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* Huawei Mate 20 Pro phone features and Specifications

* 6.39 inches, 1440 x 3120 pixels, dual SIM(Nano SIM)

* Three versions: 128GB ROM/6GB RAM，128GB ROM/8GB RAM or 256GB ROM/8GB RAM

* Chipset: HiSilicon Kirin 980 (7 nm)

* CPU: Octa-core (2x2.6 GHz Cortex-A76 & 2x1.92 GHz Cortex-A76 & 4x1.8 GHz Cortex-A55)

* Non-removable Li-Po 4200 mAh battery

* Triple (40MP + 20MP + 8MP) main camera/Single (24MP) front camera

* IP68 dust/water resistant (up to 2m for 30 mins)

* Huawei Mate 20 phone features and Specifications

* 6.53 inches, 1080 x 2244 pixels, dual SIM(Nano SIM)

* Two versions: 128GB ROM/6GB RAM or 64GB ROM/6GB RAM

* Chipset: HiSilicon Kirin 980 (7 nm)

* CPU: Octa-core (2x2.6 GHz Cortex-A76 & 2x1.92 GHz Cortex-A76 & 4x1.8 GHz Cortex-A55)

* Non-removable Li-Po 4000 mAh battery

* Triple (12MP + 16MP + 8MP) main camera/Single (24MP) front camera

* IP53 dust and splash protection

* Huawei Mate 20 X phone features and Specifications

* 7.2 inches, 1080 x 2244 pixels, dual SIM(Nano SIM)

* Two versions: 128GB ROM/6GB RAM or 256GB ROM/8GB RAM

* Chipset: HiSilicon Kirin 980 (7 nm)

* CPU: Octa-core (2x2.6 GHz Cortex-A76 & 2x1.92 GHz Cortex-A76 & 4x1.8 GHz Cortex-A55)

* Non-removable Li-Po 5000 mAh battery

* Triple (40MP + 20MP + 8MP) main camera/Single (24MP) front camera

* IP53 dust and splash protection

* Huawei Honor Magic 2 4G Smartphone features and Specifications

* 6.39 inches, 1080 x 2340 pixels, dual SIM(Nano SIM)

* Three versions: 128GB ROM/6GB RAM, 128GB ROM/8GB RAM or 256GB ROM/8GB RAM

* Chipset: HiSilicon Kirin 980 (7 nm)

* CPU: Octa-core (2x2.6 GHz Cortex-A76 & 2x1.92 GHz Cortex-A76 & 4x1.8 GHz Cortex-A55)

