Telit HS3002-AU 3G HSDPA Module

* Telit 3G UMTS Module


* Form factor: Board-to-Board(B2B)


* Target market: EMEA/APAC


* HSPA download/upload speeds up to 3.6Mbps


* 3G UMTS/HSPA+ Frequency Bands: 850/2100MHz

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Details
Details

Telit HS3002-AU is a Qualcomm chipset based HSDPA cellular module with a 100-pin Molex I/O and Board-to-Board(B2B) RF connectors. This module will excel in applications requiring low power consumption, extended temperatures, multiple radio choices, and optional audio support. With dual-band HSDPA(UMTS 3G) and GPRS/EDGE radios available in two SKUs and optional SIM, the HS3002-AU module is designed to meet your global integration objectives. The Telit HS3002-AU is certified with Telstra and other regulatory bodies for international use.


Key Benefits:

* Leading-edge silicon solutions from Qualcomm

* 100-pin connector form factor is compatible across technologies

* SIM carrier provides smallest overall system size

* SMS

* Voice and packet data

* TCP/IP and UDP/IP software stack with Packet Assembler Disassembler

* Network router and control/automation

Telit HS3002-AU Module Specifications:

* Form factor: Board-to-Board(B2B)

* Target market: EMEA/APAC

* HSPA download/upload speeds up to 3.6Mbps

* 3G UMTS/HSPA+ Frequency Bands: 850/2100MHz

* 2G GPRS/EDGE dual-band: 900/1800MHz

* Data and Voice: Yes

* Interfaces: 100-Pin Molex I/O, B2B RF, USB 2.0 HS, UART, Remote 1.8, 3V SIM interface

* Integrated Micro SIM-Chip or Remote 1.8/3.0V SIM

* Digital or Analog voice and SMS

* UMTS Uplink/Downlink up to 384Kbps

* EDGE/GPRS Uplink/Downlink up to 233.6kbps

* SMS: Text, PDU, MO/MT, Cell Broadcast

* Operating Temperature : -30 to 70 Degree C

* Storage Temperature : -40 to 85 Degree C

* Approvals: CE, GCF

* Dimensions: 28.0 x 27.0 x 4.5 mm

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