Fibocom SC153 5G Smart Module
* Fibocom 5G Smart Module
* Qualcomm Octa-Core CPU delivers powerful edge intelligence and AI processing.
* Runs on the latest Android 16 for modern software compatibility.
* Achieves blazing-fast 2.5 Gbps 5G speeds on SA/NSA networks.
* Features highly flexible, future-proof Wi-Fi 7 wireless system architecture.
* Integrates rich interfaces including USB 3.1 and dual MIPI ports.
* Housed in a compact, space-saving LGA surface-mount package.
Availability: Out of stock
Fibocom SC153 is a high-performance 5G smart wireless module built on a Qualcomm platform and designed for advanced intelligent edge devices. It integrates high-speed 5G connectivity with robust edge computing capabilities to power applications such as smart retail, industrial handhelds, and robotics.
Fibocom SC153 5G Smart Module Specifications:
Core Processing & Memory
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• Processor: Powered by the Qualcomm Dragonwing™ CQ4390 platform, featuring a Kryo Octa-Core CPU (2x Gold cores @ 2.2 GHz + 6x Silver cores @ 1.8 GHz) with a 1MB L3 cache.
• Operating System: Runs on Android 16.
• Memory Configuration: Supports 2GB LPDDR4X RAM + 16GB eMMC Flash storage.
Wireless Connectivity & Performance
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• Cellular Standard: Supports 3GPP Release 16, covering multi-mode connectivity across 5G NR Sub-6 GHz and LTE.
• Network Architecture: Operates on both 5G Standalone (SA) and Non-Standalone (NSA) network architectures.
• Data Throughput:
• Maximum 5G downlink speeds of up to 2.3 Gbps in SA mode.
• Maximum downlink speeds of up to 2.5 Gbps in EN-DC (NSA) mode.
• Wi-Fi Configurations: Flexible support for Wi-Fi 5, Wi-Fi 6E, and Wi-Fi 7 architectures.
Hardware & Peripheral Interfaces
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• Package Type: Compact LGA package.
• Dimensions: 45.0 x 48.0 x 2.75 mm.
• Interface Options: Includes a wide range of developmental interfaces:
• MIPI Display & MIPI Camera
• USB 3.1
• UART, I²C, and SD card interfaces

