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* ZTE AXON 7s A2018 4G Smartphone Specifications and Features

* Support TDD-LTE/FDD-LTE/WCDMA/TD-SCDMA/CDMA/EVDO/GSM

* Qualcomm MSM8996 Snapdragon 821 Chipset, Quad-core 

* 5.5 inches,Android 7.0, 1440 x 2560 pixels,4GB RAM/128GB ROM

* Camera(Dual 20 MP + 12 MP), NANO SIM

* Wi-Fi 802.11 a/b/g/n/ac, dual-band, WiFi Direct, hotspot

* Non-removable Li-Ion 3400 mAh battery

* LTE Cat.6 M.2 Module

* Intel XMM7262 chipset

* Low power consumption

* DL 300Mbps and UL 50Mbps

* APIs or AT Commands control

* Only support for Lenovo Thinkpad P50 P70 Series laptops

* LTE Cat.6 M.2 Module

* Intel XMM7262 chipset

* Low power consumption

* DL 300Mbps and UL 50Mbps

* APIs or AT Commands control

* Only support for Lenovo Thinkpad P50 P70 Series laptops

* Compact CF3 Form Factor

* Low power consumption

* Enhanced RF performance

* Worldwide coverage

* Snap-In Socket available

* Intelligent pin-to-pin compatibility

* LTE Cat.4 IoT Module

* CF3 SMD LGA package

* Very low power consumption

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency band B2/B4/B13

* Compact CF3 Form Factor

* Low power consumption

* Enhanced RF performance

* Worldwide coverage

* GNSS (GPS and GLONASS)

* Snap-In Socket available

* Intelligent pin-to-pin compatibility

* Compact CF3 Form Factor

* Low power consumption

* Enhanced RF performance

* Worldwide coverage

* GNSS (GPS and GLONASS)

* Intelligent pin-to-pin compatibility

* Compact CF3 Form Factor

* Low power consumption

* Enhanced RF performance

* Worldwide coverage

* GNSS (GPS and GLONASS)

* Snap-In Socket available

* Intelligent pin-to-pin compatibility

* Compact CF3 Form Factor

* Low power consumption

* Enhanced RF performance

* GNSS (GPS and GLONASS)

* Snap-In Socket available

* Intelligent pin-to-pin compatibility

* Compact CF3 Form Factor

* Low power consumption

* Enhanced RF performance

* GNSS (GPS and GLONASS)

* Worldwide coverage

* Snap-In Socket available

* Intelligent pin-to-pin compatibility

* Compact CF3 Form Factor

* Low power consumption

* Enhanced RF performance

* GNSS (GPS and GLONASS)

* Worldwide coverage

* Snap-In Socket available

* Intelligent pin-to-pin compatibility

* LTE Category 9 mobile hotspot

* Chipset: Qualcomm MDM 9240

* Support GSM/EDGE/3G/HSDPA/LTE Cat9 network technology

* LTE DL 450Mbps/UL 50Mbps

* Non-removable battery of 2200mAh

* WLAN: 802.11b/g/n/ac, 2×2 MIMO

* Support up to 32 wireless devices

* Form Type: CF3 SMD LGA package

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor and snap-in socket option

* Carrier Approval: Telstra

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency bands: B3, B7, B28

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency band B1/B19/B21

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency band B1/B11/B18

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency band B1/B3/B5/B7

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor on the factor and snap-in socket option

* Intelligent pin to pin compatibility and powered by AirVantage cloudbased service

* Support 4G LTE Cat 4 frequency band B4 and B13

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor and snap-in socket option

* Support 4G LTE Cat.1 frequency bands(B3/B8/B20)

* Usable in Europe region

* Very low power consumption

* Compact, flexible and future proof 2G, 3G and 4G essential module

* Reliable proven IoT and M2M connectivity

* Smallest 2G to 4G form factor and snap-in socket option

* Support 4G LTE Cat.1 frequency bands(B2/B4/B5/B8/B17)

* Region: Americas

* Very low power consumption