On January 6, the first day of the 2026 International Consumer Electronics Show (CES 2026), leading global IoT solutions provider Quectel announced the official launch of its next-generation flagship smart module, SP895BD-AP.
This module is powered by the Qualcomm Snapdragon™ Q-8750 processor, which offers enhanced graphics processing capabilities, superior imaging effects, and advanced AI computing performance. It is designed to meet the stringent demands of high-end devices such as video conferencing, ultra-high-definition displays, image synthesis, computation boards, smart retail, and smart home applications. It provides essential hardware support for the AIoT industry as it transitions from “basic intelligence” to “high-level smart computing.”
Quectel’s COO, Zhang Dong, stated: “At this critical juncture in the move toward ‘higher intelligence’ in AIoT, there is an explosive growth in the demand for computational power and multimedia processing capabilities in terminal devices. The newly launched flagship smart module SP895BD-AP is a key achievement for Quectel, grounded in industry needs and deepening our efforts in the edge intelligence field. Leveraging the Qualcomm Snapdragon Q-8750 processor, this module achieves significant performance enhancements in CPU, GPU, and AI engines, alongside 8K multimedia processing capabilities. It offers a solution that balances ‘computational power and energy efficiency’ for high-end AIoT scenarios, accelerating the digital transformation of the industry.”
Enhanced with 3nm Technology: A Double Leap in Performance and AI Computing Power
The SP895BD-AP redefines performance boundaries with its advanced hardware architecture. Featuring the Qualcomm Snapdragon Q-8750 processor, it employs a 3nm fabrication process and includes an octa-core high-performance Qualcomm Oryon™ CPU, with clock speeds reaching up to 2×4.32 GHz + 6×3.53 GHz. Compared to the previous generation (the 8 series chips), it achieves a 45% increase in CPU performance and a 44% improvement in energy efficiency. This allows it to maintain stable high-performance output in high-intensity scenarios such as multi-tasking and complex algorithm execution while minimizing power consumption, thereby balancing the demands for “computational power” and “energy consumption.”
The accompanying Qualcomm® Adreno™ 8 series GPU also exhibits outstanding performance, achieving a 40% increase in efficiency and energy optimization. Its unique tile-based architecture delivers stunning graphics effects and realistic environmental rendering capabilities, ensuring reliable performance for complex task handling and ultra-high-definition displays (8K Display/3D), easily meeting the high demands of graphic processing for high-end devices.
In the domain of edge AI computing, the SP895BD-AP brings groundbreaking advancements: the integrated AI engine achieves a computing power of up to 77 TOPS, marking a 45% increase over the previous generation. It supports INT4/INT8/INT16/FP16 full-precision computing modes, enabling real-time inference, and can even run large language models with up to 11 billion parameters on the edge. By integrating with multimodal perception technology, terminal devices equipped with this module can accurately recognize user contexts, facilitating multimodal interaction, and enabling generative AI assistants with real-time decision-making and personalized service capabilities, thereby establishing a “fully-covered, high-efficiency operation” foundation for edge AI development.
Multimedia Capabilities Maximized: 8K Ultra HD and Robust Imaging Input
In the field of multimedia processing, the SP895BD-AP sets a new benchmark. It supports 8K@30fps video encoding and 8K@60fps video decoding, significantly enhancing video bitrate processing and transmission efficiency. This enables “low latency transmission + high-fidelity reproduction” of ultra-high-definition videos, seamlessly aligning with the core requirements of 4K/8K ultra-high-definition displays and professional video conferencing equipment.
Its imaging input capabilities are equally robust: it features three integrated ISPs (image signal processors), capable of synchronously processing three streams of 48MP@30fps video input, and supports individual cameras with up to 108 million pixels for image capture, accurately capturing scene details to easily meet the needs of high-end imaging scenarios.
Flexible Adaptation: Hardware-Software Synergy Accelerating Scenario Implementation
To further adapt to the complex and diverse application ecosystem of AIoT, the SP895BD-AP has been fully optimized for its compatibility from “hardware flexibility” to “software compatibility.” Its hardware design utilizes LGA packaging, resulting in a compact size that can accommodate more product forms. Additionally, it is equipped with various peripheral interfaces, including MIPI DSI, CSI, PCIe, USB, I2S, UART, I2C, and SPI, to meet diverse display, audio, sensor, and communication expansion requirements, significantly enhancing scenario adaptability and deployment flexibility in AIoT applications.
On the software side, the module is designed to be compatible with a broader industry ecosystem, deeply supporting Android 15 and Linux operating systems, which greatly reduces the technological barriers for cross-field applications.
In the future, Quectel will continue to focus on the integration of edge intelligence and IoT technologies, investing and innovating to drive the deep development of industrial digital transformation with more cutting-edge products and more comprehensive solutions, injecting strong momentum into the construction of an intelligent world characterized by “everything being smart and full-domain perception.”