* Non-removable Li-Po 3500 mAh battery

* Triple (16MP + 16MP + 24MP) main camera/Dual (16MP + 2MP) front camera

* Xiaomi Mi Max 3 Specs and Features

* 6.9 inches, Android 8.1 (Oreo), 1080 x 2160 pixels resolution

* IPS LCD capacitive touchscreen

* Qualcomm SDM636 Snapdragon 636, Octa-core CPU

* Dual SIM, Non-removable Li-Ion 5500 mAh battery

* Dual(12MP & 5MP)main camera/single（8MP）front camera

* Xiaomi Mi Mix 3 Specs and Features

* 6.39 inch, Android 9.0 (Pie), 1080 x 2340 pixels resolution

* Super AMOLED capacitive touchscreen

* Qualcomm SDM845 Snapdragon 845 (10 nm), Octa-core CPU

* Dual SIM, Non-removable Li-Ion 3200 mAh battery

* Dual(12MP & 12MP)main camera/Dual（24 MP/2MP）front camera

* Xiaomi Mi 8 Pro Specs and Features

* 6.21 inch, Android 8.1 (Oreo), 1080 x 2248 resolution

* Super AMOLED capacitive touchscreen

* Qualcomm SDM845 Snapdragon 845 (10 nm), Octa-core CPU

* Dual SIM, Non-removable Li-Po 3000 mAh battery

* Dual(12MP & 12MP)main camera/20 MP front camera

* Xiaomi Mi 8 SE Specs and Features

* 5.88 inches, Android 8.1 (Oreo), 1080 x 2248 resolution

* Super AMOLED capacitive touchscreen

* Qualcomm SDM710 Snapdragon 710 (10 nm), Octa-core CPU

* Dual SIM, Non-removable Li-Po 3120 mAh battery

* Dual(12MP & 5MP)main camera/20 MP front camera

* Xiaomi Mi 8 Lite Specs and Features

* 6.26 inches, Android 8.1 (Oreo), 1080 x 2280 resolution

* IPS LCD capacitive touchscreen

* Qualcomm SDM660 Snapdragon 660(14 nm), Octa-core CPU

* Dual SIM, Non-removable Li-Po 3350 mAh battery

* Dual(12MP & 5MP)main camera/24MP front camera

* Xiaomi Mi 8 Specs and Features

* 6.21 inch, Android 8.1 (Oreo), 1080 x 2248 resolution

* Super AMOLED capacitive touchscreen

* Qualcomm SDM845 Snapdragon 845 (10 nm), Octa-core CPU

* Dual SIM, Non-removable Li-Po 3400 mAh battery

* Dual(12MP & 12MP)main camera/20 MP front camera

* Quectel 2G GSM/GPRS/GNSS Module

* Quad-band: 850/900/1800/1900MHz

* Max. 85.6 kbps (uplink & downlink)

* Multi-GNSS system: GPS, GLONASS, Galileo and QZSS

* Support 2.4G Wi-Fi (IEEE 802.11b/g/n) (scan only)

* Support hybrid positioning (GNSS, Cell ID and Wi-Fi aided positioning)

* Support 1PPS function

* Quectel 2G GSM/GPRS Module

* GSM quad-band: 850/900/1800/1900MHz

* Easier soldering process with LCC package

* Max. 85.6 kbps (uplink & downlink)

* Multi navigation constellation: GPS/ GLONASS/ QZSS

* 99 acquisition/33 tracking/210 PRN channels

* Support Voice, Data, SMS and QuecFOTA functions

* Quectel 2G GSM/GPRS Module

* GSM quad-band: 850/ 900/1800/1900MHz

* Max. 85.6 kbps (uplink & downlink)

* Multi navigation constellation: GPS/ GLONASS/ QZSS

* GNSS receiver channels: 99 acquisition/ 33 tracking channels

* Support Voice, SMS, QuecFOTA, DSSS, OpenCPU

* Support Bluetooth V3.0: SPP & HFP-AG profiles

* Quectel 2G GSM/GPRS Module

* Max. 85.6 kbps (uplink & downlink)

* Ultra compact form factor with Dual SIM Dual Standby (DSDS) feature

* Easier soldering process with LCC package

* Support Voice, Bluetooth, QuecFOTA

* Quectel UMTS/HSDPA Module

* HSDPA speed up to 7.2Mbps

* Worldwide UMTS/HSDPA and GSM/GPRS/EDGE coverage

* Seamless drop-in migration to GSM/GPRS module

* Minimal SMT form factor ideal for small end products with tight space

* Super slim profile in LGA package

* High-quality data and image transmission

* Robust mounting and interfaces

* Quectel UMTS/HSDPA Module

* HSDPA DL speed up to 14.4Mbps

* Worldwide UMTS/HSDPA and GSM/GPRS/EDGE coverage

* GNSS receiver available for applications

* High-quality data and image transmission

* Robust mounting and interfaces

* Quectel UMTS/HSDPA Module

* HSDPA up to 3.6Mbps

* Worldwide UMTS/HSDPA and GSM/GPRS/EDGE coverage

* USB 2.0 with High Speed up to 480Mbps

* Echo Cancellation, Noise Reduction

* Quectel UMTS/HSDPA Module

* HSDPA speed up to 14.4Mbps

* Worldwide UMTS/HSDPA and GSM/GPRS/EDGE coverage

* GNSS receiver available for applications

* High-quality data and image transmission

* Robust mounting and interfaces

* Quectel UMTS/HSDPA Module

* Three variant models: UC15-E, UC15-A, UC15-T

* HSDPA up to 3.6Mbps

* USB 2.0 with High Speed up to 480Mbps

* Echo Cancellation, Noise Reduction