Telit HS3002-EU 3G HSDPA Module
* Form factor: Board-to-Board(B2B)
* Target market: EMEA/APAC
* HSPA download/upload speeds up to 3.6Mbps
* 3G UMTS/HSPA+ Frequency Bands: 900/2100MHz
Availability: In stock
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Telit HS3002-EU is a Qualcomm chipset based HSDPA cellular module with a 100-pin Molex I/O and Board-to-Board(B2B) RF connectors. This module will excel in applications requiring low power consumption, extended temperatures, multiple radio choices, and optional audio support. With dual-band HSDPA(UMTS 3G) and GPRS/EDGE radios available in two SKUs and optional SIM, the HS3002-EU module is designed to meet your global integration objectives. The Telit HS3002-EU is certified with CE, GCF and other regulatory bodies for international use.
Key Benefits:
* Leading-edge silicon solutions from Qualcomm
* 100-pin connector form factor is compatible across technologies
* SIM carrier provides smallest overall system size
* SMS
* Voice and packet data
* TCP/IP and UDP/IP software stack with Packet Assembler Disassembler
* Network router and control/automation
Telit HS3002-EU Module Specifications:
* Form factor: Board-to-Board(B2B)
* Target market: EMEA/APAC
* HSPA download/upload speeds up to 3.6Mbps
* 3G UMTS/HSPA+ Frequency Bands: 900/2100MHz
* 2G GPRS/EDGE dual-band: 900/1800MHz
* Data and Voice: Yes
* Interfaces: 100-Pin Molex I/O, B2B RF, USB 2.0 HS, UART, Remote 1.8, 3V SIM interface
* Integrated Micro SIM-Chip or Remote 1.8/3.0V SIM
* Digital or Analog voice and SMS
* UMTS Uplink/Downlink up to 384Kbps
* EDGE/GPRS Uplink/Downlink up to 233.6kbps
* SMS: Text, PDU, MO/MT, Cell Broadcast
* Operating Temperature : -30 to 70 Degree C
* Storage Temperature : -40 to 85 Degree C
* Approvals: CE, GCF
* Dimensions: 28.0 x 27.0 x 4.5 mm