On June 25, during the MWC Shanghai 2026 exhibition, Quectel officially unveiled its first flagship AI computing module series based on the MediaTek platform: the SP805FL series (available in WF and AP variants). This launch establishes a crucial pathway for integrating advanced AI computing power into end-device applications across various industries.
Equipped with MediaTek’s flagship Genio Pro 5100 chip, this product seamlessly combines robust computing power, outstanding graphics and imaging capabilities, and a rich array of interfaces. It fully supports the deployment of physical AI, on-device large language models (LLMs), and multimodal interactions. The module is widely applicable to high-end scenarios such as robotics, smart helmets, 3D scanning/printing, computing boards, smart retail, large-screen displays, and smart homes, empowering customers to seize the initiative in the wave of edge computing and AI-native applications.
Flagship CPU Architecture: Effortlessly Handling Complex Tasks at the Edge
The Quectel SP805FL features a full octa-core Arm v9.2 architecture, comprising 1x Cortex-X925, 3x Cortex-X4, and 4x Cortex-A720 cores. Built on a 3nm manufacturing process, it effortlessly manages multitasking and complex computations.
In practical applications, even when a robot simultaneously performs navigation computing, visual recognition, and voice dialogue, it maintains smooth responsiveness, eliminating lag and latency. For devices like industrial tablets and 3D scanners that require real-time processing of massive amounts of data, its massive performance headroom makes “millisecond-level reconstruction” a reality.
50+ TOPS NPU: Enabling Fully Independent On-Device AI Operation
The successful deployment of on-device AI relies heavily on dedicated AI computing power. The Quectel SP805FL integrates MediaTek’s 8th-generation NPU, delivering over 50 TOPS of AI computing power. It supports full-precision computing (INT4/INT8/INT16/FP16), enabling the efficient deployment of various AI large models. With multimodal interaction and scene perception capabilities, it provides robust support for the large-scale deployment of on-device AI.
Leveraging its powerful AI performance, devices can independently handle complex AI inference tasks. Whether it is a smart helmet used for underground or field operations, service robots, or smart retail terminals, they can operate stably in offline or congested network environments, respond to commands in milliseconds, and simultaneously safeguard data privacy.
All-Scenario Multimedia and Connectivity: Meeting Rigorous Industrial Demands
In terms of multimedia capabilities, the SP805FL supports simultaneous multi-screen display and 8K encoding/decoding, catering to scenarios with stringent requirements for image quality and multi-screen display, such as 3D scanning/printing, commercial large screens, and smart retail.
Regarding wireless connectivity, the Quectel SP805FL-WF variant is equipped with Wi-Fi 7 and Bluetooth 6.0, enabling high-speed, stable wireless data transmission. It also integrates multi-constellation GNSS positioning, compatible with GPS/BDS/GLONASS/Galileo/QZSS/NAVIC, and supports L1+L5 dual-frequency positioning, providing precise positioning services for intelligent transportation and logistics platforms.
Designed for industrial-grade scenarios, the product supports a wide operating temperature range of -35°C to +75°C, making it capable of handling various complex industrial environments. Global certifications, including CE, RCM, FCC, and IC, are currently in progress to meet global compliance deployment requirements in the future.
Massive Interfaces for Flexible Expansion: Simplifying Development, Reducing Costs, and Boosting Efficiency
The SP805FL offers an interface lineup that far exceeds conventional smart modules, boasting exceptional scalability. In addition to traditional interfaces such as MIPI DSI/CSI, I2S, UART, SDIO, I2C, and SPI, it supports multiple PCIe lanes and dual Gigabit Ethernet ports, significantly enhancing its flexibility and adaptability in on-device AI applications.
Adopting a compact LGA package design, the module allows high computing power to be seamlessly integrated into smaller end products. Developers do not need to add external interface or computing chips; a single module can satisfy most device connectivity requirements, effectively simplifying hardware design and shortening R&D cycles.
The launch of the Quectel SP805FL marks a critical leap for smart modules, transforming them from mere “data transmission pipelines” into “independent on-device decision-making units.”