a richer, more diverse, and intelligent 5G connectivity experience.”

UNISOC Executive Vice President Zhou Chen commented, “UNISOC has been deeply focused on the 5G vertical industry sector for many years. The V620 is the next-generation product from UNISOC, providing deeper empowerment for 5G FWA and vertical industries. Quectel is an in-depth partner of UNISOC, and the launch of RG620UA-EU will further empower industries such as industrial manufacturing globally. Both parties will continue to work together to promote the widespread application of 5G technology, supporting the digital transformation of various industries.”

Targeting the FWA Market, Adapting to Users of Different Scales

Globally, the FWA market is experiencing rapid growth, with tremendous market potential. Quectel’s RG620UA-EU performs excellently in terms of network coverage, transmission speed, and connection stability, perfectly meeting the demands of the 5G FWA market.

Quectel RG620UA-EU supports both 5G Standalone (SA) and Non-Standalone (NSA) networks, backward compatible with 4G and 3G, and is adaptable to major networks worldwide. It also supports mainstream frequency combinations such as NR CA, LTE CA, ENDC, and others for more efficient data transmission and better network coverage. Additionally, the module supports HPUE PC1.5, improving coverage range and signal transmission quality by 3dB compared to PC2.

In terms of transmission speed, RG620UA-EU supports Super Uplink technology and a variety of non-supplementary uplink (NUL) and supplementary uplink (SUL) combinations, meeting the demand for high-speed network connections in various application scenarios. In SA networks, the module can achieve a maximum downlink speed of 4.67 Gbps and an uplink speed of 1.875 Gbps, offering an ultra-fast connection experience to users.

Additionally, Quectel has deeply analyzed the network needs of users of different scales and will launch a series of targeted overall solutions for FWA, focusing on cost control, functional expansion, and service upgrades.

Empowering the 5G to B Sector with Full Support for R16 Features

Beyond the FWA market, the RG620UA-EU also has great potential in the 5G to B industry, especially in the industrial sector.

With the support of the UNISOC V620 platform, the RG620UA-EU fully supports 5G R16 features, including 5G TSN (Time Sensitive Network), 5G LAN, URLLC (Ultra-Reliable Low Latency Communication), high-precision positioning, high-precision timing, low power consumption, and more. This injects new vitality into its application in industrial sectors, further driving the development of industrial intelligence.

Quectel RG620UA-EU brings revolutionary changes to industrial IoT by introducing 5G technology into industrial TSN networks. It supports indoor high-precision positioning, ideal for scenarios requiring precise tracking of personnel, materials, AGVs, and other targets. With an average RTT (Round-Trip Time) of up to 8ms, it is suitable for industrial applications requiring strict latency, such as industrial robot control and remote PLCs. The module also supports R16 low-power features such as WUS (Wake-Up Signal) and UAI (Uplink Assistance Information), further reducing the power consumption of terminal devices, extending device lifespan, and providing reliable assurance for large-scale deployment of industrial IoT.

AI Empowerment, Achieving Diverse Application Scenarios

As AI technology becomes more widespread, large models like DeepSeek are gradually entering the public’s view, bringing efficiency improvements to work and life. Notably, the RG620UA-EU has the capability to access the DeepSeek-R1 model. Additionally, the module supports integration with Quectel’s AI solutions developed for various application scenarios, enabling intelligent voice interaction and other functions, opening up more possibilities for AI-based applications.

Furthermore, the RG620UA-EU supports high-config LPDDR4x and FLASH storage, fully meeting third-party storage requirements.

The RG620UA-EU adopts an LGA package with dimensions of 44×53×2.95mm. It is equipped with a rich set of functional interfaces, including USXGMII, PCIe3.0, USB3.1, SDIO3.0, UART, SPI, I2S, I2C, GPIO, and more, greatly expanding its application range. It can be widely used in 5G FWA, 5G handheld terminals, laptops, gateways, and other fields. The module also supports dual-SIM functionality, catering to scenarios that require eSIM or soft SIM, providing users with great flexibility and convenience.

With the continuous development and popularization of 5G and AI technologies, the IoT sector will usher in even greater development prospects. Moving forward, Quectel will continue to collaborate with UNISOC to drive technological innovation and inclusive development, delivering higher-quality and more efficient products and solutions to clients, supporting the digital transformation of various industries.